Today in many applications such as network switches, routers, multi-computers,and processor-memory interfaces, the ability to integrate hundreds of multi-gigabit I/Os is desired to make better use of the rapidly advancing IC technology.
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Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
Today’s digital systems combine a myriad of chips with different voltage configurations.Designers must interface 2.5V processors with 3.3V memories—both RAM and ROM—as wellas 5V buses and multiple peripheral chips. Each chip has specific power supply needs. CPLDsare ideal for handling the multi-voltage interfacing, but do require forethought to ensure correctoperation.
The data plane of the reference design consists of a configurable multi-channel XBERT modulethat generates and checks high-speed serial data transmitted and received by the MGTs. Eachchannel in the XBERT module consists of two MGTs (MGTA and MGTB), which physicallyoccupy one MGT tile in the Virtex-4 FPGA. Each MGT has its own pattern checker, but bothMGTs in a channel share the same pattern generator. Each channel can load a differentpattern. The MGT serial rate depends on the reference clock frequency and the internal PMAdivider settings. The reference design can be scaled anywhere from one channel (two MGTs)to twelve channels (twenty-four MGTs).
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The practice of enterprise application development has benefited from the emergence of many new enabling technologies. Multi-tiered object-oriented platforms, such as Java and .NET, have become commonplace.
