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on-Board

基于（英蓓特）STM32V100的看門狗程序

This example shows how to update at regulate period the WWDG counter using theEarly Wakeup interrupt (EWI). The WWDG timeout is set to 262ms, refresh window set to 41h and the EWI isenabled. When the WWDG counter reaches 40h the EWI is generated and in the WWDGISR the counter is refreshed to prevent a WWDG reset and led connected to PC.07is toggled.The EXTI line9 is connected to PB.09 pin and configured to generate an interrupton falling edge.In the NVIC, EXTI line9 to 5 interrupt vector is enabled with priority equal to 0and the WWDG interrupt vector is enabled with priority equal to 1 (EXTI IT > WWDG IT). The EXTI Line9 will be used to simulate a software failure: once the EXTI line9event occurs (by pressing Key push-button on EVAL board) the correspondent interruptis served, in the ISR the led connected to PC.07 is turned off and the EXTI line9pending bit is not cleared. So the CPU will execute indefinitely EXTI line9 ISR andthe WWDG ISR will never be entered(WWDG counter not updated). As result, when theWWDG counter falls to 3Fh the WWDG reset occurs.If the EXTI line9 event don抰 occurs the WWDG counter is indefinitely refreshed inthe WWDG ISR which prevent from WWDG reset. If the WWDG reset is generated, after resuming from reset a led connected to PC.06is turned on. In this example the system is clocked by the HSE(8MHz).

標簽： V100 STM 100 32V

上傳時間： 2013-11-11

上傳用戶：gundamwzc
【PPT】Board(印刷電路板)的縮寫

Board(印刷電路板)的縮寫。

標簽： Board 印刷電路板

上傳時間： 2015-01-01

上傳用戶：ppeyou
Spartan-3E Starter Kit Board User Guide

Spartan-3E Starter Kit Board User Guide英語版的介紹，很適合初學者學習學習

標簽： Spartan Starter Board Guide

上傳時間： 2013-11-19

上傳用戶：ruan2570406
《器件封裝用戶向?qū)А焚愳`思產(chǎn)品封裝資料

Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

標簽： 封裝器件用戶賽靈思

上傳時間： 2013-11-21

上傳用戶：不懂夜的黑
XAPP740利用AXI互聯(lián)設計高性能視頻系統(tǒng)

This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX and area optimizations in certain portions of the design. The design uses five AXI video direct memory access (VDMA) engines to simultaneously move 10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary video timing signals. Data read by each AXI VDMA is sent to a common on-screen display (OSD) core capable of multiplexing or overlaying multiple video streams to a single output video stream. The output of the OSD core drives the DVI video display interface on the board. Performance monitor blocks are added to capture performance data. All 10 video streams moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are controlled by a MicroBlaze™ processor. The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the Xilinx® ML605 Rev D evaluation board

標簽： XAPP 740 AXI 互聯(lián)

上傳時間： 2013-11-23

上傳用戶：shen_dafa
擴頻通信芯片STEL-2000A的FPGA實現(xiàn)

針對傳統(tǒng)集成電路（ASIC）功能固定、升級困難等缺點，利用FPGA實現(xiàn)了擴頻通信芯片STEL-2000A的核心功能。使用ISE提供的DDS IP核實現(xiàn)NCO模塊，在下變頻模塊調(diào)用了硬核乘法器并引入CIC濾波器進行低通濾波，給出了DQPSK解調(diào)的原理和實現(xiàn)方法，推導出一種簡便的引入?仔/4固定相移的實現(xiàn)方法。采用模塊化的設計方法使用VHDL語言編寫出源程序，在Virtex-II Pro 開發(fā)板上成功實現(xiàn)了整個系統(tǒng)。測試結果表明該系統(tǒng)正確實現(xiàn)了STEL-2000A的核心功能。 Abstract: To overcome drawbacks of ASIC such as fixed functionality and upgrade difficulty, FPGA was used to realize the core functions of STEL-2000A. This paper used the DDS IP core provided by ISE to realize the NCO module, called hard core multiplier and implemented CIC filter in the down converter, described the principle and implementation detail of the demodulation of DQPSK, and derived a simple method to introduce a fixed phase shift of ?仔/4. The VHDL source code was designed by modularity method , and the complete system was successfully implemented on Virtex-II Pro development board. Test results indicate that this system successfully realize the core function of the STEL-2000A.

標簽： STEL 2000 FPGA 擴頻通信

上傳時間： 2013-11-19

上傳用戶：neu_liyan
PCB設計問題集錦

PCB設計問題集錦問：PCB圖中各種字符往往容易疊加在一起，或者相距很近，當板子布得很密時，情況更加嚴重。當我用Verify Design進行檢查時，會產(chǎn)生錯誤，但這種錯誤可以忽略。往往這種錯誤很多，有幾百個，將其他更重要的錯誤淹沒了，如何使Verify Design會略掉這種錯誤，或者在眾多的錯誤中快速找到重要的錯誤?！?　　答：可以在顏色顯示中將文字去掉,不顯示后再檢查;并記錄錯誤數(shù)目。但一定要檢查是否真正屬于不需要的文字。問： What’s mean of below warning:(6230,8330 L1) Latium Rule not checked: COMPONENT U26 component rule.答：這是有關制造方面的一個檢查，您沒有相關設定，所以可以不檢查。問：怎樣導出jop文件？答：應該是JOB文件吧？低版本的powerPCB與PADS使用JOB文件。現(xiàn)在只能輸出ASC文件，方法如下STEP：FILE/EXPORT/選擇一個asc名稱/選擇Select ALL/在Format下選擇合適的版本/在Unit下選Current比較好/點擊OK/完成然后在低版本的powerPCB與PADS產(chǎn)品中Import保存的ASC文件，再保存為JOB文件。問：怎樣導入reu文件？答：在ECO與Design 工具盒中都可以進行，分別打開ECO與Design 工具盒，點擊右邊第2個圖標就可以。問：為什么我在pad stacks中再設一個via:1(如附件）和默認的standardvi(如附件）在布線時V選擇1，怎么布線時按add via不能添加進去這是怎么回事，因為有時要使用兩種不同的過孔。答：PowerPCB中有多個VIA時需要在Design Rule下根據(jù)信號分別設置VIA的使用條件，如電源類只能用Standard VIA等等，這樣操作時就比較方便。詳細設置方法在PowerPCB軟件通中有介紹。問：為什么我把On-line DRC設置為prevent..移動元時就會彈出(圖2),而你們教程中也是這樣設置怎么不會呢?答：首先這不是錯誤,出現(xiàn)的原因是在數(shù)據(jù)中沒有BOARD OUTLINE.您可以設置一個,但是不使用它作為CAM輸出數(shù)據(jù). 問：我用ctrl+c復制線時怎設置原點進行復制，ctrl+v粘帖時總是以最下面一點和最左邊那一點為原點答：復制布線時與上面的MOVE MODE設置沒有任何關系,需要在右鍵菜單中選擇,這在PowerPCB軟件通教程中有專門介紹. 問：用(圖4)進行修改線時拉起時怎總是往左邊拉起(圖5)，不知有什么辦法可以輕易想拉起左就左，右就右。答：具體條件不明,請檢查一下您的DESIGN GRID,是否太大了. 問：好不容易拉起右邊但是用(圖6)修改線怎么改怎么下面都會有一條不能和在一起，而你教程里都會好好的(圖8)答：這可能還是與您的GRID 設置有關,不過沒有問題,您可以將不需要的那段線刪除.最重要的是需要找到布線的感覺,每個軟件都不相同,所以需要多練習。問：尊敬的老師:您好！這個圖已經(jīng)畫好了，但我只對（如圖1）一種的完全間距進行檢查，怎么錯誤就那么多，不知怎么改進。請老師指點。這個圖在附件中請老師幫看一下，如果還有什么問題請指出來，本人在改進。謝?。。。?！答：請注意您的DRC SETUP窗口下的設置是錯誤的,現(xiàn)在選中的SAME NET是對相同NET進行檢查,應該選擇NET TO ALL.而不是SAME NET有關各項參數(shù)的含義請仔細閱讀第5部教程. 問： U101元件已建好，但元件框的拐角處不知是否正確，請幫忙CHECK 答：元件框等可以通過修改編輯來完成。問： U102和U103元件沒建完全，在自動建元件參數(shù)中有幾個不明白：如：SOIC--》silk screen欄下spacing from pin與outdent from first pin對應U102和U103元件應寫什么數(shù)值，還有這兩個元件SILK怎么自動設置，以及SILK內(nèi)有個圓圈怎么才能畫得與該元件參數(shù)一致。答：Spacing from pin指從PIN到SILK的Y方向的距離,outdent from first pin是第一PIN與SILK端點間的距離.請根據(jù)元件資料自己計算。

標簽： PCB 設計問題集錦

上傳時間： 2014-01-03

上傳用戶：Divine
PQP is a library for performing three types of proximity queries on a pair of geometric models compo

PQP is a library for performing three types of proximity queries on a pair of geometric models composed of triangles:

標簽： performing geometric proximity library

上傳時間： 2014-01-13

上傳用戶：love_stanford
uClinux on ARM7TDMI(ppt)

uClinux on ARM7TDMI(ppt)

標簽： ARM7TDMI uClinux on

上傳時間： 2013-12-11

上傳用戶：shizhanincc
TheTool is highy customizable map editor(based on QT) which can be extended via LUA scripts. A first

TheTool is highy customizable map editor(based on QT) which can be extended via LUA scripts. A first implentation is ready and can be published to the public. The editor is the perfect tool who wants to design some 3d games but don t have time to write

標簽： customizable extended TheTool scripts

上傳時間： 2013-12-12

上傳用戶：lanwei