In 揚(yáng)erformance of multi-carrier DS CDMA Systems?we apply a multi-carrier signaling technique to a direct-sequence CDMA system, where a data sequence multiplied by a spreading sequence modulates multiple carriers, rather than a single carrier. The receiver provides a correlator for each carrier, and the outputs of the correlators are combined with a maximal-ratio combiner. This type of signaling has the desirable properties of exhibiting a narrowband interference suppression effect, along with robustness to fading, without requiring the use of either an explicit RAKE structure or an interference suppression filter.
The MAX3243E device consists of three line drivers, five line receivers, and a dual charge-pump circuit with±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge)protection on serial-port connection pins. The device meets the requirements of TIA/EIA-232-F and provides theelectrical interface between an asynchronous communication controller and the serial-port connector. Thiscombination of drivers and receivers matches that needed for the typical serial port used in an IBM PC/AT, orcompatible. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-Vsupply. In addition, the device includes an always-active noninverting output (ROUT2B), which allowsapplications using the ring indicator to transmit data while the device is powered down. The device operates atdata signaling rates up to 250 kbit/s and a maximum of 30-V/ms driver output slew rate.
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced development cost. Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements. For all these reasons the COM methodology has gained much popularity with OEMs in the embedded industry. COM Express® is an open industry standard for Computer-On-Modules. It is designed to be future proof and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage Differential signaling) interfaces. These include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other hand.
The Cyclone® III PCI development board provides a hardware platform for developing and
prototyping low-power, high-performance, logic-intensive PCI-based designs. The board provides a
high-density of the memory to facilitate the design and development of FPGA designs which need
huge memory storage, and also includes Low-Voltage Differential signaling (LVDS) interface of
the High-Speed Terasic Connectors (HSTCs) for extra high-speed interface application.
High volume USB 2.0 devices will be designed using ASIC technology with embedded USB 2.0 support.
For full-speed USB devices the operating frequency was low enough to allow data recovery to be handled
in a vendors VHDL code, with the ASIC vendor providing only a simple level translator to meet the USB
signaling requirements. Today s gate arrays operate comfortably between 30 and 60 MHz. With USB 2.0
signaling running at hundreds of MHz, the existing design methodology must change.
High volume USB 2.0 devices will be designed using ASIC technology with embedded USB 2.0 support.
For full-speed USB devices the operating frequency was low enough to allow data recovery to be handled
in a vendors VHDL code, with the ASIC vendor providing only a simple level translator to meet the USB
signaling requirements. Today s gate arrays operate comfortably between 30 and 60 MHz. With USB 2.0
signaling running at hundreds of MHz, the existing design methodology must change.
