The 14-bit LTC2351-14 is a 1.5Msps, low power SARADC with six simultaneously sampled differential inputchannels. It operates from a single 3V supply and featuressix independent sample-and-hold amplifi ers and a singleADC. The single ADC with multiple S/HAs enables excellentrange match (1mV) between channels and channel-tochannelskew (200ps).
上傳時(shí)間： 2014-12-23
上傳用戶：天誠(chéng)24
A fully differential amplifi er is often used to converta single-ended signal to a differential signal, a designwhich requires three signifi cant considerations: theimpedance of the single-ended source must match thesingle-ended impedance of the differential amplifi er,the amplifi er’s inputs must remain within the commonmode voltage limits and the input signal must be levelshifted to a signal that is centered at the desired outputcommon mode voltage.
上傳時(shí)間： 2013-11-09
上傳用戶：wweqas
Recent advances in low voltage silicon germaniumand BiCMOS processes have allowed the design andproduction of very high speed amplifi ers. Because theprocesses are low voltage, most of the amplifi er designshave incorporated differential inputs and outputs to regainand maximize total output signal swing. Since many lowvoltageapplications are single-ended, the questions arise,“How can I use a differential I/O amplifi er in a single-endedapplication?” and “What are the implications of suchuse?” This Design Note addresses some of the practicalimplications and demonstrates specifi c single-endedapplications using the 3GHz gain-bandwidth LTC6406differential I/O amplifi er.
標(biāo)簽： 單端應(yīng)用 差分 放大器
上傳時(shí)間： 2013-11-23
上傳用戶：rocketrevenge
Application considerations and circuits for the LT1001 and LT1002 single and dual precision amplifiers are illustrated in a number of circuits, including strain gauge signal conditioners, linearized platinum RTD circuits, an ultra precision dead zone circuit for motor servos and other examples.
標(biāo)簽： 精密 運(yùn)算放大器
上傳時(shí)間： 2013-10-18
上傳用戶：dreamboy36
•Founded in Jan. 08, 2001 in Shanghai, China.•Fabless IDH focused on Analog & Mixed Signal Chip design & marketing •Over 100 IC introduced.•Over 200 OEM Customer worldwide•ISO-9000 Certified•Distribution Channel in Taiwan, China & Japan To achieve 100% customer satisfactionby producing the technically advanced product with the best quality, on-time delivery and service. Leverages on proprietary process and world-class engineering team to develop innovative & high quality analog solutions that add value to electronics equipment.
標(biāo)簽： Circuit Analog Design Porta
上傳時(shí)間： 2013-10-24
上傳用戶：songnanhua
This reference design (RD) features a fullyassembled and tested surface-mount printed circuitboard (PCB). The RD board utilizes the MAX48851:2 or 2:1 multiplexer and other ICs to implement acomplete video graphics array (VGA) 8:1multiplexer.VGA input/output connections are provided to easilyinterface the MAX4885 RD board with VGAcompatibledevices. The RD board gives the optionto use a single 5V DC power supply (V+), or this RDboard can be powered from any one of the eight VGA sources.
標(biāo)簽： multiplexer reference VGA
上傳時(shí)間： 2013-11-09
上傳用戶：ANRAN
OPTOELECTRONICS CIRCUIT COLLECTION AVALANCHE PHOTODIODE BIAS SUPPLY 1Provides an output voltage of 0V to +80V for reverse biasingan avalanche photodiode to control its gain. This circuit canalso be reconfigured to supply a 0V to –80V output.LINEAR TEC DRIVER–1This is a bridge-tied load (BTL) linear amplifier for drivinga thermoelectric cooler (TEC). It operates on a single +5Vsupply and can drive ±2A into a common TEC.LINEAR TEC DRIVER–2This is very similar to DRIVER–1 but its power output stagewas modified to operate from a single +3.3V supply in orderto increase its efficiency. Driving this amplifier from astandard +2.5V referenced signal causes the output transistorsto have unequal power dissipation.LINEAR TEC DRIVER–3This BTL TEC driver power output stage achieves very highefficiency by swinging very close to its supply rails, ±2.5V.This driver can also drive ±2A into a common TEC. Operationis shown with the power output stage operating on±1.5V supplies. Under these conditions, this linear amplifiercan achieve very high efficiency. Application ReportThe following collection of analog circuits may be useful in electro-optics applications such as optical networkingsystems. This page summarizes their salient characteristics.
標(biāo)簽： 光電轉(zhuǎn)換 電路設(shè)計(jì)
上傳時(shí)間： 2013-10-27
上傳用戶：落花無(wú)痕
Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.
標(biāo)簽： Rogers Radio John Freq
上傳時(shí)間： 2014-12-23
上傳用戶：han_zh
模擬集成電路的設(shè)計(jì)與其說(shuō)是一門技術(shù)，還不如說(shuō)是一門藝術(shù)。它比數(shù)字集成電路設(shè)計(jì)需要更嚴(yán)格的分析和更豐富的直覺(jué)。嚴(yán)謹(jǐn)堅(jiān)實(shí)的理論無(wú)疑是嚴(yán)格分析能力的基石，而設(shè)計(jì)者的實(shí)踐經(jīng)驗(yàn)無(wú)疑是誕生豐富直覺(jué)的源泉。這也正足初學(xué)者對(duì)學(xué)習(xí)模擬集成電路設(shè)計(jì)感到困惑并難以駕馭的根本原因。.美國(guó)加州大學(xué)洛杉機(jī)分校(UCLA)Razavi教授憑借著他在美國(guó)多所著名大學(xué)執(zhí)教多年的豐富教學(xué)經(jīng)驗(yàn)和在世界知名頂級(jí)公司(AT&T，Bell Lab，HP)卓著的研究經(jīng)歷為我們提供了這本優(yōu)秀的教材。本書自2000午出版以來(lái)得到了國(guó)內(nèi)外讀者的好評(píng)和青睞，被許多國(guó)際知名大學(xué)選為教科書。同時(shí)，由于原著者在世界知名頂級(jí)公司的豐富研究經(jīng)歷，使本書也非常適合作為CMOS模擬集成電路設(shè)計(jì)或相關(guān)領(lǐng)域的研究人員和工程技術(shù)人員的參考書。... 本書介紹模擬CMOS集成電路的分析與設(shè)計(jì)。從直觀和嚴(yán)密的角度闡述了各種模擬電路的基本原理和概念，同時(shí)還闡述了在SOC中模擬電路設(shè)計(jì)遇到的新問(wèn)題及電路技術(shù)的新發(fā)展。本書由淺入深，理論與實(shí)際結(jié)合，提供了大量現(xiàn)代工業(yè)中的設(shè)計(jì)實(shí)例。全書共18章。前10章介紹各種基本模塊和運(yùn)放及其頻率響應(yīng)和噪聲。第11章至第13章介紹帶隙基準(zhǔn)、開(kāi)關(guān)電容電路以及電路的非線性和失配的影響，第14、15章介紹振蕩器和鎖相環(huán)。第16章至18章介紹MOS器件的高階效應(yīng)及其模型、CMOS制造工藝和混合信號(hào)電路的版圖與封裝。 1 Introduction to Analog Design 2 Basic MOS Device Physics 3 Single-Stage Amplifiers 4 Differential Amplifiers 5 Passive and Active Current Mirrors 6 Frequency Response of Amplifiers 7 Noise 8 Feedback 9 Operational Amplifiers 10 Stability and Frequency Compensation 11 Bandgap References 12 Introduction to Switched-Capacitor Circuits 13 Nonlinearity and Mismatch 14 Oscillators 15 Phase-Locked Loops 16 Short-Channel Effects and Device Models 17 CMOS Processing Technology 18 Layout and Packaging
標(biāo)簽： analog design cmos of
上傳時(shí)間： 2014-12-23
上傳用戶：杜瑩12345
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
標(biāo)簽： pci PCB 設(shè)計(jì)規(guī)范
上傳時(shí)間： 2013-10-15
上傳用戶：busterman
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