With the rapid growth in the number of wireless applications, services and devices,
using a single wireless technology such as a second generation (2G) and third gener-
ation (3G) wireless system would not be efficient to deliver high speed data rate and
quality-of-service (QoS) support to mobile users in a seamless way. The next genera-
tion wireless systems (also sometimes referred to as Fourth generation (4G) systems)
are being devised with the vision of heterogeneity in which a mobile user/device will
be able to connect to multiple wireless networks (e.g., WLAN, cellular, WMAN)
simultaneously.
The telecommunications industry has seen a rapid boost within the last decade. New realities
and visions of functionalities in various telecommunications networks have brought forward the
concept of next-generation networks (NGNs). The competitions among operators for support-
ing various services, lowering of the cost of having mobile and cellular phones and smartphones,
increasing demand for general mobility, explosion of digital traffic, and advent of convergence
network technologies added more dynamism in the idea of NGNs. In fact, facilitating con-
vergence of networks and convergence of various types of services is a significant objective of
NGNs.
This book addresses the issues on the development of next generation CDMA technologies and
contains a lot of information on the subject from both the open literature and my own research
activities in the last fifteen years.
Abstract: This application note describes a new generation of digital-input Class D audio amplifiers that achieve high PSRRperformance, comparable to traditional analog Class D amplifiers. More importantly, these digital-input Class D amplifiersprovide additional benefits of reduced power, complexity, noise, and system cost.
Silicon Motion, Inc. has made best efforts to ensure that the information contained in this document is accurate andreliable. However, the information is subject to change without notice. No responsibility is assumed by SiliconMotion, Inc. for the use of this information, nor for infringements of patents or other rights of third parties.Copyright NoticeCopyright 2002, Silicon Motion, Inc. All rights reserved. No part of this publication may be reproduced, photocopied,or transmitted in any form, without the prior written consent of Silicon Motion, Inc. Silicon Motion, Inc. reserves theright to make changes to the product specification without reservation and without notice to our users
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
