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third-Generation

  • Xilinx UltraScale:新一代架構(gòu)滿足您的新一代架構(gòu)需求(EN)

      中文版詳情瀏覽:http://www.elecfans.com/emb/fpga/20130715324029.html   Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture    The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.   The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.   Some of the UltraScale architecture breakthroughs include:   • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%    • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability   • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization   • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard    • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets   • Greatly enhanced DSP and packet handling   The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.

    標簽: UltraScale Xilinx 架構(gòu)

    上傳時間: 2013-11-21

    上傳用戶:wxqman

  • 采用TüV認證的FPGA開發(fā)功能安全系統(tǒng)

    This white paper discusses how market trends, the need for increased productivity, and new legislation have accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is changing the paradigms of safety designs and will greatly reduce development effort, system complexity, and time to market. This allows FPGA users to design their own customized safety controllers and provides a significant competitive advantage over traditional microcontroller or ASIC-based designs. Introduction The basic motivation of deploying functional safety systems is to ensure safe operation as well as safe behavior in cases of failure. Examples of functional safety systems include train brakes, proximity sensors for hazardous areas around machines such as fast-moving robots, and distributed control systems in process automation equipment such as those used in petrochemical plants. The International Electrotechnical Commission’s standard, IEC 61508: “Functional safety of electrical/electronic/programmable electronic safety-related systems,” is understood as the standard for designing safety systems for electrical, electronic, and programmable electronic (E/E/PE) equipment. This standard was developed in the mid-1980s and has been revised several times to cover the technical advances in various industries. In addition, derivative standards have been developed for specific markets and applications that prescribe the particular requirements on functional safety systems in these industry applications. Example applications include process automation (IEC 61511), machine automation (IEC 62061), transportation (railway EN 50128), medical (IEC 62304), automotive (ISO 26262), power generation, distribution, and transportation. 圖Figure 1. Local Safety System

    標簽: FPGA 安全系統(tǒng)

    上傳時間: 2013-11-14

    上傳用戶:zoudejile

  • 基于Xilinx FPGA的雙輸出DC/DC轉(zhuǎn)換器解決方案

      Xilinx FPGAs require at least two power supplies: VCCINTfor core circuitry and VCCO for I/O interface. For the latestXilinx FPGAs, including Virtex-II Pro, Virtex-II and Spartan-3, a third auxiliary supply, VCCAUX may be needed. Inmost cases, VCCAUX can share a power supply with VCCO.The core voltages, VCCINT, for most Xilinx FPGAs, rangefrom 1.2V to 2.5V. Some mature products have 3V, 3.3Vor 5V core voltages. Table 1 shows the core voltagerequirement for most of the FPGA device families. TypicalI/O voltages (VCCO) vary from 1.2V to 3.3V. The auxiliaryvoltage VCCAUX is 2.5V for Virtex-II Pro and Spartan-3, andis 3.3V for Virtex-II.

    標簽: Xilinx FPGA DC 輸出

    上傳時間: 2013-10-22

    上傳用戶:aeiouetla

  • WP312-Xilinx新一代28nm FPGA技術(shù)簡介

    Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. These devices enable unprecedented levels of integration and bandwidth and provide system architects and designers a fully programmable alternative to ASSPs and ASICs.

    標簽: Xilinx FPGA 312 WP

    上傳時間: 2013-12-07

    上傳用戶:bruce

  • SM320 PCB LAYOUT GUIDELINES

    Silicon Motion, Inc. has made best efforts to ensure that the information contained in this document is accurate andreliable. However, the information is subject to change without notice. No responsibility is assumed by SiliconMotion, Inc. for the use of this information, nor for infringements of patents or other rights of third parties.Copyright NoticeCopyright 2002, Silicon Motion, Inc. All rights reserved. No part of this publication may be reproduced, photocopied,or transmitted in any form, without the prior written consent of Silicon Motion, Inc. Silicon Motion, Inc. reserves theright to make changes to the product specification without reservation and without notice to our users

    標簽: GUIDELINES LAYOUT 320 PCB

    上傳時間: 2013-10-10

    上傳用戶:manga135

  • 開關(guān)電源EMI設(shè)計(英文版)

    Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.

    標簽: EMI 開關(guān)電源 英文

    上傳時間: 2013-11-16

    上傳用戶:萍水相逢

  • LT5514三階互調(diào)的精確測量

      Accurate measurement of the third order intercept pointfor low distortion IC products such as the LT5514 requirescertain precautions to be observed in the test setup andtesting procedure. The LT5514 linearity performance ishigh enough to push the test equipment and test set-up totheir limits. A method for accurate measurement of thirdorder intermodulation products, IM3, with standard testequipment is outlined below.It is also important to correctly interpret the LT5514specification with respect to ROUT, and the impact ofdemo-board transmission-line termination loss whenevaluating the linearity performance, as explained in theLT5514 Datasheet and in Note 1 of this document.

    標簽: 5514 LT 三階互調(diào) 精確測量

    上傳時間: 2013-11-14

    上傳用戶:l254587896

  • Complete support for EBNF notation; Object-oriented parser design; C++ output; Deterministic bottom-

    Complete support for EBNF notation; Object-oriented parser design; C++ output; Deterministic bottom-up "shift-reduce" parsing; SLR(1), LALR(1) and LR(1) table construction methods; Automatic parse tree creation; Possibility to output parse tree in XML format; Verbose conflict diagnostics; Generation of tree traverse procedures

    標簽: Object-oriented Deterministic Complete notation

    上傳時間: 2014-11-29

    上傳用戶:kr770906

  • The goal with this project was to make it possible for almost any mobile-phone to use ICQ and be abl

    The goal with this project was to make it possible for almost any mobile-phone to use ICQ and be able to communicate with other users! One other goal with this project was to lower the GPRS-traffic in the phone and make the ICQ-ing cheaper. A third goal was to make this service as easy to log-in to as possible. Anyone tried to fill a log-in screen with a WAP-browser should know what I mean. With Wapmess all you have to do is to write your login-url ONCE and then bookmark it in your phone, to make it available fast. :)

    標簽: mobile-phone possible project almost

    上傳時間: 2015-04-08

    上傳用戶:xiaodu1124

  • The source code for "C++ Solutions". This book is a companion to the book that is widely recognized

    The source code for "C++ Solutions". This book is a companion to the book that is widely recognized as "the C++ bible": The C++ Programming Language (third edition) by Bjarne Stroustrup. If you re a programmer, Bjarne s book comes very highly recommended.

    標簽: book recognized Solutions companion

    上傳時間: 2014-01-22

    上傳用戶:努力努力再努力

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