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  • assembly language program for programming adf7020 devices through pic16f628a

    assembly language program for programming adf7020 devices through pic16f628a

    標簽: programming assembly language devices

    上傳時間: 2013-12-08

    上傳用戶:zhuoying119

  • Code for calculating reduced PAPR through SLM

    Code for calculating reduced PAPR through SLM

    標簽: calculating reduced through Code

    上傳時間: 2017-09-20

    上傳用戶:851197153

  • Project for interfacing Parallel port of the PC through JAVA application.

    Project for interfacing Parallel port of the PC through JAVA application.

    標簽: application interfacing Parallel Project

    上傳時間: 2017-09-24

    上傳用戶:xsnjzljj

  • Smart+City+Networks+through+the+Internet+of+Things

    Smart City Networks: through the Internet of Things is composed of research results, analyses, and ideas, which focus on a diversity of interconnected factors relating with urbanization, its “smartness,” and overarching “internet of things (IoT).” The latter refers to interconnected objects and devices – through compu- tational operations – which can receive signals and actuate systems.

    標簽: Networks Internet through Things Smart City

    上傳時間: 2020-05-26

    上傳用戶:shancjb

  • MAX17600數據資料

     The MAX17600–MAX17605 devices are high-speedMOSFET drivers capable of sinking /sourcing 4A peakcurrents. The devices have various inverting and noninvertingpart options that provide greater flexibility incontrolling the MOSFET. The devices have internal logiccircuitry that prevents shoot-through during output-statchanges. The logic inputs are protected against voltagespikes up to +14V, regardless of VDD voltage. Propagationdelay time is minimized and matched between the dualchannels. The devices have very fast switching time,combined with short propagation delays (12ns typ),making them ideal for high-frequency circuits. Thedevices operate from a +4V to +14V single powersupply and typically consume 1mA of supply current.The MAX17600/MAX17601 have standard TTLinput logic levels, while the MAX17603 /MAX17604/MAX17605 have CMOS-like high-noise margin (HNM)input logic levels. The MAX17600/MAX17603 are dualinverting input drivers, the MAX17601/MAX17604 aredual noninverting input drivers, and the MAX17602 /MAX17605 devices have one noninverting and oneinverting input. These devices are provided with enablepins (ENA, ENB) for better control of driver operation.

    標簽: 17600 MAX 數據資料

    上傳時間: 2013-12-20

    上傳用戶:zhangxin

  • 水聲信號功率放大器的設計與實現

    設計了水聲信號發生系統中的功率放大電路,可將前級電路產生的方波信號轉換為正弦信號,同時進行濾波、功率放大,使其滿足換能器對輸入信號的要求。該電路以單片機AT89C52,集成6階巴特沃思低通濾波芯片MF6以及大功率運算放大器LM12為核心,通過標準RS232接口與PC進行通信,實現信號增益的程控調節,對干擾信號具有良好的抑制作用。經調試該電路工作穩定正常,輸出波形無失真,在輸出功率以及放大增益、波紋系數等方面均滿足設計要求。    This paper presented a design and implementation of underwater acoustic power amplifer. This circuit converted the rectangle signal generated by frontend circuit into the sine signal, then filtered and power amplification, it meets the requirements of the transducer.Included AT89C52, 6th order Butterworth filter MF6, hipower amplififier LM12.Communication with PC through the RS232 port. The signal gain is adjustable and could be remote controlled. It has a good inhibitory effect on the interference signal. After debugged, this circuit works stable, the output waveform has no distortion, it meets the design requirement in outprt power, amplifier gain and ripple factor.

    標簽: 水聲信號 功率放大器

    上傳時間: 2013-11-20

    上傳用戶:qwe1234

  • 高速數字系統設計下載pdf

    高速數字系統設計下載pdf:High-Speed Digital SystemDesign—A Handbook ofInterconnect Theory and DesignPracticesStephen H. HallGarrett W. HallJames A. McCallA Wiley-Interscience Publication JOHN WILEY & SONS, INC.New York • Chichester • Weinheim • Brisbane • Singapore • TorontoCopyright © 2000 by John Wiley & Sons, Inc.speeddigital systems at the platform level. The book walks the reader through everyrequired concept, from basic transmission line theory to digital timing analysis, high-speedmeasurement techniques, as well as many other topics. In doing so, a unique balancebetween theory and practical applications is achieved that will allow the reader not only tounderstand the nature of the problem, but also provide practical guidance to the solution.The level of theoretical understanding is such that the reader will be equipped to see beyondthe immediate practical application and solve problems not contained within these pages.Much of the information in this book has not been needed in past digital designs but isabsolutely necessary today. Most of the information covered here is not covered in standardcollege curricula, at least not in its focus on digital design, which is arguably one of the mostsignificant industries in electrical engineering.The focus of this book is on the design of robust high-volume, high-speed digital productssuch as computer systems, with particular attention paid to computer busses. However, thetheory presented is applicable to any high-speed digital system. All of the techniquescovered in this book have been applied in industry to actual digital products that have beensuccessfully produced and sold in high volume.Practicing engineers and graduate and undergraduate students who have completed basicelectromagnetic or microwave design classes are equipped to fully comprehend the theorypresented in this book. At a practical level, however, basic circuit theory is all thebackground required to apply the formulas in this book.

    標簽: 高速數字 系統設計

    上傳時間: 2013-10-26

    上傳用戶:縹緲

  • 射頻集成電路設計John Rogers(Radio Freq

    Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.

    標簽: Rogers Radio John Freq

    上傳時間: 2014-12-23

    上傳用戶:han_zh

  • 印刷電路板的過孔設置原則

    過孔(via)是多層PCB的重要組成部分之一,鉆孔的費用通常占PCB制板費用的30%到40%。簡單的說來,PCB上的每一個孔都可以稱之為過孔。從作用上看,過孔可以分成兩類:一是用作各層間的電氣連接;二是用作器件的固定或定位。如果從工藝制程上來說,這些過孔一般又分為三類,即盲孔(blind via)、埋孔(buried via)和通孔(through via)。盲孔位于印刷線路板的頂層和底層表面,具有一定深度,用于表層線路和下面的內層線路的連接,孔的深度通常不超過一定的比率(孔徑)。埋孔是指位于印刷線路板內層的連接孔,它不會延伸到線路板的表面。上述兩類孔都位于線路板的內層,層壓前利用通孔成型工藝完成,在過孔形成過程中可能還會重疊做好幾個內層。第三種稱為通孔,這種孔穿過整個線路板,可用于實現內部互連或作為元件的安裝定位孔。由于通孔在工藝上更易于實現,成本較低,所以絕大部分印刷電路板均使用它,而不用另外兩種過孔。以下所說的過孔,沒有特殊說明的,均作為通孔考慮。

    標簽: 印刷電路板 過孔

    上傳時間: 2013-11-08

    上傳用戶:chenhr

  • 通孔插裝PCB的可制造性設計

    對于電子產品設計師尤其是線路板設計人員來說,產品的可制造性設計(Design For Manufacture,簡稱DFM)是一個必須要考慮的因素,如果線路板設計不符合可制造性設計要求,將大大降低產品的生產效率,嚴重的情況下甚至會導致所設計的產品根本無法制造出來。目前通孔插裝技術(through Hole Technology,簡稱THT)仍然在使用,DFM在提高通孔插裝制造的效率和可靠性方面可以起到很大作用,DFM方法能有助于通孔插裝制造商降低缺陷并保持競爭力。本文介紹一些和通孔插裝有關的DFM方法,這些原則從本質上來講具有普遍性,但不一定在任何情況下都適用,不過,對于與通孔插裝技術打交道的PCB設計人員和工程師來說相信還是有一定的幫助。1、排版與布局在設計階段排版得當可避免很多制造過程中的麻煩。(1)用大的板子可以節約材料,但由于翹曲和重量原因,在生產中運輸會比較困難,它需要用特殊的夾具進行固定,因此應盡量避免使用大于23cm×30cm的板面。最好是將所有板子的尺寸控制在兩三種之內,這樣有助于在產品更換時縮短調整導軌、重新擺放條形碼閱讀器位置等所導致的停機時間,而且板面尺寸種類少還可以減少波峰焊溫度曲線的數量。(2)在一個板子里包含不同種拼板是一個不錯的設計方法,但只有那些最終做到一個產品里并具有相同生產工藝要求的板才能這樣設計。(3)在板子的周圍應提供一些邊框,尤其在板邊緣有元件時,大多數自動裝配設備要求板邊至少要預留5mm的區域。(4)盡量在板子的頂面(元件面)進行布線,線路板底面(焊接面)容易受到損壞。不要在靠近板子邊緣的地方布線,因為生產過程中都是通過板邊進行抓持,邊上的線路會被波峰焊設備的卡爪或邊框傳送器損壞。(5)對于具有較多引腳數的器件(如接線座或扁平電纜),應使用橢圓形焊盤而不是圓形,以防止波峰焊時出現錫橋(圖1)。

    標簽: PCB 通孔插裝 可制造性

    上傳時間: 2013-11-07

    上傳用戶:refent

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