The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously.
In today’s world of modular networking and telecommunications design, it is becomingincreasingly difficult to keep alignment with the many different and often changing interfaces,both inter-board and intra-board. Each manufacturer has their own spin on the way in whichdevices are connected. To satisfy the needs of our customers, we must be able to support alltheir interface requirements. For us to be able to make products for many customers, we mustadopt a modular approach to the design. This modularity is the one issue that drives the majorproblem of shifting our bits from one modular interface to another.
today in many applications such as network switches, routers, multi-computers,and processor-memory interfaces, the ability to integrate hundreds of multi-gigabit I/Os is desired to make better use of the rapidly advancing IC technology.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
In the past decade, the size and complexity of manyFPGA designs exceeds the time and resourcesavailable to most design teams, making the use andreuse of Intellectual Property (IP) imperative.However, integrating numerous IP blocks acquiredfrom both internal and external sources can be adaunting challenge that often extends, rather thanshortens, design time. As today's designs integrateincreasing amounts of functionality, it is vital thatdesigners have access to proven, up-to-date IP fromreliable sources.
today’s digital systems combine a myriad of chips with different voltage configurations.Designers must interface 2.5V processors with 3.3V memories—both RAM and ROM—as wellas 5V buses and multiple peripheral chips. Each chip has specific power supply needs. CPLDsare ideal for handling the multi-voltage interfacing, but do require forethought to ensure correctoperation.
The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously.
This document describes the uIP TCP/IP stack. The uIP TCP/IP stack is an extremely small implementation of the TCP/IP protocol suite intended for embedded systems running low-end 8 or 16-bit microcon-trollers. The code size and RAM requirements of uIP is an order of magnitude smaller than other generic TCP/IP stacks today.
OReilly.Ajax.on.Rails.Dec.2006. ISBN-10: 0-596-52744-6.
Learn to build dynamic, interactive web applications using the two most important approaches to web development today: Ajax and the phenomenally efficient Ruby on Rails platform. This book teaches intermediate to advanced web developers how to use both Ajax and Rails to quickly build high-performance, scalable applications without being overwhelmed with thousands of lines of JavaScript code. More than just recipes, you also get a thorough, low-level understanding of what s happening under the hood.
Learning Kernel Classifiers: Theory and Algorithms, Introduction This chapter introduces the general problem of machine learning and how it relates to statistical inference. 1.1 The Learning Problem and (Statistical) Inference It was only a few years after the introduction of the first computer that one of man’s greatest dreams seemed to be realizable—artificial intelligence. Bearing in mind that in the early days the most powerful computers had much less computational power than a cell phone today, it comes as no surprise that much theoretical research on the potential of machines’ capabilities to learn took place at this time. This becomes a computational problem as soon as the dataset gets larger than a few hundred examples.
