華成英課件復(fù)習(xí)與考試。
標(biāo)簽：
上傳時(shí)間： 2013-11-21
上傳用戶(hù)：chendawei
拉扎維的前十章課件，初學(xué)者看看
標(biāo)簽： CMOS 模擬 集成電路設(shè)計(jì)
上傳時(shí)間： 2013-11-12
上傳用戶(hù)：spman
這是在網(wǎng)上找了好久的課件，比較不錯(cuò)，上面還有我的筆記，主要講解模擬集成電路設(shè)計(jì)原理。
標(biāo)簽： cmos 模擬集成電路 設(shè)計(jì)原理
上傳時(shí)間： 2013-11-07
上傳用戶(hù)：huyiming139
TLV5616 12 位 3微秒 DAC 串行輸入可編程設(shè)置時(shí)間 功耗
上傳時(shí)間： 2013-11-02
上傳用戶(hù)：xinyuzhiqiwuwu
在使用一些專(zhuān)用開(kāi)發(fā)工具如Authorware時(shí)，常遇到不支持COM組件調(diào)用的問(wèn)題。文中介紹了將COM組件和ActiveX控件的轉(zhuǎn)化方法以解決這種問(wèn)題。根據(jù)組件的函數(shù)和數(shù)據(jù)成員在控件中添加相應(yīng)的屬性、方法和事件來(lái)設(shè)計(jì)控件。文中以一個(gè)語(yǔ)音識(shí)別組件來(lái)詳細(xì)說(shuō)明轉(zhuǎn)化方法和流程。最后，在Authorware工具中調(diào)用語(yǔ)音識(shí)別控件并能夠識(shí)別出文本。
標(biāo)簽： 語(yǔ)音識(shí)別 控件 轉(zhuǎn)化
上傳時(shí)間： 2013-11-03
上傳用戶(hù)：XLHrest
數(shù)字電路基礎(chǔ)課件
標(biāo)簽： 數(shù)字電路基礎(chǔ)
上傳時(shí)間： 2013-11-20
上傳用戶(hù)：dgann
數(shù)電Verilog相關(guān)課件
上傳時(shí)間： 2013-10-23
上傳用戶(hù)：wangzeng
數(shù)字電路基礎(chǔ)課件PDF
上傳時(shí)間： 2013-10-08
上傳用戶(hù)：csgcd001
緒論 3線(xiàn)性及邏輯器件新產(chǎn)品優(yōu)先性計(jì)算領(lǐng)域4PCI Express®多路復(fù)用技術(shù)USB、局域網(wǎng)、視頻多路復(fù)用技術(shù)I2C I/O擴(kuò)展及LED驅(qū)動(dòng)器RS-232串行接口靜電放電(ESD)保護(hù)服務(wù)器/存儲(chǔ)10GTL/GTL+至LVTTL轉(zhuǎn)換PCI Express信號(hào)開(kāi)關(guān)多路復(fù)用I2C及SMBus接口RS-232接口靜電放電保護(hù)消費(fèi)醫(yī)療16電源管理信號(hào)調(diào)節(jié)I2C總線(xiàn)輸入/輸出擴(kuò)展電平轉(zhuǎn)換靜電放電保護(hù) 手持設(shè)備22電平轉(zhuǎn)換音頻信號(hào)路由I2C基帶輸入/輸出擴(kuò)展可配置小邏輯器件靜電放電保護(hù)鍵區(qū)控制娛樂(lè)燈光顯示USB接口工業(yè)自動(dòng)化31接口——RS-232、USB、RS-485/422繼電器及電機(jī)控制保持及控制：I2C I/O擴(kuò)展信號(hào)調(diào)節(jié)便攜式工業(yè)（掌上電腦/掃描儀） 36多路復(fù)用USB外設(shè)卡接口接口—RS-232、USB、RS-485/422I2C控制靜電放電保護(hù) 對(duì)于任意外部接口連接器的端口來(lái)說(shuō)，靜電放電的沖擊一直是對(duì)器件可靠性的威脅。許多低電壓核心芯片或系統(tǒng)級(jí)的特定用途集成電路(ASIC)提供了器件級(jí)的人體模型(HBM)靜電放電保護(hù)，但無(wú)法應(yīng)付系統(tǒng)級(jí)的靜電放電。一個(gè)卓越的靜電放電解決方案應(yīng)該是一個(gè)節(jié)省空間且經(jīng)濟(jì)高效的解決方案，可保護(hù)系統(tǒng)的相互連接免受外部靜電放電的沖擊。
上傳時(shí)間： 2013-10-18
上傳用戶(hù)：mikesering
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線(xiàn)理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線(xiàn)的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線(xiàn)的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線(xiàn)電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線(xiàn)的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線(xiàn)RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線(xiàn)規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問(wèn)題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線(xiàn)器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問(wèn)...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線(xiàn)分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問(wèn)題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線(xiàn)進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2014-04-18
上傳用戶(hù)：wpt
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