VIP專區(qū)-嵌入式/單片機(jī)編程源碼精選合集系列（92）資源包含以下內(nèi)容：1. 這里是:"EDA技術(shù)基礎(chǔ)_第5章".謝謝大家的支持!.2. 這里接下來是:"EDA技術(shù)基礎(chǔ)_第6章.PPT".希望大家支持!.3. Protel99電子元件封裝.4. bios源碼.5. 一本關(guān)于我國嵌入式考試的很好的參考資料,值得下載.6. tms2812的原理圖.7. smartarm2200開發(fā)板上做的一個(gè)程序.8. wsd:tiger studio ,1_2 .protel 99 se多層電路板設(shè)計(jì)配套光盤資料.9. wsd:tiger studio ,1_3 .protel 99 se多層電路板設(shè)計(jì)配套光盤資料.10. wsd:tiger studio 1_4 ,which is verygood and useful.protel 99 se多層電路板設(shè)計(jì)配套光盤資料.11. wsd:tiger studio 1_5 ,which is very good and useful.protel 99 se多層電路板設(shè)計(jì)配套光盤資料.12. wsd:tiger studio 1_6,which is very good and useful.protel 99 se多層電路板設(shè)計(jì)配套光盤資料.13. wsd:tiger studio 1_7,which is very good and useful.protel 99 se多層電路板設(shè)計(jì)配套光盤資料.14. wsd:tiger studio 1_7 ,which is very good and useful.protel 99 se多層電路板設(shè)計(jì)配套光盤資料.15. wsd:tiger studio 1_9,which is very good and useful.protel 99 se多層電路板設(shè)計(jì)配套光盤資料.16. 步進(jìn)伺服電機(jī)運(yùn)動(dòng)控制,k880伺服電機(jī)運(yùn)動(dòng)控制vb測(cè)試程序.17. ucosii下的arm9LCD程序.18. 用 Atmega8 實(shí)現(xiàn)D觸發(fā)鎖存器的功能.19. 學(xué)習(xí)ARM嵌入式及相關(guān)操作系統(tǒng)的介紹,是清華大學(xué)碩士教材.對(duì)嵌入式有更深一層的了解.20. ThreadX Datasheet Version 4.0.21. CH375 是南京沁恒公司開發(fā)的一個(gè)USB總線的通用接口芯片.22. ML Estimation of 2 PFM signals using EM and AM.23. i2c 在linux下的驅(qū)動(dòng)設(shè)計(jì).24. 這些程序是在ccs調(diào)試通過的.25. 該文件在ccs編譯器下調(diào)試通過的2812 DSP pwm實(shí)驗(yàn)程序。.26. 該文件在ccs編譯器下調(diào)試通過的2812 DSP EV事件管理實(shí)驗(yàn)程序。.27. 該文件在ccs編譯器下調(diào)試通過的2812 DSP mcsbp實(shí)驗(yàn)程序。.28. 該文件在ccs編譯器下調(diào)試通過的2812 DSP 外EXRAM實(shí)驗(yàn)程序。.29. the ndis driver ,you must install the inf file.30. 僅供參考的protel電路圖.31. ERTFS是一個(gè)優(yōu)秀的文件系統(tǒng).32. 此源碼為vb寫的底屋開發(fā)。通過bios取得相關(guān)信息。希望有所收獲.33. zigbee的協(xié)議標(biāo)準(zhǔn).34. 達(dá)盛科技公司S3C2410基礎(chǔ)實(shí)驗(yàn)源碼.35. MD204LV4文本顯示器電路原理圖,已廣泛用于工業(yè)設(shè)備上..36. 這是一個(gè)關(guān)于基于CPLD的多路SPWM控制器的研制的論文.37. Altera FPGA與CPLD的外部處理器連接方式及編程。.38. 北京航空航天大學(xué)2006年嵌入式系統(tǒng)課件及試驗(yàn)．適合嵌入式初級(jí)學(xué)者！.39. altera 的i2c ip核.40. altera 的vga ip核.
標(biāo)簽： 減
上傳時(shí)間： 2013-04-15
上傳用戶：eeworm
單片機(jī)精品課件,教程,試題庫,實(shí)驗(yàn)指導(dǎo)(無錫科技學(xué)院)
標(biāo)簽： 單片機(jī) 精品課 教程 實(shí)驗(yàn)指導(dǎo)
上傳時(shí)間： 2013-04-15
上傳用戶：eeworm
RFID被列為本世紀(jì)十大重要技術(shù)項(xiàng)目之一，經(jīng)濟(jì)部技術(shù)處為國內(nèi)科技研發(fā)推動(dòng)之火車頭，92年度起即開始透過工研院系統(tǒng)中心推動(dòng)高頻 RFID的研發(fā)計(jì)劃，研發(fā)內(nèi)容包括IC芯片、天線、讀取機(jī)(Reader)等重
標(biāo)簽： RFID
上傳時(shí)間： 2013-08-04
上傳用戶：14786697487
LC1920 是上海嶺芯微電子有限公司最新設(shè)計(jì)的一款線性LED 恒流驅(qū)動(dòng)IC，封裝為TO-92，應(yīng)用電壓范圍為5-90V，輸出電流可調(diào)。由于較高的耐壓，在多燈串聯(lián)的應(yīng)用中，只需要少量的外部元件
標(biāo)簽： 1920 LC 應(yīng)用指南
上傳時(shí)間： 2013-04-24
上傳用戶：liangrb
這篇論文以數(shù)字電視條件接收系統(tǒng)為研究對(duì)象，系統(tǒng)硬件設(shè)計(jì)以DSP和FPGA為實(shí)現(xiàn)平臺(tái)，采用以DSP實(shí)現(xiàn)其加密算法、以FPGA實(shí)現(xiàn)其外圍電路，對(duì)數(shù)字電視條件接收系統(tǒng)進(jìn)行設(shè)計(jì)。首先根據(jù)數(shù)字電視條件接收系統(tǒng)的原理及其軟硬分離的發(fā)展趨勢(shì)，提出采用 DSP+FPGA結(jié)構(gòu)的設(shè)計(jì)方式，將ECC與AES加密算法應(yīng)用于SK與CW的加密；根據(jù)其原理對(duì)系統(tǒng)進(jìn)行總體設(shè)計(jì)，同時(shí)對(duì)系統(tǒng)各部分的硬件原理圖進(jìn)行詳細(xì)設(shè)計(jì)，并進(jìn)行 PCB設(shè)計(jì)。其次采用從上而下的設(shè)計(jì)方式，對(duì)FPGA實(shí)現(xiàn)的邏輯功能劃分為各個(gè)功能模塊，然后再對(duì)各個(gè)模塊進(jìn)行設(shè)計(jì)、仿真。采用Quartus Ⅱ7.2軟件對(duì)FPGA實(shí)現(xiàn)的邏輯功能進(jìn)行設(shè)計(jì)、仿真。仿真結(jié)果表明：基于通用加擾算法(CSA)的加擾器模塊，滿足TS流加擾要求；塊加密模塊的最高時(shí)鐘頻率達(dá)到229.89MHz，流加密模塊的最高時(shí)鐘頻率達(dá)到331.27MHz，對(duì)于實(shí)際的碼流來說，具有比較大的時(shí)序裕量；DSP接口模塊滿足 ADSP BF-535的讀寫時(shí)序；包處理模塊實(shí)現(xiàn)對(duì)加密后數(shù)據(jù)的包處理。最后對(duì)條件接收系統(tǒng)中加密算法程序采用結(jié)構(gòu)化、模塊化的編程方式進(jìn)行設(shè)計(jì)。 ECC設(shè)計(jì)時(shí)采用C語言與匯編語言混合編程，充分利用兩種編程語言的優(yōu)勢(shì)。將ECC 與AES加密算法在VisualDSP++3.0開發(fā)環(huán)境下進(jìn)行驗(yàn)證，并下載至ADSP BF-535評(píng)估板上運(yùn)行。輸出結(jié)果表明：有限域運(yùn)算匯編語言編程的實(shí)現(xiàn)方式，其運(yùn)行速度明顯提高， 192位加法提高380個(gè)時(shí)鐘周期，32位乘法提高92個(gè)時(shí)鐘周期；ECC與AES達(dá)到加密要求。上述工作對(duì)數(shù)字電視條件接收系統(tǒng)的設(shè)計(jì)具有實(shí)際的應(yīng)用價(jià)值。關(guān)鍵詞：條件接收，DSP，F(xiàn)PGA，ECC，AEs
標(biāo)簽： DSPFPGA 數(shù)字電視 條件接收系統(tǒng)
上傳時(shí)間： 2013-07-03
上傳用戶：www240697738
為了滿足寬頻段、細(xì)步進(jìn)頻率綜合器的工程需求，對(duì)基于多環(huán)鎖相的頻率合成器進(jìn)行了分析和研究。在對(duì)比傳統(tǒng)單環(huán)鎖相技術(shù)基礎(chǔ)上，介紹了采用DDS+PLL多環(huán)技術(shù)實(shí)現(xiàn)寬帶細(xì)步進(jìn)頻綜，輸出頻段10~13 GHz，頻率步進(jìn)10 kHz，相位噪聲達(dá)到-92 dBc/Hz@1 kHz，雜散抑制達(dá)到-68 dBc，滿足實(shí)際工程應(yīng)用需求。
上傳時(shí)間： 2013-10-12
上傳用戶：Late_Li
現(xiàn)代的電子設(shè)計(jì)和芯片制造技術(shù)正在飛速發(fā)展，電子產(chǎn)品的復(fù)雜度、時(shí)鐘和總線頻率等等都呈快速上升趨勢(shì)，但系統(tǒng)的電壓卻不斷在減小，所有的這一切加上產(chǎn)品投放市場(chǎng)的時(shí)間要求給設(shè)計(jì)師帶來了前所未有的巨大壓力。要想保證產(chǎn)品的一次性成功就必須能預(yù)見設(shè)計(jì)中可能出現(xiàn)的各種問題，并及時(shí)給出合理的解決方案，對(duì)于高速的數(shù)字電路來說，最令人頭大的莫過于如何確保瞬時(shí)跳變的數(shù)字信號(hào)通過較長(zhǎng)的一段傳輸線，還能完整地被接收，并保證良好的電磁兼容性，這就是目前頗受關(guān)注的信號(hào)完整性（SI）問題。本章就是圍繞信號(hào)完整性的問題，讓大家對(duì)高速電路有個(gè)基本的認(rèn)識(shí)，并介紹一些相關(guān)的基本概念。 第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1066.2 源同步時(shí)序系統(tǒng).......................................................................................1086.2.1 源同步系統(tǒng)的基本結(jié)構(gòu)...................................................................1096.2.2 源同步時(shí)序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構(gòu)成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關(guān)工具及鏈接..............................................................................120第八章 高速設(shè)計(jì)理論在實(shí)際中的運(yùn)用.............................................................1228.1 疊層設(shè)計(jì)方案...........................................................................................1228.2 過孔對(duì)信號(hào)傳輸?shù)挠绊?..........................................................................1278.3 一般布局規(guī)則...........................................................................................1298.4 接地技術(shù)...................................................................................................1308.5 PCB 走線策略............................................................................................134
標(biāo)簽： 信號(hào)完整性
上傳時(shí)間： 2014-05-15
上傳用戶：dudu1210004
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2014-04-18
上傳用戶：wpt
LTC®3838 是一款雙輸出、兩相降壓型控制器，其采用一種受控恒定導(dǎo)通時(shí)間、谷值電流模式架構(gòu)，可提供快速負(fù)載階躍響應(yīng)、高開關(guān)頻率和低占空比能力。開關(guān)頻率范圍為 200kHz 至 2MHz，其鎖相環(huán)可在穩(wěn)態(tài)操作期間保持固定頻率，并可同步至一個(gè)外部時(shí)鐘
上傳時(shí)間： 2013-11-09
上傳用戶：uuuuuuu
提出了一種利用耦合輸出電感的新型次級(jí)箝位零電壓、零電流開關(guān)-脈寬調(diào)制（ZVZCS-PWM）全橋變換器。它采用無損耗元件及有源開關(guān)的簡(jiǎn)單輔助電路，實(shí)現(xiàn)了滯后橋臂的零電流開關(guān)。與傳統(tǒng)的ZVZCS-PWM全橋變換器相比，這種新型變換器具有電路結(jié)構(gòu)簡(jiǎn)單，整機(jī)效率高，以及輕載時(shí)能根據(jù)負(fù)載情況自動(dòng)調(diào)整箝位電容的充放電電流。因而非常適合用于IGBT 作為主開關(guān)的高壓、大功率應(yīng)用場(chǎng)合。詳細(xì)分析了該變換器的工作原理及電路設(shè)計(jì)；在一臺(tái)功率為1kW的工程樣機(jī)上測(cè)出了實(shí)際運(yùn)行時(shí)的波形及變換器效率。實(shí)驗(yàn)結(jié)果證明，該變換器能在任意負(fù)載下實(shí)現(xiàn)滯后橋臂的零電流開關(guān)，且滿載時(shí)的效率最高達(dá)到92%。關(guān)鍵詞: 變換器；控制/軟開關(guān)
上傳時(shí)間： 2014-12-24
上傳用戶：wujijunshi
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