交叉耦合控制(cross-COUPLING control)對誤差的影響
標簽： cross-COUPLING control 交叉耦合 控制
上傳時間： 2013-12-25
上傳用戶：rishian
COUPLING OF TRANSIENT ELECTROMAGNETIC FIELD TO UNSHIELDED CABLE (over a ground plane)
標簽： ELECTROMAGNETIC UNSHIELDED TRANSIENT COUPLING
上傳時間： 2013-12-19
上傳用戶：lingzhichao
印刷電路板（PCB）設(shè)計解決方案市場和技術(shù)領(lǐng)軍企業(yè)Mentor Graphics（Mentor Graphics）宣布推出HyperLynx® PI（電源完整性）產(chǎn)品，滿足業(yè)內(nèi)高端設(shè)計者對于高性能電子產(chǎn)品的需求。HyperLynx PI產(chǎn)品不僅提供簡單易學(xué)、操作便捷，又精確的分析，讓團隊成員能夠設(shè)計可行的電源供應(yīng)系統(tǒng)；同時縮短設(shè)計周期，減少原型生成、重復(fù)制造，也相應(yīng)降低產(chǎn)品成本。隨著當今各種高性能/高密度/高腳數(shù)集成電路的出現(xiàn)，傳輸系統(tǒng)的設(shè)計越來越需要工程師與布局設(shè)計人員的緊密合作，以確保能夠透過眾多PCB電源與接地結(jié)構(gòu)，為IC提供純凈、充足的電力。配合先前推出的HyperLynx信號完整性（SI）分析和確認產(chǎn)品組件，Mentor Graphics目前為用戶提供的高性能電子產(chǎn)品設(shè)計堪稱業(yè)內(nèi)最全面最具實用性的解決方案。“我們擁有非常高端的用戶，受到高性能集成電路多重電壓等級和電源要求的驅(qū)使，需要在一個單一的PCB中設(shè)計30余套電力供應(yīng)結(jié)構(gòu)。”Mentor Graphics副總裁兼系統(tǒng)設(shè)計事業(yè)部總經(jīng)理Henry Potts表示。“上述結(jié)構(gòu)的設(shè)計需要快速而準 確的直流壓降(DC Power Drop)和電源雜訊(Power Noise)分析。擁有了精確的分析信息，電源與接地層結(jié)構(gòu)和解藕電容數(shù)(de-COUPLING capacitor number)以及位置都可以決定，得以避免過于保守的設(shè)計和高昂的產(chǎn)品成本。”
上傳時間： 2013-11-18
上傳用戶：362279997
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC COUPLING capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
標簽： pci PCB 設(shè)計規(guī)范
上傳時間： 2013-10-15
上傳用戶：busterman
印刷電路板（PCB）設(shè)計解決方案市場和技術(shù)領(lǐng)軍企業(yè)Mentor Graphics（Mentor Graphics）宣布推出HyperLynx® PI（電源完整性）產(chǎn)品，滿足業(yè)內(nèi)高端設(shè)計者對于高性能電子產(chǎn)品的需求。HyperLynx PI產(chǎn)品不僅提供簡單易學(xué)、操作便捷，又精確的分析，讓團隊成員能夠設(shè)計可行的電源供應(yīng)系統(tǒng)；同時縮短設(shè)計周期，減少原型生成、重復(fù)制造，也相應(yīng)降低產(chǎn)品成本。隨著當今各種高性能/高密度/高腳數(shù)集成電路的出現(xiàn)，傳輸系統(tǒng)的設(shè)計越來越需要工程師與布局設(shè)計人員的緊密合作，以確保能夠透過眾多PCB電源與接地結(jié)構(gòu)，為IC提供純凈、充足的電力。配合先前推出的HyperLynx信號完整性（SI）分析和確認產(chǎn)品組件，Mentor Graphics目前為用戶提供的高性能電子產(chǎn)品設(shè)計堪稱業(yè)內(nèi)最全面最具實用性的解決方案。“我們擁有非常高端的用戶，受到高性能集成電路多重電壓等級和電源要求的驅(qū)使，需要在一個單一的PCB中設(shè)計30余套電力供應(yīng)結(jié)構(gòu)。”Mentor Graphics副總裁兼系統(tǒng)設(shè)計事業(yè)部總經(jīng)理Henry Potts表示。“上述結(jié)構(gòu)的設(shè)計需要快速而準 確的直流壓降(DC Power Drop)和電源雜訊(Power Noise)分析。擁有了精確的分析信息，電源與接地層結(jié)構(gòu)和解藕電容數(shù)(de-COUPLING capacitor number)以及位置都可以決定，得以避免過于保守的設(shè)計和高昂的產(chǎn)品成本。”
上傳時間： 2013-10-31
上傳用戶：ljd123456
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC COUPLING capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
標簽： pci PCB 設(shè)計規(guī)范
上傳時間： 2014-01-24
上傳用戶：s363994250
A system simulation environment in Matlab/Simulink of RFID is constructed in this paper. Special attention is emphasized on the analog/RF circuit.Negative effects are concerned in the system model,such as phase noise of the local oscillator,TX-RX COUPLING,reflection of the environment, AWGN noise,DC offset,I/Q mismatch,etc.Performance of the whole system can be evaluated by changing the coding method,parameters of building blocks,and operation distance.Finally,some simulation results are presented in this paper.
標簽： environment constructed simulation Simulink
上傳時間： 2014-01-09
上傳用戶：zhangliming420
This research work aims at eliminating the off-chip RF SAW filters from fre- quency division duplexed (FDD) receivers. In the first approach, a monolithic passive RF filter was constructed using on-chip capacitors and bondwire inductors. The bond- wire characteristics were studied in details and the effect of mutual inductive COUPLING between the bondwires on the filter performance was analyzed. Based on that, a bond- wire configuration was proposed to improve the frequency response of the filter. The filter was implemented in 0.18 μm CMOS process for WCDMA applications.
標簽： Interference Mitigation Techniques
上傳時間： 2020-05-27
上傳用戶：shancjb
Sensors are points ofcontact betweenthe material world ofatoms, mass, andenergy and the seemingly immaterial world of information, computation, and cognition. Linking these two domains more tightly yields all sorts of practical benefits, such as improvedinputdevicesforcomputers,moreeffectivemedicaldevices(implantedor worn), more precise agricultural operations, better monitored buildings or bridges, more secure payment systems, and more reliable sensor–actuator control systems. There are many settings in which tighter COUPLING between digital and physical planes can enhance safety, security, performance, and reliability.
標簽： Computational RFID
上傳時間： 2020-06-08
上傳用戶：shancjb
This design uses Common-Emitter Amplifier (Class A) with 2N3904 Bipolar Junction Transistor. Use “Voltage Divider Biasing” to reduce the effects of varying β (= ic / ib) (by holding the Base voltage constant) Base Voltage (Vb) = Vcc * [R2 / (R1 + R2)] Use COUPLING Capacitors to separate the AC signals from the DC biasing voltage (which only pass AC signals and block any DC component). Use Bypass Capacitor to maintain the Q-point stability. To determine the value of each component, first set Q-point close to the center position of the load line. (RL is the resistance of the speaker.)
標簽： 音頻放大器設(shè)計 電路圖 英文
上傳時間： 2020-11-27
上傳用戶：
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