Interface 8051 to Coolrunner CPLD(Xilinx App)
標簽： Coolrunner Interface Xilinx 8051
上傳時間： 2013-09-05
上傳用戶：bcjtao
該工程文件實現ARM系統中CPLD的邏輯工作，起到外圍資源的邏輯地址譯碼功能
上傳時間： 2013-09-05
上傳用戶：zcs023047
cpld的入門交流：CPLD的跑馬燈一個簡易型cpld試驗電路用VHDL語言遍的
上傳時間： 2013-09-06
上傳用戶：blacklee
用VHDL語言在CPLD上實現串行通信
上傳時間： 2013-09-06
上傳用戶：q3290766
這是可編程邏輯器件（CPLD）初學者的入門級文章，僅供參考。
上傳時間： 2013-09-06
上傳用戶：dudu121
CPLD/FPGA是目前誚用最為廣泛的兩種可編程專用集成電路（ASIC），特別適合于產品的樣品開發與小批量生產。本書從現代電子系統設計的角度出發，以全球著名的可編程邏輯器件供應商Xilinx公司的產品為背景，系統全面地介紹該公司的CPLD/FPGA產品的結構原理、性能特點、設計方法以及相應的EDA工具軟件，重點介紹CPLD/FPGA在數字系統設計、數字通信與數字信號處理等領域中的應用。\r\n 本書內容新穎、技術先進、由淺入深，既有關于大規?？删庉嬤壿嬈骷南到y論述，又有豐富的設計應用實例。對于從事各類
上傳時間： 2013-09-06
上傳用戶：Maple
用cpld實現曼徹斯特編碼\r\n用verilog HDL進行曼徹斯特編碼，用于通信中
上傳時間： 2013-09-07
上傳用戶：786334970
PCI ExpressTM Architecture Add-in Card Compliance Checklist for the PCI Express Base 1.0a SpecificationThe PCI Special Interest Group disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI Special Interest Group make a commitment to update the information contained herein.Contact the PCI Special Interest Group office to obtain the latest revision of this checklistQuestions regarding the ths document or membership in the PCI Special Interest Group may be forwarded tPCI Special Interest Group5440 SW Westgate Drive #217Portland, OR 97221Phone: 503-291-2569Fax: 503-297-1090 DISCLAIMERThis document is provided "as is" with no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or sample. The PCI SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
標簽： Architecture ExpressTM PCI
上傳時間： 2013-11-03
上傳用戶：gy592333
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
PCI ExpressTM is the third generation of PCI (PeripheralComponent Interconnect) technology used to connect I/Operhipheral devices in computer systems. It is intended asa general purpose I/O device interconnect that meets theneeds of a wide variety of computing platforms such asdesktop, mobile, server and communications. It alsospecifies the electrical and mechanical attributes of thebackplane, connectors and removable cards in thesesystems.
上傳時間： 2013-11-17
上傳用戶：squershop
