Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor Devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the Device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the Device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved Device functionality and performance. Feature size at the Device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
This application note describes how to implement the Bus LVDS (BLVDS) interface in the supported Altera ® Device families for high-performance multipoint applications. This application note also shows the performance analysis of a multipoint application with the Cyclone III BLVDS example.
標簽： Implementing LVDS 522 Bus
上傳時間： 2013-11-10
上傳用戶：frank1234
Xilinx FPGAs require at least two power supplies: VCCINTfor core circuitry and VCCO for I/O interface. For the latestXilinx FPGAs, including Virtex-II Pro, Virtex-II and Spartan-3, a third auxiliary supply, VCCAUX may be needed. Inmost cases, VCCAUX can share a power supply with VCCO.The core voltages, VCCINT, for most Xilinx FPGAs, rangefrom 1.2V to 2.5V. Some mature products have 3V, 3.3Vor 5V core voltages. Table 1 shows the core voltagerequirement for most of the FPGA Device families. TypicalI/O voltages (VCCO) vary from 1.2V to 3.3V. The auxiliaryvoltage VCCAUX is 2.5V for Virtex-II Pro and Spartan-3, andis 3.3V for Virtex-II.
上傳時間： 2013-10-22
上傳用戶：liu999666
The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single Device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously.
上傳時間： 2013-11-01
上傳用戶：dingdingcandy
SRAM-based FPGAs are non-volatile Devices. Upon powerup, They are required to be programmed from an external source. This procedure allows anyone to easily monitor the bit-stream, and clone the Device. The problem then becomes how can you effectively protect your intellectual property from others in an architecture where the part is externally programmed?
上傳時間： 2013-11-06
上傳用戶：wl9454
a8259 可編程中斷控制 altera提供 The a8259 is designed to simplify the implementation of the interrupt interface in 8088 and 8086 based microcomputer systems. The Device is known as a programmable interrupt controller. The a8259 receives and prioritizes up to 8 interrupts, and in the cascade mode, this can be expanded up to 64 interrupts. An asynchronous reset and a clock input have been added to improve operation and reliability.
上傳時間： 2014-11-29
上傳用戶：zhyiroy
移動設備管理(Mobile Device Management)正是應對這種管理挑戰而產生的，確保所有連接到運營商網絡的移動設備能夠提供高質量的移動數據服務。移動設備管理提供了對2G、3G、WiMAX等移動設備的支持。OMA基于OTA(over-the-air)的設備管理框架為移動設備管理提供了一種解決方案，OMA DM協議明確獨立于承載網絡，因此該協議可以用于多種網絡，包括移動蜂窩網、藍牙、以太網、Wi-Fi、WiMAX等等，它橫跨2G、3G和WiMAX技術。
上傳時間： 2013-11-15
上傳用戶：yuchunhai1990
The field of microelectromechanical systems (MEMS), particularly micromachinedmechanical transducers, has been expanding over recent years, and the productioncosts of these Devices continue to fall. Using materials, fabrication processes, anddesign tools originally developed for the microelectronic circuits industry, newtypes of microengineered Device are evolving all the time—many offering numerousadvantages over their traditional counterparts. The electrical properties of siliconhave been well understood for many years, but it is the mechanical properties thathave been exploited in many examples of MEMS. This book may seem slightlyunusual in that it has four editors. However, since we all work together in this fieldwithin the School of Electronics and Computer Science at the University of Southampton,it seemed natural to work together on a project like this. MEMS are nowappearing as part of the syllabus for both undergraduate and postgraduate coursesat many universities, and we hope that this book will complement the teaching thatis taking place in this area.
上傳時間： 2013-10-16
上傳用戶：朗朗乾坤
多遠程二極管溫度傳感器-Design Considerations for pc thermal management Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and placement issues encountered when trying to place external sensors. PCB component count decreases when using a Device that provides multiple inputs.Better temperature sensing improves product performance and reliability. Disk drive data integrity suffers at elevated temperatures. IBM published an article stating that a 5°C rise in operating temperature causes a 15% increase in the drive’s failure rate. The overall performance of a system can be improved by providing a more accurate temperature measurement of the most critical Devices allowing them to run just a few degrees hotter.The LM83 directly senses its own temperature and the temperature of three external PN junctions. One is dedicated to the CPU of choice, the other two go to other parts of your system that need thermal monitoring such as the disk drive or graphics chip. The SMBus-compatible LM83 supports SMBus timeout and logic levels. The LM83 has two interrupt outputs; one for user-programmable limits and WATCHDOG capability (INT), the other is a Critical Temperature Alarm output (T_CRIT_A) for system power supply shutdown.
標簽： Considerat Design 遠程 二極管
上傳時間： 2014-12-21
上傳用戶：ljd123456
The Maxim Integrated 71M6541-DB REV 3.0 Demo Board is a demonstration board for evaluating the 71M6541 Device for single-phase electronic energy metering applications in conjunction with the Remote Sensor Inter-face. It incorporates a 71M6541 integrated circuit, a 71M6601 Remote Interface IC, peripheral circuitry such as a serial EEPROM, emulator port, and on-board power supply. A serial to USB converter allows communication to a PC through a USB port. The Demo Board allows the evaluation of the 71M6541 energy meter chip for measurement accuracy and overall system use.
上傳時間： 2013-11-06
上傳用戶：雨出驚人love
