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Flexible

  • 《器件封裝用戶向導》賽靈思產品封裝資料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be Flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    標簽: 封裝 器件 用戶 賽靈思

    上傳時間: 2013-10-22

    上傳用戶:ztj182002

  • xilinx Zynq-7000 EPP產品簡介

    The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a Flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously. 

    標簽: xilinx Zynq 7000 EPP

    上傳時間: 2013-11-01

    上傳用戶:dingdingcandy

  • LPC314x系列ARM微控制器用戶手冊

    The NXP LPC314x combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, Flexible external bus interface, three channel10-bit A/D, and a myriad of serial and parallel interfaces in a single chip targeted atconsumer, industrial, medical, and communication markets. To optimize system powerconsumption, the LPC314x have multiple power domains and a very Flexible ClockGeneration Unit (CGU) that provides dynamic clock gating and scaling.

    標簽: 314x LPC 314 ARM

    上傳時間: 2013-10-11

    上傳用戶:yuchunhai1990

  • LPC315x系列ARM微控制器用戶手冊

    The NXP LPC315x combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, Flexible external bus interface, an integratedaudio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallelinterfaces in a single chip targeted at consumer, industrial, medical, and communicationmarkets. To optimize system power consumption, the LPC315x have multiple powerdomains and a very Flexible Clock Generation Unit (CGU) that provides dynamic clockgating and scaling.The LPC315x is implemented as multi-chip module with two side-by-side dies, one fordigital fuctions and one for analog functions, which include a Power Supply Unit (PSU),audio codec, RTC, and Li-ion battery charger.

    標簽: 315x LPC 315 ARM

    上傳時間: 2014-01-17

    上傳用戶:Altman

  • 《器件封裝用戶向導》賽靈思產品封裝資料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be Flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    標簽: 封裝 器件 用戶 賽靈思

    上傳時間: 2013-11-21

    上傳用戶:不懂夜的黑

  • xilinx Zynq-7000 EPP產品簡介

    The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a Flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously. 

    標簽: xilinx Zynq 7000 EPP

    上傳時間: 2013-10-09

    上傳用戶:evil

  • FlexCompress is a high-speed compression library developed to provide archive functionality for your

    FlexCompress is a high-speed compression library developed to provide archive functionality for your applications. This solution provides Flexible compression and strong encryption algorithms that allows you to integrate archiving or backup features into your programs in a fast and easy way.

    標簽: functionality FlexCompress compression high-speed

    上傳時間: 2015-04-04

    上傳用戶:s363994250

  • Many many developers all over the net respect NASM for what i s - a widespread (thus netwide), port

    Many many developers all over the net respect NASM for what i s - a widespread (thus netwide), portable (thus netwide!), very Flexible and mature assembler tool with support for many output formats (thus netwide!!). Now we have good news for you: NASM is licensed under LGPL. This means its development is open to even wider society of programmers wishing to improve their lovely assembler. The NASM project is now situated at SourceForge.net, the most famous Open Source development center on The Net. Visit our development page at http://nasm.2y.net/ and our SF project at http://sf.net/projects/nasm/

    標簽: developers widespread netwide respect

    上傳時間: 2014-01-20

    上傳用戶:2404

  • A graphics toolkit, Graf_Tool() is developed which can be used to process and edit graphics. Label

    A graphics toolkit, Graf_Tool() is developed which can be used to process and edit graphics. Labels, lines and arrows can be added and the program is very Flexible and easy to use.

    標簽: graphics Graf_Tool developed toolkit

    上傳時間: 2014-01-22

    上傳用戶:huql11633

  • 關于NETFLOW信息分析的軟件。 is a netflow analyzer. It uses MySQL database to store accounting information. Fil

    關于NETFLOW信息分析的軟件。 is a netflow analyzer. It uses MySQL database to store accounting information. Filters, used in the JFlowAnalyzer, allows very Flexible classificate any kind of traffic and store it in the differend fields in database

    標簽: information accounting analyzer database

    上傳時間: 2014-01-27

    上傳用戶:kr770906

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