This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to HELP close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
This application note provides a detailed description of themetastable behavior in PLDs from both circuit and statisticalviewpoints. Additionally, the information on the metastablecharacteristics of Cypress PLDs presented here can HELP youachieve any desired degree of reliability.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to HELP
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
Abstract: The rapid build out of today's smart grid raises a number of security questions. In this article,we review two recent well-documented security breaches and a report of a security gap. These situationsinclude a 2009 smart-meter hack in Puerto Rico; a 2012 password discovery in grid distributionequipment; and insecure storage of a private key in distribution automation equipment. For each of theseattacks, we examine the breach, the potential threat, and secure silicon methods that, as part of acomplete security strategy, can HELP thwart the attacks.
Abstract: We don't expect manufacturers to produce clothes that in one size that fits everyone. In thesame way, one ESD component can't solve all issues—each application has different ESD requirements.Knowing that "one size fits all" cannot apply to power design, the power designer, or the engineering"super hero," must consider all the potential disruptions to a steady flow of power and thenvarious waysto mitigate them. This tutorial describes voltage- and current-limiting devices and risetime reducers tomanage the power. It also points to free and low-cost software tools to HELP design lowpass filters, checkcapacitor self-resonance, and simulate circuits.
現有基于MAX7219芯片的數碼管驅動電路只適用于小尺寸LED，為擴展其使用范圍，在介紹動態顯示芯片MAX7219功能的基礎上，提出了一個基于該芯片的8位高亮度8英寸數碼管驅動電路。電路保留了MAX7219芯片的功能強大、編程簡單等優點，通過74LS273鎖存器和ULN2803達林頓驅動器，實現了對任意大尺寸數碼管提供較高電壓和電流驅動的靜態顯示，并亮度可調。
Abstract:
The existing display-driving circuit based on MAX7219 was only applicable to small-size LED. To expand its use, based on the function introduction of dynamic display chip MAX7219, a display-driving circuit for high-brightness 8-bit LED with the size of 8-inch was proposed. The advantages of MAX7219 were retained, such as powerful function and simple programming. Static display with adjustable brightness for large-size LED with higher voltage and current was achieved with the HELP of 74LS273 and ULN2803.
為深入了解基于UC3854A控制的PFC變換器中的動力學特性，研究系統參數變化對變換器中分岔現象的影響，在建立Boost PFC變換器雙閉環數學模型的基礎上，用Matlab軟件對變換器中慢時標分岔及混沌等不穩定現象進行了仿真。在對PFC變換器中慢時標分岔現象仿真的基礎上，分析了系統參數變化對分岔點的影響，并進行了仿真驗證。仿真結果清晰地顯示了輸入整流電壓的幅值變化對系統分岔點的影響。
Abstract:
In order to better understand the dynamics characteristic of power factor correction converter based on UC3854A， and make the way that parameters change influences the bifurcation phenomena of the system clearly. The math model of the two closed loop circuits to the Boost PFC （Power Factor Correction） converter controller was built. Then， with the HELP of Matlab， the simulation for nonlinear phenomena such as chaos and slow-scale bifurcation in the PFC converter was made. Finally the factors that have influence to the phenomenon of bifurcation under slow-scale in PFC converter were analyzed. The simulation results clearly show the parameters change influences the bifurcation point of the system.
The C500 microcontroller family usually provides only one on-chip synchronous serialchannel (SSC). If a second SSC is required, an emulation of the missing interface mayHELP to avoid an external hardware solution with additional electronic components.The solution presented in this paper and in the attached source files emulates the mostimportant SSC functions by using optimized SW routines with a performance up to 25KBaud in Slave Mode with half duplex transmission and an overhead less than 60% atSAB C513 with 12 MHz. Due to the implementation in C this performance is not the limitof the chip. A pure implementation in assembler will result in a strong reduction of theCPU load and therefore increase the maximum speed of the interface. In addition,microcontrollers like the SAB C505 will speed up the interface by a factor of two becauseof an optimized architecture compared with the SAB C513.Moreover, this solution lays stress on using as few on-chip hardware resources aspossible. A more excessive consumption of those resources will result in a highermaximum speed of the emulated interface.Due to the restricted performance of an 8 bit microcontroller a pin compatible solution isprovided only; the internal register based programming interface is replaced by a set ofsubroutine calls.The attached source files also contain a test shell, which demonstrates how to exchangeinformation between an on-chip HW-SSC and the emulated SW-SSC via 5 external wiresin different operation modes. It is based on the SAB C513 (Siemens 8 bit microcontroller).A table with load measurements is presented to give an indication for the fraction of CPUperformance required by software for emulating the SSC.
