-
This application note shows how to write an Inter Integrated Circuit bus driver (I²C) for the Philips P90CL301micro-controller.It is not only an example of writing a driver, but it also includes a set of application interface software routines toquickly implement a complete I²C multi-master system application.For specific applications the user will have to make minimal changes in the driver program. Using the drivermeans linking modules to your application software and including a header-file into the application sourceprograms. A small example program of how to use the driver is listed.The driver supports i.a. polled or interrupt driven message handling, slave message transfers and multi-mastersystem applications. Furthermore, it is made suitable for use in conjunction with real time operating systems, likepSOS+.
標(biāo)簽：
routines
driver
P90
301
上傳時(shí)間：
2013-11-23
上傳用戶(hù)：weixiao99
-
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html
Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽：
UltraScale
Xilinx
架構(gòu)
上傳時(shí)間：
2013-11-13
上傳用戶(hù)：瓦力瓦力hong
-
As businesses and consumers expect more fromportable electronics, the FPGA industry has beencompelled to re-think how it serves these low-power,cost-sensitive markets. Application classes like
標(biāo)簽：
Artix
FPGA
功耗
上傳時(shí)間：
2013-11-10
上傳用戶(hù)：XLHrest
-
There is no doubt that remote controls are extremely popular and it has become very hard to imagine a world without them. They are used to control all manner of house appliances like the TV
set, the stereo, the VCR, and the satellite receiver.
標(biāo)簽：
紅外遙控
協(xié)議
英文
上傳時(shí)間：
2013-11-13
上傳用戶(hù)：頂?shù)弥?/p>
-
The field of microelectromechanical systems (MEMS), particularly micromachinedmechanical transducers, has been expanding over recent years, and the productioncosts of these devices continue to fall. Using materials, fabrication processes, anddesign tools originally developed for the microelectronic circuits industry, newtypes of microengineered device are evolving all the time—many offering numerousadvantages over their traditional counterparts. The electrical properties of siliconhave been well understood for many years, but it is the mechanical properties thathave been exploited in many examples of MEMS. This book may seem slightlyunusual in that it has four editors. However, since we all work together in this fieldwithin the School of Electronics and Computer Science at the University of Southampton,it seemed natural to work together on a project like this. MEMS are nowappearing as part of the syllabus for both undergraduate and postgraduate coursesat many universities, and we hope that this book will complement the teaching thatis taking place in this area.
標(biāo)簽：
MEMS
教材
上傳時(shí)間：
2013-10-16
上傳用戶(hù)：朗朗乾坤
-
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced development cost. Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements. For all these reasons the COM methodology has gained much popularity with OEMs in the embedded industry. COM Express® is an open industry standard for Computer-On-Modules. It is designed to be future proof and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage Differential Signaling) interfaces. These include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other hand.
標(biāo)簽：
PICMG_COM
COMe
上傳時(shí)間：
2013-11-05
上傳用戶(hù)：Wwill
-
The NCV7356 is a physical layer device for a single wire data linkcapable of operating with various Carrier Sense Multiple Accesswith Collision Resolution (CSMA/CR) protocols such as the BoschController Area Network (CAN) version 2.0. This serial data linknetwork is intended for use in applications where high data rate is notrequired and a lower data rate can achieve cost reductions in both thephysical media components and in the microprocessor and/ordedicated logic devices which use the network.The network shall be able to operate in either the normal data ratemode or a high-speed data download mode for assembly line andservice data transfer operations. The high-speed mode is onlyintended to be operational when the bus is attached to an off-boardservice node. This node shall provide temporary bus electrical loadswhich facilitate higher speed operation. Such temporary loads shouldbe removed when not performing download operations.The bit rate for normal communications is typically 33 kbit/s, forhigh-speed transmissions like described above a typical bit rate of83 kbit/s is recommended. The NCV7356 features undervoltagelockout, timeout for faulty blocked input signals, output blankingtime in case of bus ringing and a very low sleep mode current.
標(biāo)簽：
CANBUS
7356
NCV
單線
上傳時(shí)間：
2013-10-24
上傳用戶(hù)：s藍(lán)莓汁
-
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html
Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽：
UltraScale
Xilinx
架構(gòu)
上傳時(shí)間：
2013-11-21
上傳用戶(hù)：wxqman
-
As businesses and consumers expect more fromportable electronics, the FPGA industry has beencompelled to re-think how it serves these low-power,cost-sensitive markets. Application classes like
標(biāo)簽：
Artix
FPGA
功耗
上傳時(shí)間：
2013-11-08
上傳用戶(hù)：immanuel2006
-
We would like to welcome you as a user of the Allegro CX, a rugged, handheld fi eld PC for data collection. Developed with the input of data collection professionals worldwide, the Allegro CX is adaptable and versatile for use in a wide variety of data collection environments. The Allegro CX continues to utilize our ergonomic, lightweight design that is standard in our line of Allegro Field PCs. This design makes your Allegro easy to use for extended periods while moving to and from data collection sites in the fi eld.
標(biāo)簽：
allegro
manual
cx
教程
上傳時(shí)間：
2015-01-02
上傳用戶(hù)：zhangyi99104144
