亚洲欧美第一页_禁久久精品乱码_粉嫩av一区二区三区免费野_久草精品视频

蟲(chóng)蟲(chóng)首頁(yè)| 資源下載| 資源專(zhuān)輯| 精品軟件
登錄| 注冊(cè)

Layout

Layout,動(dòng)畫(huà)專(zhuān)用名稱(chēng),根據(jù)導(dǎo)演(或者其他人)所畫(huà)的分鏡表畫(huà)出來(lái)的“設(shè)計(jì)圖”,原畫(huà)要根據(jù)Layout來(lái)畫(huà)。Layout集成了分鏡頭的六要素:空間關(guān)系、鏡頭運(yùn)動(dòng)、鏡頭時(shí)間、分解動(dòng)作、臺(tái)詞、以及文字說(shuō)明。但是每一點(diǎn)都要做的更深入,更具體.
  • PADSLayout很好的參考資料

    Layout很好的參考資料

    標(biāo)簽: PADSLayout 參考資料

    上傳時(shí)間: 2014-12-24

    上傳用戶(hù):busterman

  • PADs Layout教程

    基礎(chǔ)的也很實(shí)用哦!

    標(biāo)簽: Layout PADs 教程

    上傳時(shí)間: 2013-10-17

    上傳用戶(hù):1037540470

  • PCB Layout指南

    一般規(guī)則 元器件放置 . 信號(hào)走線(xiàn) 電源 地線(xiàn) 晶振

    標(biāo)簽: Layout PCB

    上傳時(shí)間: 2013-10-18

    上傳用戶(hù):dvfeng

  • PCB Layout DIY封裝庫(kù)

    Altium Designer下的封裝庫(kù),整個(gè)庫(kù)都是項(xiàng)目的積累,所有元件都通過(guò)項(xiàng)目測(cè)試,可靠快捷。此刻上傳,奉獻(xiàn)給大家,希望能不讓更多的人受益。。。

    標(biāo)簽: Layout PCB DIY 封裝庫(kù)

    上傳時(shí)間: 2013-11-12

    上傳用戶(hù):tfyt

  • PCB設(shè)計(jì)者必看經(jīng)典教材

      在 PCB 設(shè)計(jì)中,布線(xiàn)是完成產(chǎn)品設(shè)計(jì)的重要步驟,可以說(shuō)前面的準(zhǔn)備工作都是為它而做的,  在整個(gè) PCB 中,以布線(xiàn)的設(shè)計(jì)過(guò)程限定最高,技巧最細(xì)、工作量最大。PCB 布線(xiàn)有單面布線(xiàn)、  雙面布線(xiàn)及多層布線(xiàn)。布線(xiàn)的方式也有兩種:自動(dòng)布線(xiàn)及交互式布線(xiàn),在自動(dòng)布線(xiàn)之前,  可以用交互式預(yù)先對(duì)要求比較嚴(yán)格的線(xiàn)進(jìn)行布線(xiàn),輸入端與輸出端的邊線(xiàn)應(yīng)避免相鄰平行,  以免產(chǎn)生反射干擾。必要時(shí)應(yīng)加地線(xiàn)隔離,兩相鄰層的布線(xiàn)要互相垂直,平行容易產(chǎn)生寄生耦合。 目  錄 高速 PCB 設(shè)計(jì)指南之一  高速 PCB 設(shè)計(jì)指南之二  PCB Layout指南(上)  PCB Layout指南(下)  PCB 設(shè)計(jì)的一般原則  PCB 設(shè)計(jì)基礎(chǔ)知識(shí)  PCB 設(shè)計(jì)基本概念  pcb 設(shè)計(jì)注意事項(xiàng)  PCB 設(shè)計(jì)幾點(diǎn)體會(huì)  PCB Layout 技術(shù)大全  PCB 和電子產(chǎn)品設(shè)計(jì)  PCB 電路版圖設(shè)計(jì)的常見(jiàn)問(wèn)題  PCB 設(shè)計(jì)中格點(diǎn)的設(shè)置  新手設(shè)計(jì) PCB 注意事項(xiàng)  怎樣做一塊好的 PCB 板  射頻電路 PCB 設(shè)計(jì)  設(shè)計(jì)技巧整理  用 PROTEL99 制作印刷電路版的基本流程  用 PROTEL99SE  布線(xiàn)的基本流程  蛇形走線(xiàn)有什么作用  封裝小知識(shí)  典型的焊盤(pán)直徑和最大導(dǎo)線(xiàn)寬度的關(guān)系  新手上路認(rèn)識(shí) PCB  新手上路認(rèn)識(shí) PCB< ;二>

    標(biāo)簽: PCB 教材

    上傳時(shí)間: 2014-04-18

    上傳用戶(hù):shizhanincc

  • 信號(hào)完整性知識(shí)基礎(chǔ)(pdf)

    現(xiàn)代的電子設(shè)計(jì)和芯片制造技術(shù)正在飛速發(fā)展,電子產(chǎn)品的復(fù)雜度、時(shí)鐘和總線(xiàn)頻率等等都呈快速上升趨勢(shì),但系統(tǒng)的電壓卻不斷在減小,所有的這一切加上產(chǎn)品投放市場(chǎng)的時(shí)間要求給設(shè)計(jì)師帶來(lái)了前所未有的巨大壓力。要想保證產(chǎn)品的一次性成功就必須能預(yù)見(jiàn)設(shè)計(jì)中可能出現(xiàn)的各種問(wèn)題,并及時(shí)給出合理的解決方案,對(duì)于高速的數(shù)字電路來(lái)說(shuō),最令人頭大的莫過(guò)于如何確保瞬時(shí)跳變的數(shù)字信號(hào)通過(guò)較長(zhǎng)的一段傳輸線(xiàn),還能完整地被接收,并保證良好的電磁兼容性,這就是目前頗受關(guān)注的信號(hào)完整性(SI)問(wèn)題。本章就是圍繞信號(hào)完整性的問(wèn)題,讓大家對(duì)高速電路有個(gè)基本的認(rèn)識(shí),并介紹一些相關(guān)的基本概念。 第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線(xiàn)理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線(xiàn)的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線(xiàn)的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線(xiàn)電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線(xiàn)的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線(xiàn)RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線(xiàn)規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1066.2 源同步時(shí)序系統(tǒng).......................................................................................1086.2.1 源同步系統(tǒng)的基本結(jié)構(gòu)...................................................................1096.2.2 源同步時(shí)序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來(lái)...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構(gòu)成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關(guān)工具及鏈接..............................................................................120第八章 高速設(shè)計(jì)理論在實(shí)際中的運(yùn)用.............................................................1228.1 疊層設(shè)計(jì)方案...........................................................................................1228.2 過(guò)孔對(duì)信號(hào)傳輸?shù)挠绊?..........................................................................1278.3 一般布局規(guī)則...........................................................................................1298.4 接地技術(shù)...................................................................................................1308.5 PCB 走線(xiàn)策略............................................................................................134

    標(biāo)簽: 信號(hào)完整性

    上傳時(shí)間: 2014-05-15

    上傳用戶(hù):dudu1210004

  • 高速PCB基礎(chǔ)理論及內(nèi)存仿真技術(shù)(經(jīng)典推薦)

    第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線(xiàn)理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線(xiàn)的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線(xiàn)的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線(xiàn)電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩:.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線(xiàn)的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線(xiàn)RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線(xiàn)規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問(wèn)題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線(xiàn)器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠0弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括:................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問(wèn)...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線(xiàn)分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分:HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問(wèn)題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線(xiàn)進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309

    標(biāo)簽: PCB 內(nèi)存 仿真技術(shù)

    上傳時(shí)間: 2014-04-18

    上傳用戶(hù):wpt

  • SM320 PCB Layout GUIDELINES

    Silicon Motion, Inc. has made best efforts to ensure that the information contained in this document is accurate andreliable. However, the information is subject to change without notice. No responsibility is assumed by SiliconMotion, Inc. for the use of this information, nor for infringements of patents or other rights of third parties.Copyright NoticeCopyright 2002, Silicon Motion, Inc. All rights reserved. No part of this publication may be reproduced, photocopied,or transmitted in any form, without the prior written consent of Silicon Motion, Inc. Silicon Motion, Inc. reserves theright to make changes to the product specification without reservation and without notice to our users

    標(biāo)簽: GUIDELINES Layout 320 PCB

    上傳時(shí)間: 2014-12-24

    上傳用戶(hù):zhaistone

  • 印刷電路板設(shè)計(jì)原則

    減小電磁干擾的印刷電路板設(shè)計(jì)原則 內(nèi) 容 摘要……1 1 背景…1 1.1 射頻源.1 1.2 表面貼裝芯片和通孔元器件.1 1.3 靜態(tài)引腳活動(dòng)引腳和輸入.1 1.4 基本回路……..2 1.4.1 回路和偶極子的對(duì)稱(chēng)性3 1.5 差模和共模…..3 2 電路板布局…4 2.1 電源和地…….4 2.1.1 感抗……4 2.1.2 兩層板和四層板4 2.1.3 單層板和二層板設(shè)計(jì)中的微處理器地.4 2.1.4 信號(hào)返回地……5 2.1.5 模擬數(shù)字和高壓…….5 2.1.6 模擬電源引腳和模擬參考電壓.5 2.1.7 四層板中電源平面因該怎么做和不應(yīng)該怎么做…….5 2.2 兩層板中的電源分配.6 2.2.1 單點(diǎn)和多點(diǎn)分配.6 2.2.2 星型分配6 2.2.3 格柵化地.7 2.2.4 旁路和鐵氧體磁珠……9 2.2.5 使噪聲靠近磁珠……..10 2.3 電路板分區(qū)…11 2.4 信號(hào)線(xiàn)……...12 2.4.1 容性和感性串?dāng)_……...12 2.4.2 天線(xiàn)因素和長(zhǎng)度規(guī)則...12 2.4.3 串聯(lián)終端傳輸線(xiàn)…..13 2.4.4 輸入阻抗匹配...13 2.5 電纜和接插件……...13 2.5.1 差模和共模噪聲……...14 2.5.2 串?dāng)_模型……..14 2.5.3 返回線(xiàn)路數(shù)目..14 2.5.4 對(duì)板外信號(hào)I/O的建議14 2.5.5 隔離噪聲和靜電放電ESD .14 2.6 其他布局問(wèn)題……...14 2.6.1 汽車(chē)和用戶(hù)應(yīng)用帶鍵盤(pán)和顯示器的前端面板印刷電路板...15 2.6.2 易感性布局…...15 3 屏蔽..16 3.1 工作原理…...16 3.2 屏蔽接地…...16 3.3 電纜和屏蔽旁路………………..16 4 總結(jié)…………………………………………17 5 參考文獻(xiàn)………………………17  

    標(biāo)簽: 印刷電路板 設(shè)計(jì)原則

    上傳時(shí)間: 2013-10-24

    上傳用戶(hù):18165383642

  • 開(kāi)關(guān)電源EMI設(shè)計(jì)(英文版)

    Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit Layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitLayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit Layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.

    標(biāo)簽: EMI 開(kāi)關(guān)電源 英文

    上傳時(shí)間: 2013-11-10

    上傳用戶(hù):1595690

主站蜘蛛池模板: 普兰店市| 阳谷县| 科尔| 章丘市| 江津市| 沙坪坝区| 德保县| 永泰县| 永安市| 绥棱县| 明光市| 绥棱县| 华亭县| 定襄县| 图片| 鄯善县| 昌乐县| 瑞丽市| 克山县| 永善县| 江阴市| 辽阳市| 利津县| 莱阳市| 邵阳市| 龙山县| 宝兴县| 德钦县| 绥宁县| 商丘市| 武义县| 商都县| SHOW| 永德县| 常宁市| 商都县| 松阳县| 京山县| 通渭县| 台北市| 澎湖县|