Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.
上傳時間： 2014-12-23
上傳用戶：han_zh
【摘要】本文結合作者多年的印制板設計經驗，著重印制板的電氣性能，從印制板穩定性、可靠性方面，來討論多層印制板設計的基本要求。【關鍵詞】印制電路板；表面貼裝器件；高密度互連；通孔【Key words】Printed Circuit Board；Surface Mounting Device；High Density Interface；Via一．概述印制板（PCB－Printed Circuit Board）也叫印制電路板、印刷電路板。多層印制板，就是指兩層以上的印制板，它是由幾層絕緣基板上的連接導線和裝配焊接電子元件用的焊盤組成，既具有導通各層線路，又具有相互間絕緣的作用。隨著SMT（表面安裝技術）的不斷發展，以及新一代SMD（表面安裝器件）的不斷推出，如QFP、QFN、CSP、BGA（特別是MBGA），使電子產品更加智能化、小型化，因而推動了PCB工業技術的重大改革和進步。自1991年IBM公司首先成功開發出高密度多層板（SLC）以來，各國各大集團也相繼開發出各種各樣的高密度互連（HDI）微孔板。這些加工技術的迅猛發展，促使了PCB的設計已逐漸向多層、高密度布線的方向發展。多層印制板以其設計靈活、穩定可靠的電氣性能和優越的經濟性能，現已廣泛應用于電子產品的生產制造中。下面，作者以多年設計印制板的經驗，著重印制板的電氣性能，結合工藝要求，從印制板穩定性、可靠性方面，來談談多層制板設計的基本要領。
上傳時間： 2013-11-19
上傳用戶：zczc
討論、研究高性能覆銅板對它所用的環氧樹脂的性能要求，應是立足整個產業鏈的角度去觀察、分析。特別應從HDI多層板發展對高性能CCL有哪些主要性能需求上著手研究。HDI多層板有哪些發展特點，它的發展趨勢如何——這都是我們所要研究的高性能CCL發展趨勢和重點的基本依據。而HDI多層板的技術發展，又是由它的應用市場——終端電子產品的發展所驅動（見圖1）。 圖1 在HDI多層板產業鏈中各類產品對下游產品的性能需求關系圖 1．HDI多層板發展特點對高性能覆銅板技術進步的影響1.1 HDI多層板的問世，對傳統PCB技術及其基板材料技術是一個嚴峻挑戰20世紀90年代初，出現新一代高密度互連（High Density Interconnection，簡稱為 HDI）印制電路板——積層法多層板（Build—Up Multiplayer printed board，簡稱為 BUM）的最早開發成果。它的問世是全世界幾十年的印制電路板技術發展歷程中的重大事件。積層法多層板即HDI多層板，至今仍是發展HDI的PCB的最好、最普遍的產品形式。在HDI多層板之上，將最新PCB尖端技術體現得淋漓盡致。HDI多層板產品結構具有三大突出的特征：“微孔、細線、薄層化”。其中“微孔”是它的結構特點中核心與靈魂。因此，現又將這類HDI多層板稱作為“微孔板”。HDI多層板已經歷了十幾年的發展歷程，但它在技術上仍充滿著朝氣蓬勃的活力，在市場上仍有著前程廣闊的空間。
上傳時間： 2013-11-22
上傳用戶：gundan
Abstract: There are differences between the operation of low-frequency AC transformers and electronic transformersthat supply current to MR16 lamps, and there are also differences in the current draw for MR16 halogen lamps andMR16 LED lamps. These contrasts typically prevent an MR16 LED lamp from operating with most electronictransformers. This article explains how a high-brightness (HB) LED driver optimized for MR16 lamps will allow LEDlamps to be compatible with most electronic transformers.A similar version of this article appeared on Display Plus, July 7, 2012 and in German in Elektronikpraxis, October 1,2012.
上傳時間： 2013-10-14
上傳用戶：playboys0
A light-emitting diode (LED) is a semiconductor device that emits narrow-spectrum incoherent light when forward-biased.The color of the emitted light depends on the chemical composition of the semiconductor material used, and can benear-ultraviolet, visible or infrared. LEDs are more prevalent today than ever before, replacing traditional incandescent andfluorescent bulbs in many lighting applications. Incandescents use a heated filament, are subject to breakage and burnoutand operate at a luminous efficiency of 2% to 4%. Fluorescents are more efficient, at 7% to 12%, but require highdrive voltage and contain mercury, a toxic substance that may be eventually banned in certain countries. LEDs, however,produce light directly through electroluminescence, operate at low voltage and can deliver over 20% luminous efficiency.
上傳時間： 2013-11-07
上傳用戶：xiaoyuer
Abstract: We don't expect manufacturers to produce clothes that in one size that fits everyone. In thesame way, one ESD component can't solve all issues—each application has different ESD requirements.Knowing that "one size fits all" cannot apply to power design, the power designer, or the engineering"super hero," must consider all the potential disruptions to a steady flow of power and thenvarious waysto mitigate them. This tutorial describes voltage- and current-limiting devices and risetime reducers tomanage the power. It also points to free and low-cost software tools to help design lowpass filters, checkcapacitor self-resonance, and simulate circuits.
上傳時間： 2013-11-18
上傳用戶：zhouxuepeng1
Abstract: This document details the Lakewood (MAXREFDES7#) subsystem reference design, a 3.3V input, ±12V (±15V) output, isolated power supply. The Lakewood reference design includes a 3W primary-side transformer H-bridge driver for isolated supplies, and two wide input range and adjustable output low-dropout linear regulators (LDOs). Test results and hardware files are included.
標簽： MAXREFDES Lakewood Isolated Output
上傳時間： 2013-11-02
上傳用戶：fengzimili
Abstract: This document details the Riverside (MAXREFDES8#) subsystem reference design, a 3.3V input, 12V (15V) output, isolated power supply. The Riverside reference design includes a 3W primary-side transformer H-bridge driver for isolated supplies, and one wide input range and adjustable output low-dropout linear regulator (LDO). Test results and hardware files are included.
標簽： Riverside MAXREFDES Isolated Output
上傳時間： 2013-11-16
上傳用戶：會稽劍客
Abstract: This document details the Oceanside (MAXREFDES9#) subsystem reference design, a 3.3V to 15V input,±15V (±12V) output, isolated power supply. The Oceanside design includes a high-efficiency step-up controller, a36V H-bridge transformer driver for isolated supplies, a wide input range, and adjustable output low-dropout linearregulator (LDO). Test results and hardware files are included.
上傳時間： 2013-10-12
上傳用戶：jinyao
Abstract: Some power architectures require the power supply sequencer (or system manager) to controldownstream power MOSFETs to allow power to flow into branch circuits. This application note explains howsystem power sequencing and level shifting can be accomplished using a low-voltage system manager
上傳時間： 2013-11-02
上傳用戶：wys0120
