Application note Jennic wifi Modules sensor wireless
標(biāo)簽： Application wireless Modules Jennic
上傳時(shí)間： 2014-01-24
上傳用戶：李彥東
GPRS無線模塊的開發(fā)工具，是源碼不是演示程序。-GPRS wireless Modules
標(biāo)簽： Gprs
上傳時(shí)間： 2013-05-17
上傳用戶：pscsmon
使用51單片機(jī)控制T35模塊收發(fā)短信及接聽撥打電話等-51 SCM control Modules using the send and receive text messages and recei
上傳時(shí)間： 2013-06-08
上傳用戶：417313137
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these Modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
標(biāo)簽： Modelling Guide Navy VHDL
上傳時(shí)間： 2014-12-23
上傳用戶：xinhaoshan2016
Maxim Analog Essentials are a series of plug-in peripheral Modules that allow engineers to quickly test, evaluate, and integrate Maxim components into their hardware/software designs. The Modules electrically and physically conform to the Digilent Pmod™ interface specification and are compatible with any Digilent Pmod-compatible header.
標(biāo)簽： 模擬技術(shù)
上傳時(shí)間： 2013-11-14
上傳用戶：ljj722
Advancements in board assembly, PCB layout anddigital IC integration have produced a new generationof densely populated, high performance systems. Theboard-mounted point-of-load (POL) DC/DC power suppliesin these systems are subject to the same demandingsize, high power and performance requirements asother subsystems. The rigorous new POL demands aredifficult to meet with traditional controller or regulatorICs, or power Modules.
上傳時(shí)間： 2014-12-24
上傳用戶：lbbyxmraon
Many complex systems—such as telecom equipment,memory Modules, optical systems, networking equipment,servers and base stations—use FPGAs and otherdigital ICs that require multiple voltage rails that muststart up and shut down in a specific order, otherwise theICs can be damaged. The LTC®2924 is a simple andcompact solution to power supply sequencing in a 16-pinSSOP package (see Figures 1 and 2).
上傳時(shí)間： 2013-10-29
上傳用戶：tonyshao
Avalanche photo diode (APD) receiver Modules arewidely used in fi ber optic communication systems. AnAPD module contains the APD and a signal conditioningamplifi er, but is not completely self contained. It stillrequires signifi cant support circuitry including a highvoltage, low noise power supply and a precision currentmonitor to indicate the signal strength. The challenge issqueezing this support circuitry into applications withlimited board space. The LT®3482 addresses this challengeby integrating a monolithic DC/DC step-up converter andan accurate current monitor. The LT3482 can supportup to a 90V APD bias voltage, and the current monitorprovides better than 10% accuracy over four decades ofdynamic range (250nA to 2.5mA).
上傳時(shí)間： 2014-01-18
上傳用戶：wenyuoo
The latest generation of Texas Instruments (TI) boardmountedpower Modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These Modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter Modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power Modules inboth through-hole and surface-mount packages. The surfacemountModules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
上傳時(shí)間： 2013-10-10
上傳用戶：1184599859
HIGH SPEED 8051 μC CORE - Pipe-lined Instruction Architecture; Executes 70% of Instructions in 1 or 2 System Clocks - Up to 25MIPS Throughput with 25MHz System Clock - 22 Vectored Interrupt Sources MEMORY - 4352 Bytes Internal Data RAM (256 + 4k) - 64k Bytes In-System Programmable FLASH Program Memory - External Parallel Data Memory Interface – up to 5Mbytes/sec DIGITAL PERIPHERALS - 64 Port I/O; All are 5V tolerant - Hardware SMBusTM (I2CTM Compatible), SPITM, and Two UART Serial Ports Available Concurrently - Programmable 16-bit Counter/Timer Array with 5 Capture/Compare Modules - 5 General Purpose 16-bit Counter/Timers - Dedicated Watch-Dog Timer; Bi-directional Reset CLOCK SOURCES - Internal Programmable Oscillator: 2-to-16MHz - External Oscillator: Crystal, RC, C, or Clock - Real-Time Clock Mode using Timer 3 or PCA SUPPLY VOLTAGE ........................ 2.7V to 3.6V - Typical Operating Current: 10mA @ 25MHz - Multiple Power Saving Sleep and Shutdown Modes 100-Pin TQFP (64-Pin Version Available) Temperature Range: –40°C to +85°C
標(biāo)簽： C8051F020
上傳時(shí)間： 2013-10-12
上傳用戶：lalalal
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