The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi- level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. T
標簽： mechanical polishing Chemical
上傳時間： 2020-06-06
上傳用戶：shancjb
stract With global drivers such as better energy consumption, energy efficiency and reduction of greenhouse gases, CO 2 emission reduction has become key in every layer of the value chain. Power Electronics has definitely a role to play in these thrilling challenges. From converters down to compound semiconductors, innovation is leading to breakthrough technologies. Wide BandGap, Power Module Packaging, growth of Electric Vehicle market will game change the overall power electronic industry and supply chain. In this presentation we will review power electronics trends, from technologies to markets.
標簽： Electronics Materials Power WBG for
上傳時間： 2020-06-07
上傳用戶：shancjb
adio Frequency Identification (RFID) is a rapidly developing automatic wireless data-collection technology with a long history.The first multi-bit functional passive RFID systems,with a range of several meters, appeared in the early 1970s, and continued to evolve through the 1980s. Recently, RFID has experienced a tremendous growth,due to developments in integrated circuits and radios, and due to increased interest from the retail industrial and government.
標簽： RFID-Enabled Sensors RFID and
上傳時間： 2020-06-08
上傳用戶：shancjb
Radio frequency identification (RFID) and Wireless sensor networks (WSN) are the two key wireless technologies that have diversified applications in the present and the upcoming systems in this area. RFID is a wireless automated recognition technology which is primarily used to recognize objects or to follow their posi- tion without providing any sign about the physical form of the substance. On the other hand, WSN not only offers information about the state of the substance and environment but also enables multi-hop wireless communications.
標簽： Architecture Integrated RFID-WSN
上傳時間： 2020-06-08
上傳用戶：shancjb
Recent work has shown that convolutional networks can be substantially deeper, more accurate, and efficient to train if they contain shorter connections between layers close to the input and those close to the output. In this paper, we embrace this observation and introduce the Dense Convo- lutional Network (DenseNet), which connects each layer to every other layer in a feed-forward fashion.
標簽： Convolutional Connected Networks Densely
上傳時間： 2020-06-10
上傳用戶：shancjb
? 如果 PCB 用排線連接，控制排線對應的插頭插座必須成直線，不交叉、不扭曲。 ? 連續的 40PIN 排針、排插必須隔開 2mm 以上。 ? 考慮信號流向，合理安排布局，使信號流向盡可能保持一致。 ? 輸入、輸出元件盡量遠離。 ? 電壓的元器件應盡量放在調試時手不易觸及的地方。 ? 驅動芯片應靠近連接器。 ? 有高頻連線的元件盡可能靠近，以減少高頻信號的分布參數和電磁干擾。 ? 對于同一功能或模組電路，分立元件靠近芯片放置。 ? 連接器根據實際情況必須盡量靠邊放置。 ? 開關電源盡量靠近輸入電源座。 ? BGA 等封裝的元器件不應放于 PCB 板正中間等易變形區 ? BGA 等陣列器件不能放在底面， PLCC 、 QFP 等器件不宜放在底層。 ? 多個電感近距離放置時應相互垂直以消除互感。 ? 元件的放置盡量做到模塊化并連線最短。 ? 在保證電氣性能的前提下，盡量按照均勻分布、重心平衡、版面美觀的標準優化布局。 ? 按電路模塊進行布局，實現同一功能的相關電路稱為一個模塊，電路模塊中的元件應采用就近集 中原則，同時數字電路和模擬電路分開； ? 定位孔、標準孔等非安裝孔周圍 1.27mm 內不得貼裝元、器件，螺釘等安裝孔周圍 緊固件安裝孔、橢圓孔及板中其它方孔外側距板邊的尺寸大于 3mm ； ? 發熱元件不能緊鄰導線和熱敏元件；高熱器件要均衡分布；
上傳時間： 2021-06-25
上傳用戶：xiangshuai
核心板說明（1）DDR模板：RK3288-LPDDR3P232SD6-V12-20140623HXS（2）適用的平臺：RK3288；（3）支持的DDR類型：LPDDR3_2PCS*32BIT（4）最大支持容量：4G（2PCS*32BIT）；（5）板層：6 Layer；（6）貼片方式：DDR器件單面貼,其它器件雙面貼；（7）面積：35mm*35mm；
上傳時間： 2022-02-02
上傳用戶：
PW4203 is a 4.5-22V input, 2A multi-cell synchronous Buck Li-Ion battery charger, suitable forportable application. Select pin is convenient for multi-cell charging. 800 kHz synchronous buckregulator integrates of 22V rating FETs with ultra low on- resistance to achieve high efficiency andsimple circuit design.The PW4203 is available in an 8-pin SOP package, provides a very compact system solution andgood thermal conductance
標簽： pw4203
上傳時間： 2022-02-11
上傳用戶：
ST提供適用于SLC的NFTL（NAND Flash Translation Layer）和FAT類文件系統來解決NAND Flash存儲的問題。
標簽： flash
上傳時間： 2022-02-21
上傳用戶：trh505
如果了解FAT的系統結構，并理解了FatSL的軟件結構，那么文件系統移植并不困難（其實文件系統移植都是大同小異的）。本文給出的例子是基于STEVAL-CCM007V1硬件平臺，通過NFTL層（NAND Flash Translation Layer）在NAND Flash上建立該文件系統的情況。
標簽： fatsl
上傳時間： 2022-02-21
上傳用戶：得之我幸78
