The PCA9672 provides general purpose remote I/O expansion for most microcontrollerfamilies via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plusfamily.The PCA9672 is a drop-in upgrade for the PCF8574 providing higher Fast-mode Plus(Fm+) I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWMdimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devicescan be on the bus without the need for bus buffers, higher total package sink capacity(200 mA versus 100 mA) that supports having all LEDs on at the same time and moredevice addresses (16 versus 8) are available to allow many more devices on the buswithout address conflicts.
標(biāo)簽: Remote expand 9672 PCA
上傳時(shí)間: 2013-10-23
上傳用戶(hù):jasonheung
The PCA9673 provides general purpose remote I/O expansion for most microcontrollerfamilies via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plusfamily.The PCA9673 is a drop in upgrade for the PCF8575 providing higher Fast-mode Plus(Fm+) I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWMdimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devicescan be on the bus without the need for bus buffers, higher total package sink capacity(400 mA versus 100 mA) that supports having all 25 mA LEDs on at the same time andmore device addresses (16 versus 8) are available to allow many more devices on the buswithout address conflicts.
標(biāo)簽: Remote expan 9673 PCA
上傳時(shí)間: 2013-10-29
上傳用戶(hù):wkchong
The PCA9674/74A is a drop-in upgrade for the PCF8574/74A providing higher Fast-modePlus I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWMdimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devicescan be on the bus without the need for bus buffers, higher total package sink capacity(200 mA versus 100 mA) that supports having all LEDs on at the same time and moredevice addresses (64 versus 8) are available to allow many more devices on the buswithout address conflicts.
標(biāo)簽: 9674 PCA Remote 9674A
上傳時(shí)間: 2013-10-22
上傳用戶(hù):wwwwwen5
中文版詳情瀏覽:http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽: UltraScale Xilinx 架構(gòu)
上傳時(shí)間: 2013-11-13
上傳用戶(hù):瓦力瓦力hong
Abstract: This application note discusses the development and deployment of 3G cellular femtocell base stations. The technicalchallenges for last-mile residential connectivity and adding system capacity in dense urban environments are discussed, with 3Gfemtocell base stations as a cost-effective solution. Maxim's 3GPP TS25.104-compliant transceiver solution is presented along withcomplete radio reference designs such as RD2550. For more information on the RD2550, see reference design 5364, "FemtocellRadio Reference Designs Using the MAX2550–MAX2553 Transceivers."
標(biāo)簽: Base-Station Applications Single-Chip Transceiver
上傳時(shí)間: 2013-11-07
上傳用戶(hù):songrui
NNS-701 是專(zhuān)為移動(dòng)裝置設(shè)計(jì)的全功能NFC (Near Field Communication)控制器芯片。
上傳時(shí)間: 2013-10-11
上傳用戶(hù):蠢蠢66
為滿(mǎn)足無(wú)線(xiàn)網(wǎng)絡(luò)技術(shù)具有低功耗、節(jié)點(diǎn)體積小、網(wǎng)絡(luò)容量大、網(wǎng)絡(luò)傳輸可靠等技術(shù)要求,設(shè)計(jì)了一種以MSP430單片機(jī)和CC2420射頻收發(fā)器組成的無(wú)線(xiàn)傳感節(jié)點(diǎn)。通過(guò)分析其節(jié)點(diǎn)組成,提出了ZigBee技術(shù)中的幾種網(wǎng)絡(luò)拓?fù)湫问剑⒀芯苛薢igBee路由算法。針對(duì)不同的傳輸要求形式選用不同的網(wǎng)絡(luò)拓?fù)湫问娇梢员M大可能地減少系統(tǒng)成本。同時(shí)針對(duì)不同網(wǎng)絡(luò)選用正確的ZigBee路由算法有效地減少了網(wǎng)絡(luò)能量消耗,提高了系統(tǒng)的可靠性。應(yīng)用試驗(yàn)表明,采用ZigBee方式通信可以提高傳輸速率且覆蓋范圍大,與傳統(tǒng)的有線(xiàn)通信方式相比可以節(jié)約40%左右的成本。 Abstract: To improve the proposed technical requirements such as low-ower, small nodes, large capacity and reliable network transmission, wireless sensor nodes based on MSP430 MCU and CC2420 RF transceiver were designed. This paper provided network topology of ZigBee technology by analysing the component of the nodes and researched ZigBee routing algorithm. Aiming at different requirements of transmission mode to choose the different network topologies form can most likely reduce the system cost. And aiming at different network to choose the correct ZigBee routing algorithm can effectively reduced the network energy consumption and improved the reliability of the system. Results show that the communication which used ZigBee mode can improve the transmission rate, cover more area and reduce 40% cost compared with traditional wired communications mode.
標(biāo)簽: ZigBee 無(wú)線(xiàn)傳感網(wǎng)絡(luò) 協(xié)議研究 路由
上傳時(shí)間: 2013-10-09
上傳用戶(hù):robter
中文版詳情瀏覽:http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽: UltraScale Xilinx 架構(gòu)
上傳時(shí)間: 2013-11-21
上傳用戶(hù):wxqman
Abstract: This application note discusses the development and deployment of 3G cellular femtocell base stations. The technicalchallenges for last-mile residential connectivity and adding system capacity in dense urban environments are discussed, with 3Gfemtocell base stations as a cost-effective solution. Maxim's 3GPP TS25.104-compliant transceiver solution is presented along withcomplete radio reference designs such as RD2550. For more information on the RD2550, see reference design 5364, "FemtocellRadio Reference Designs Using the MAX2550–MAX2553 Transceivers."
標(biāo)簽: Base-Station Applications Single-Chip Transceiver
上傳時(shí)間: 2013-11-05
上傳用戶(hù):超凡大師
這是一篇關(guān)于turbo碼的原始論文,Near optimum error correcting cod ing and decoding turbo codes,可供學(xué)習(xí)參考之用。
上傳時(shí)間: 2014-01-24
上傳用戶(hù):pkkkkp
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