Although Stellaris microcontrollers have generous internal SRAM capabilities, certain applicationsmay have data storage requirements that exceed the 8 KB limit of the Stellaris LM3S8xx seriesdevices. Since microcontrollers do not have an external parallel data-bus, serial memory optionsmust be considered. Until recently, the ubiquitous serial EEPROM/flash device was the only serialmemory solution. The major limitations of EEPROM and flash technology are slow write speed, slowerase times, and limited write/erase endurance.Recently, serial SRAM devices have become available as a solution for high-speed dataapplications. The N256S08xxHDA series of devices, from AMI Semiconductor, offer 32 K x 8 bits oflow-power data storage, a fast Serial Peripheral Interface (SPI) serial bus, and unlimited write cycles.The parts are available in 8-pin SOIC and compact TSSOP Packages.
標(biāo)簽： Adding Serial SRAM 32
上傳時間： 2013-10-14
上傳用戶：cxl274287265
The MC68HC05K0 is a low cost, low pin countsingle chip microcomputer with 504 bytes of userROM and 32 bytes of RAM. The MC68HC05K0 isa member of the 68HC05K series of devices whichare available in 16-pin DIL or SOIC Packages.It uses the same CPU as the other devices in the68HC05 family and has the same instructions andregisters. Additionally, the device has a 15-stagemulti-function timer and 10 general purposebi-directional I/0 lines. A mask option is availablefor software programmable pull-downs on all ofthe I/O pins and four of the pins are capable ofgenerating interrupts.The device is ideally suited for remote-controlkeyboard applications because the pull-downs andthe interrupt drivers on the port pins allowkeyboards to be built without any externalcomponents except the keys themselves. There isno need for external pull-up or pull-down resistors,or diodes for wired-OR interrupts, as these featuresare already designed into the device.
標(biāo)簽： Infra-red Remote Cont 05K
上傳時間： 2014-01-24
上傳用戶：zl5712176
Introduction to Xilinx Packaging Electronic Packages are interconnectable housings for semiconductor devices. The major functions of the electronic Packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor Packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic Packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,Packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
Abstract: Standard PCB design and mounting processes can adversely influence MEMS inertial sensors.This application note contains guidelines for the layout, soldering, and mounting of MEMS inertialsensors in LGA Packages in order to reduce stresses and improve functionality.
上傳時間： 2014-01-15
上傳用戶：sjb555
使用Nios II軟件構(gòu)建工具 This chapter describes the Nios® II Software Build Tools (SBT), a set of utilities and scripts that creates and builds embedded C/C++ application projects, user library projects, and board support Packages (BSPs). The Nios II SBT supports a repeatable, scriptable, and archivable process for creating your software product. You can invoke the Nios II SBT through either of the following user interfaces: ■ The Eclipse™ GUI ■ The Nios II Command Shell The purpose of this chapter is to make you familiar with the internal functionality of the Nios II SBT, independent of the user interface employed.
上傳時間： 2013-10-12
上傳用戶：china97wan
Introduction to Xilinx Packaging Electronic Packages are interconnectable housings for semiconductor devices. The major functions of the electronic Packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor Packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic Packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,Packages must be reliable and cost effective.
上傳時間： 2013-11-21
上傳用戶：不懂夜的黑
SL811開發(fā)資料_包含源程序_電路圖_芯片資料:SL811HS Embedded USB Host/Slave Controller.The SL811HS is an Embedded USB Host/Slave Controller capable of communicate with either full-speed or low-speed USB peripherals. The SL811HS can interface to devices such as microprocessors, microcontrollers, DSPs, or directly to a variety of buses such as ISA, PCMCIA, and others. The SL811HS USB Host Controller conforms to USB Specification 1.1.The SL811HS USB Host/Slave Controller incorporates USB Serial Interface functionality along with internal full-/low-speed transceivers.The SL811HS supports and operates in USB full-speed mode at 12 Mbps, or at low-speed 1.5-Mbps mode.The SL811HS data port and microprocessor interface provide an 8-bit data path I/O or DMA bidirectional, with interrupt support to allow easy interface to standard microprocessors or microcontrollers such as Motorola or Intel CPUs and many others. Internally,the SL811HS contains a 256-byte RAM data buffer which is used for control registers and data buffer.The available package types offered are a 28-pin PLCC (SL811HS) and a 48-pin TQFP package (SL811HST-AC). Both Packages operate at 3.3 VDC. The I/O interface logic is 5V-tolerant.
上傳時間： 2013-12-22
上傳用戶：a82531317
項目描述: Fink is an attempt to bring the full world of Unix Open Source software to Darwin and Mac OS X. Packages are downloaded and built automatically and installed into a tree managed by dpkg. Fink試圖將Unix開源軟件世界帶入到 Darwin 和Mac OS X。工具包可以被下載和自動生成，并安裝到由dpkg管理的樹狀結(jié)構(gòu)中。 來源: http://sourceforge.net/projects/fink/
標(biāo)簽： software attempt Darwin Source
上傳時間： 2015-04-17
上傳用戶：tedo811
JabberX 是一個基于unix平臺的jabber客戶端 JabberX is a unix console Jabber client. Jabber is a cross-platform, open source, XML-based, distributed instant messaging system. Requirements: ------------- Iksemel library (from http://jabber-x.sourceforge.net) NCurses or S-Lang package. Autoconf and Automake Packages are required for compiling from cvs. Perl is required for building perl scripting support.
標(biāo)簽： JabberX Jabber unix cross-platform
上傳時間： 2013-12-18
上傳用戶：wfeel
NORTi3 is a realtime multitasking operating system conforming to the micro-ITRON 3.0 specification. NORTi3 is divided into two Packages: NORTi3 Standard and NORTi3 Extended. The product NORTi3 Extended has implemented all the system calls of level E placed as "added and extended functions” in the micro-ITRON specification as well as the system calls equivalent to level X.
標(biāo)簽： specification multitasking micro-ITRON conforming
上傳時間： 2014-01-14
上傳用戶：saharawalker
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