Program for : 1) ZOOMING , 2) SHRINKING & 3) GRAY LEVEL RESOLUTION
標簽： SHRINKING Program ZOOMING for
上傳時間： 2013-12-18
上傳用戶：zhangyi99104144
Piezoelectric motors are used in digital cameras for autofocus,zooming and optical image stabilization. Theyare relatively small, lightweight and effi cient, but theyalso require a complicated driving scheme. Traditionally,this challenge has been met with the use ofseparatecircuits, including a step-up converter and an oversizedgeneric full-bridge drive IC. The resulting high componentcount and large board space are especially problematicin the design of cameras for ever SHRINKING cell phones.The LT®3572 solves these problems by combining astep-up regulator and a dual full-bridge driver in a 4mm× 4mm QFN package. Figure 1 shows a typical LT3572Piezo motor drive circuit. A step-up converter is usedto generate 30V from a low voltage power source suchas a Li-Ion battery or any input power source within thepart’s wide input voltage range of 2.7V to 10V. The highoutput voltage of the step-up converter, adjustable upto 40V, is available for the drivers at the VOUT pin. Thedrivers operate in a full-bridge fashion, where the OUTAand OUTB pins are the same polarity as the PWMA andPWMB pins, respectively, and the OUTA and OUTB pinsare inverted from PWMA and PWMB, respectively. Thestep-up converter and both Piezo drivers have their ownshutdown control. Figure 2 shows a typical layout
上傳時間： 2013-11-18
上傳用戶：hulee
IntroductionAs chip designers pack more functions into ICs,pin counts continue to grow and the space betweenpins keeps SHRINKING. Pin spacings of 0.5 mm and0.65 mm are not at all uncommon. The power ofthese new ICs is wonderful, to be sure, but trou-bleshooting them can be a chore because connect-ing scopes and logic analyzers has become muchmore difficult and less dependable.
標簽： Agilent Probing Wedge High
上傳時間： 2013-10-22
上傳用戶：蔣清華嗯
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly SHRINKING, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly SHRINKING, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-11-21
上傳用戶：不懂夜的黑
