資料說明介紹
PCB Translator_CAMCAD轉(zhuǎn)換器3.95版本，里面含CAMCAD_3.9.5a_crack文件，可以對(duì)軟件進(jìn)行破解 （需要安裝PCB Translator后才能進(jìn)行破解）
針對(duì)PCB設(shè)計(jì)文件的RSI轉(zhuǎn)換器能夠轉(zhuǎn)換PCB設(shè)計(jì)和生產(chǎn)所需要的所有信息。它們包括：庫，布置位置，插入屬性信息，網(wǎng)表，走線，文字和銅箔，以及其它相關(guān)的項(xiàng)目。不需要執(zhí)行"導(dǎo)入Gerber"和"交叉參考"就可以完成所有這些工作。事實(shí)上，根本不需要定義參考，因?yàn)檐浖梢詮脑嘉募袷街刑崛〕鯟AD數(shù)據(jù)，并把它直接輸出到新的文件格式中。只需要注意CAD系統(tǒng)本身的限制就可以了。
CAMCAD PCB 轉(zhuǎn)換器
CAMCAD PCB 轉(zhuǎn)換器是一個(gè)功能完善的PCB CAD 轉(zhuǎn)換器，圖形用戶界面也很淺顯易懂。CAMCAD PCB 轉(zhuǎn)換器支持大多數(shù)流行的CAD格式，比如Cadence Allegro, Orcad, Mentor and Accel EDA,也支持工業(yè)標(biāo)準(zhǔn)格式，比如GenCAM, GenCAD, and IPC-D-356.CAMCAD PCB 轉(zhuǎn)換器允許導(dǎo)入CAD文件到CAMCAD圖形用戶環(huán)境中，校驗(yàn)數(shù)據(jù)，修改數(shù)據(jù)，然后可以把數(shù)據(jù)導(dǎo)出為任意格式的文件。這些特性意味著用戶可以完全控制所有的事情，比如層的轉(zhuǎn)換，也能解決CAD格式之間不兼容的問題。
一個(gè)案例,如果要轉(zhuǎn)換Cadence Allegro文件到PADS,所有必須的設(shè)計(jì)信息都會(huì)包含在新的文件中。不過，Cadence Allegro允許板子上的銅箔重疊，PADS卻不允許。Allegro 文件可以正常導(dǎo)入到CAMCAD。如果要立即把這個(gè)文件導(dǎo)出到PADS，程序會(huì)有錯(cuò)誤提示。這時(shí)，可以使用CAMCAD的數(shù)據(jù)處理特性來改變有問題的銅箔，解決問題后再導(dǎo)出到PADS。
下面的矩陣表格，列出了CAMCAD PCB 轉(zhuǎn)換器所支持的當(dāng)前PCB的轉(zhuǎn)換組合。Import Modules 一列中列出了可以被導(dǎo)入（讀取）的所有ECAD文件格式。Export Modules一行中列出了可以被導(dǎo)出（寫）的文件格式。在這個(gè)矩陣中的任意輸入和輸出模塊組合轉(zhuǎn)換都是可行的。當(dāng)然，沒有任何ECAD到ECAD的轉(zhuǎn)換器是絕對(duì)完美的。由于ECAD layout系統(tǒng)有自己獨(dú)特的特性，而這些可能不能直接轉(zhuǎn)換到另一個(gè)有自己獨(dú)特特性的ECAD系統(tǒng)中。
CAMCAD PCB 轉(zhuǎn)換器支持的組合
建議配置：Windows 2000 或者 XP Professional，800 MHZ 處理器，512MB RAM 17"顯示器，1024×768分辨率
Copyright 2004 Router Solutions Incorporated
RSI Reserves the right to make changes to its specifications and products without prior notice.
CAMCAD is a registered trademark of Router Solutions Incorporated. All rights reserved.
RSI recognizes other brand and product names as trademarks or registered trademarks of their respective holders.
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html
Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity Solutions.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip Solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells called complexprogrammable logic devices (CPLDs)or they can be high-density devicesbased on SRAM look-up tables (LUTs)
Designing withProgrammable Logicin an Analog WorldProgrammable logic devicesrevolutionized digital design over 25years ago, promising designers a blankchip to design literally any functionand program it in the field. PLDs canbe low-logic density devices that usenonvolatile sea-of-gates cells calledcomplex programmable logic devices(CPLDs) or they can be high-densitydevices based on SRAM look-up tables
This application note contains a reference design consisting of HDL IP and Xilinx AdvancedConfiguration Environment (ACE) software utilities that give designers great flexibility increating in-system programming (ISP) Solutions. In-system programming support allowsdesigners to revise existing designs, package the new bitstream programming files with theprovided software utilities, and update the remote system through the JTAG interface using theEmbedded JTAG ACE Player.
The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new Solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously.
解壓密碼：www.elecfans.com 隨著微電子技術(shù)的迅速發(fā)展以及集成電路規(guī)模不斷提高，對(duì)電路性能的設(shè)計(jì)
要求越來越嚴(yán)格，這勢(shì)必對(duì)用于大規(guī)模集成電路設(shè)計(jì)的EDA 工具提出越來越高的
要求。自1972 年美國加利福尼亞大學(xué)柏克萊分校電機(jī)工程和計(jì)算機(jī)科學(xué)系開發(fā)
的用于集成電路性能分析的電路模擬程序SPICE（Simulation Program with IC
Emphasis）誕生以來，為適應(yīng)現(xiàn)代微電子工業(yè)的發(fā)展，各種用于集成電路設(shè)計(jì)的
電路模擬分析工具不斷涌現(xiàn)。HSPICE 是Meta-Software 公司為集成電路設(shè)計(jì)中
的穩(wěn)態(tài)分析，瞬態(tài)分析和頻域分析等電路性能的模擬分析而開發(fā)的一個(gè)商業(yè)化通
用電路模擬程序，它在柏克萊的SPICE（1972 年推出），MicroSim公司的PSPICE
（1984 年推出）以及其它電路分析軟件的基礎(chǔ)上，又加入了一些新的功能，經(jīng)
過不斷的改進(jìn)，目前已被許多公司、大學(xué)和研究開發(fā)機(jī)構(gòu)廣泛應(yīng)用。HSPICE 可
與許多主要的EDA 設(shè)計(jì)工具，諸如Candence,Workview 等兼容，能提供許多重要
的針對(duì)集成電路性能的電路仿真和設(shè)計(jì)結(jié)果。采用HSPICE 軟件可以在直流到高
于100MHz 的微波頻率范圍內(nèi)對(duì)電路作精確的仿真、分析和優(yōu)化。在實(shí)際應(yīng)用中，
HSPICE能提供關(guān)鍵性的電路模擬和設(shè)計(jì)方案，并且應(yīng)用HSPICE進(jìn)行電路模擬時(shí)，
其電路規(guī)模僅取決于用戶計(jì)算機(jī)的實(shí)際存儲(chǔ)器容量。
The HSPICE Integrator Program enables qualified EDA vendors to integrate their products with the de facto standard HSPICE simulator, HSPICE RF simulator, and WaveView Analyzer™. In addition, qualified HSPICE Integrator Program members have access to HSPICE integrator application programming interfaces (APIs). Collaboration between HSPICE Integrator Program members will enable customers to achieve more thorough design verification in a shorter period of time from the improvements offered by inter-company EDA design Solutions.
The revolution of automation on factory floors is a key driver for the seemingly insatiable demand for higher productivity， lower total cost of ownership，and high safety. As a result， industrial applications drive an insatiable demand of higher data bandwidth and higher system-level performance.
This white paper describes the trends and challenges seen by designers and how FPGAs enable Solutions to meet their stringent design goals.
Abstract: As industrial control systems (ICSs) have become increasingly connected and use more off-the-shelfcomponents, new vulnerabilities to cyber attacks have emerged. This tutorial looks at three types of ICSs:programmable logic controllers (PLCs), supervisory control and data acquisition (SCADA) systems, anddistributed control systems (DCSs), and then discusses security issues and remedies. This document alsoexplains the benefits and limitations of two cryptographic Solutions (digital signatures and encryption) andelaborates on the reasons for using security ICs in an ICS to support cryptography.
