Abstract: This application note describes how to improve the Speed of modular exponentiation by more than 50% whenusing MAXQ® microcontrollers that have a modular arithmetic accelerator (MAA).
標(biāo)簽： 如何提高 模冪運(yùn)算 應(yīng)用筆記 速度
上傳時(shí)間： 2013-11-17
上傳用戶：s363994250
Recent advances in low voltage silicon germaniumand BiCMOS processes have allowed the design andproduction of very high Speed amplifi ers. Because theprocesses are low voltage, most of the amplifi er designshave incorporated differential inputs and outputs to regainand maximize total output signal swing. Since many lowvoltageapplications are single-ended, the questions arise,“How can I use a differential I/O amplifi er in a single-endedapplication?” and “What are the implications of suchuse?” This Design Note addresses some of the practicalimplications and demonstrates specifi c single-endedapplications using the 3GHz gain-bandwidth LTC6406differential I/O amplifi er.
標(biāo)簽： 單端應(yīng)用 差分 放大器
上傳時(shí)間： 2013-11-23
上傳用戶：rocketrevenge
A complete design for a data acquisition card for the IBM PC is detailed in this application note. Additionally, C language code is provided to allow sampling of data at Speed of more than 20kHz. The Speed limitation is strictly based on the execution Speed of the "C" data acquisition loop. A "Turbo" XT can acquire data at Speeds greater than 20kHz. Machines with 80286 and 80386 processors can go faster than 20kHz. The computer that was used as a test bed in this application was an XT running at 4.77MHz and therefore all system timing and acquisition time measurements are based on a 4.77MHz clock Speed.
標(biāo)簽： 1099 LTC 數(shù)據(jù) 采集板
上傳時(shí)間： 2013-10-29
上傳用戶：BOBOniu
前面討論了很多內(nèi)容，基本上涉及了有關(guān)PCB板的絕大部分相關(guān)的知識。第二章探討了傳輸線的基本原理，第三章探討了串?dāng)_，在第四章里我們闡述了許多在現(xiàn)代設(shè)計(jì)中必須關(guān)注的非理想互連的問題。對于信號從驅(qū)動(dòng)端引腳到接收端引腳的電氣路徑的相關(guān)問題，我們已經(jīng)做了一些探究，然而對于硅芯片，即處于封裝內(nèi)部的IC來說，其信號傳輸通常要通過過孔和連接器來進(jìn)行，對這樣的情況我們該如何處理？在本章中，我們將通過對封裝、過孔和連接器的研究，闡述其原理，從而指導(dǎo)大家在設(shè)計(jì)的時(shí)候?qū)φ麄€(gè)電氣路徑進(jìn)行完整地分析，即從驅(qū)動(dòng)端內(nèi)部IC芯片的焊盤到接受器IC芯片的焊盤。
標(biāo)簽： High-Speed Digital System desi
上傳時(shí)間： 2013-11-24
上傳用戶：maizezhen
高速數(shù)字系統(tǒng)設(shè)計(jì)下載pdf:High-Speed Digital SystemDesign—A Handbook ofInterconnect Theory and DesignPracticesStephen H. HallGarrett W. HallJames A. McCallA Wiley-Interscience Publication JOHN WILEY & SONS, INC.New York • Chichester • Weinheim • Brisbane • Singapore • TorontoCopyright © 2000 by John Wiley & Sons, Inc.Speeddigital systems at the platform level. The book walks the reader through everyrequired concept, from basic transmission line theory to digital timing analysis, high-Speedmeasurement techniques, as well as many other topics. In doing so, a unique balancebetween theory and practical applications is achieved that will allow the reader not only tounderstand the nature of the problem, but also provide practical guidance to the solution.The level of theoretical understanding is such that the reader will be equipped to see beyondthe immediate practical application and solve problems not contained within these pages.Much of the information in this book has not been needed in past digital designs but isabsolutely necessary today. Most of the information covered here is not covered in standardcollege curricula, at least not in its focus on digital design, which is arguably one of the mostsignificant industries in electrical engineering.The focus of this book is on the design of robust high-volume, high-Speed digital productssuch as computer systems, with particular attention paid to computer busses. However, thetheory presented is applicable to any high-Speed digital system. All of the techniquescovered in this book have been applied in industry to actual digital products that have beensuccessfully produced and sold in high volume.Practicing engineers and graduate and undergraduate students who have completed basicelectromagnetic or microwave design classes are equipped to fully comprehend the theorypresented in this book. At a practical level, however, basic circuit theory is all thebackground required to apply the formulas in this book.
標(biāo)簽： 高速數(shù)字 系統(tǒng)設(shè)計(jì)
上傳時(shí)間： 2013-10-26
上傳用戶：縹緲
Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-Speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.
標(biāo)簽： Rogers Radio John Freq
上傳時(shí)間： 2014-12-23
上傳用戶：han_zh
介紹高速電路的設(shè)計(jì)
標(biāo)簽： High-Speed Digital Design 高速數(shù)字
上傳時(shí)間： 2013-10-16
上傳用戶：yt1993410
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-Speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
標(biāo)簽： pci PCB 設(shè)計(jì)規(guī)范
上傳時(shí)間： 2013-10-15
上傳用戶：busterman
Abstract: This application note details a step-by-step design process for the MAX16833 high-voltagehigh-brightness LED driver. This process can Speed up prototyping and increase the chance for firstpass
上傳時(shí)間： 2013-10-09
上傳用戶：tianjinfan
Speed and accuracy don’t always go hand-in-handin DC/DC converter systems—that is, until now. TheLTC3811 is a dual output, fi xed frequency current modeDC/DC switching regulator controller designed for one oftoday’s most demanding power supply applications: highcurrent, low voltage processor core supplies.
上傳時(shí)間： 2013-11-21
上傳用戶：aix008
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