使用新電源模塊改進表面貼裝可制造性
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufactur...
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufactur...
摘要:采用表面組裝技術(shù)(surface mountt echnology,SMT)進行印制板級電子電路組裝是當(dāng)代組裝技術(shù)發(fā)展的主流。典型的SMT生產(chǎn)線是由高速機和多功能機串聯(lián)而成,印制電路板(printed circuit board,PCB)上的元器件在貼片機之間的負荷均衡優(yōu)化問題是SMT生產(chǎn)調(diào)度...
表面貼片膠(SMA,surface mount adhesives)用于波峰焊接和回流焊接,以保持組件在印刷電路板(PCB)上的位置,確保在裝配線上傳送過程中組件不會丟失。PCB裝配中使用的大多數(shù)表面貼片膠(SMA)都是環(huán)氧樹脂(epoxies),雖然還有聚丙烯(acrylics)用于特殊的用途。在...
【摘要】本文結(jié)合作者多年的印制板設(shè)計經(jīng)驗,著重印制板的電氣性能,從印制板穩(wěn)定性、可靠性方面,來討論多層印制板設(shè)計的基本要求。【關(guān)鍵詞】印制電路板;表面貼裝器件;高密度互連;通孔【Key words】Printed Circuit Board;Surface Mounting Device;High ...
Calculation of the Differential Impedance of Tracks on FR4 substrates There is a discrepancy between calculated and measured values of impedance for d...