-
Abstract: Most magnetic read head data sheets do not fully specify the frequency-dependent components andare often vague when specifying other key parameters. In some cases, the specifications of two very similarheads from two different manufacturers might be quite different in TERMS of parameters specified and omitted.The limitations in the data sheets make designing an optimum card reading system unnecessarily difficult andtime consuming. This document outlines a strategy to overcome the above shortcomings and offers guidelinesto overcome the noise issues.
標(biāo)簽：
MCR
噪聲環(huán)境
磁卡讀寫器
上傳時(shí)間：
2013-11-13
上傳用戶：dysyase
-
A MEMS microphone IC is unique among Analog Devices, Inc., products in that its input is an acoustic pressure wave. For this reason, some specifications included in the data sheets for these parts may not be familiar, or familiar specifications may be applied in unfamiliar ways. This application note explains the specifica-tions and TERMS found in MEMS microphone data sheets so that the microphone can be appropriately designed into a system.
標(biāo)簽：
MEMS
麥克風(fēng)
系統(tǒng)設(shè)計(jì)
效率
上傳時(shí)間：
2013-10-31
上傳用戶：masochism
-
Who has never experienced oscillations issues when using an operational amplifier? Opampsare often used in a simple voltage follower configuration. However, this is not the bestconfiguration in TERMS of capacitive loading and potential risk of oscillations.Capacitive loads have a big impact on the stability of operational amplifier-basedapplications. Several compensation methods exist to stabilize a standard op-amp. Thisapplication note describes the most common ones, which can be used in most cases.The general theory of each compensation method is explained, and based on this, specific
標(biāo)簽：
半導(dǎo)體
運(yùn)放
穩(wěn)定性
上傳時(shí)間：
2013-10-28
上傳用戶：chenbhdt
-
TCS ECN Background & Key TERMSTrust Issues with PCIe PlatformsTCS ECN DetailsTrusted Config Space and TCS TransactionsTrusted Config Access Mech (TCAM)Standard vs Trusted Config AccessNew Capability StructuresTCS Support in Root Ports, Switches, & BridgesTCS “Does not…” ListExample Trusted Computing PlatformRevisiting the Trust IssuesKey Takeaways/Call to ActionQuestions
標(biāo)簽：
Configuration
Trusted
PCIe
Spa
上傳時(shí)間：
2013-11-21
上傳用戶：hsfei8
-
PCB LAYOUT 術(shù)語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數(shù)零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設(shè)計(jì)之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設(shè)計(jì)之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：?jiǎn)巍㈦p層板之各層線路；多層板之上、下兩層線路及內(nèi)層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內(nèi)層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範(fàn)圍，不與零件腳相接。10. THERMAL PAD：多層板內(nèi)NEGATIVE LAYER 上必須零件腳時(shí)所使用之PAD，一般稱為散熱孔或?qū)住?1. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應(yīng)相同。12. Moat : 不同信號(hào)的 Power& GND plane 之間的分隔線13. Grid : 佈線時(shí)的走線格點(diǎn)2. Test Point : ATE 測(cè)試點(diǎn)供工廠ICT 測(cè)試治具使用ICT 測(cè)試點(diǎn) LAYOUT 注意事項(xiàng):PCB 的每條TRACE 都要有一個(gè)作為測(cè)試用之TEST PAD(測(cè)試點(diǎn))，其原則如下：1. 一般測(cè)試點(diǎn)大小均為30-35mil，元件分布較密時(shí)，測(cè)試點(diǎn)最小可至30mil.測(cè)試點(diǎn)與元件PAD 的距離最小為40mil。2. 測(cè)試點(diǎn)與測(cè)試點(diǎn)間的間距最小為50-75mil，一般使用75mil。密度高時(shí)可使用50mil,3. 測(cè)試點(diǎn)必須均勻分佈於PCB 上，避免測(cè)試時(shí)造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測(cè)試點(diǎn)留於錫爐著錫面上(Solder Side)。5. 測(cè)試點(diǎn)必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測(cè)率7. 測(cè)試點(diǎn)設(shè)置處:Setuppadsstacks
標(biāo)簽：
layout
design
pcb
硬件工程師
上傳時(shí)間：
2013-10-22
上傳用戶：pei5
-
LAYOUT REPORT .............. 1
目錄.................. 1
1. PCB LAYOUT 術(shù)語解釋(TERMS)......... 2
2. Test Point : ATE 測(cè)試點(diǎn)供工廠ICT 測(cè)試治具使用............ 2
3. 基準(zhǔn)點(diǎn) (光學(xué)點(diǎn)) -for SMD:........... 4
4. 標(biāo)記 (LABEL ING)......... 5
5. VIA HOLE PAD................. 5
6. PCB Layer 排列方式...... 5
7.零件佈置注意事項(xiàng) (PLACEMENT NOTES)............... 5
8. PCB LAYOUT 設(shè)計(jì)............ 6
9. Transmission Line ( 傳輸線 )..... 8
10.General Guidelines – 跨Plane.. 8
11. General Guidelines – 繞線....... 9
12. General Guidelines – Damping Resistor. 10
13. General Guidelines - RJ45 to Transformer................. 10
14. Clock Routing Guideline........... 12
15. OSC & CRYSTAL Guideline........... 12
16. CPU
標(biāo)簽：
layout
pcb
上傳時(shí)間：
2013-12-20
上傳用戶：康郎
-
Information in this document is subject to change without notice and does notrepresent a commitment on the part of the manufacturer. The software describedin this document is furnished under license agreement or nondisclosureagreement and may be used or copied only in accordance with the TERMS of theagreement. It is against the law to copy the software on any medium except asspecifically allowed in the license or nondisclosure agreement. The purchasermay make one copy of the software for backup purposes. No part of this manualmay be reproduced or transmitted in any form or by any means, electronic ormechanical, including photocopying, recording, or information storage andretrieval systems, for any purpose other than for the purchaser’s personal use,without written permission.
標(biāo)簽：
keilA
51
教程
上傳時(shí)間：
2014-12-27
上傳用戶：Tracey
-
Stellaris(群星)單片機(jī)的片上FLASH編程(英)
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH LUMINARY MICRO PRODUCTS. NO LICENSE,EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THISDOCUMENT. EXCEPT AS PROVIDED IN LUMINARY MICRO’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,LUMINARY MICRO ASSUMES NO LIABILITY WHATSOEVER, AND LUMINARY MICRO DISCLAIMS ANY EXPRESS OR IMPLIEDWARRANTY, RELATING TO SALE AND/OR USE OF LUMINARY MICRO’S PRODUCTS INCLUDING LIABILITY OR WARRANTIESRELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHTOR OTHER INTELLECTUAL PROPERTY RIGHT. LUMINARY MICRO’S PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL,LIFE SAVING, OR LIFE-SUSTAINING APPLICATIONS.
標(biāo)簽：
Stellaris
FLASH
單片機(jī)
編程
上傳時(shí)間：
2013-10-22
上傳用戶：JamesB
-
Stellaris(群星)單片機(jī)加上32KB串行SRAM(英)
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH LUMINARY MICRO PRODUCTS. NO LICENSE,EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THISDOCUMENT. EXCEPT AS PROVIDED IN LUMINARY MICRO’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,LUMINARY MICRO ASSUMES NO LIABILITY WHATSOEVER, AND LUMINARY MICRO DISCLAIMS ANY EXPRESS OR IMPLIEDWARRANTY, RELATING TO SALE AND/OR USE OF LUMINARY MICRO’S PRODUCTS INCLUDING LIABILITY OR WARRANTIESRELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHTOR OTHER INTELLECTUAL PROPERTY RIGHT. LUMINARY MICRO’S PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL,LIFE SAVING, OR LIFE-SUSTAINING APPLICATIONS.
標(biāo)簽：
Stellaris
SRAM
32
KB
上傳時(shí)間：
2013-11-22
上傳用戶：lixqiang
-
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their productsor to discontinue any product or service without notice, and advise customers to obtain the latestversion of relevant information to verify, before placing orders, that information being relied onis current and complete. All products are sold subject to the TERMS and conditions of sale suppliedat the time of order acknowledgement, including those pertaining to warranty, patentinfringement, and limitation of liability.
標(biāo)簽：
Assembly
Language
C6000
320C
上傳時(shí)間：
2013-11-12
上傳用戶：chens000
