Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their productsor to discontinue any product or service without notice, and advise customers to obtain the latestversion of relevant information to verify, before placing orders, that information being relied onis current and complete. All products are sold subject to the TERMS and conditions of sale suppliedat the time of order acknowledgement, including those pertaining to warranty, patentinfringement, and limitation of liability
上傳時間： 2013-12-26
上傳用戶：凌云御清風
This application note describes how the existing dual-port block memories in the Spartan™-IIand Virtex™ families can be used as Quad-Port memories. This essentially involves a dataaccess time (halved) versus functionality (doubled) trade-off. The overall bandwidth of the blockmemory in TERMS of bits per second will remain the same.
上傳時間： 2013-11-08
上傳用戶：lou45566
USB接口控制器參考設計,xilinx提供VHDL代碼 usb xilinx vhdl ; This program is free software; you can redistribute it and/or modify ; it under the TERMS of the GNU General Public License as published by ; the Free Software Foundation; either version 2 of the License, or ; (at your option) any later version. ; ; This program is distributed in the hope that it will be useful, ; but WITHOUT ANY WARRANTY; without even the implied warranty of ; MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the ; GNU General Public License for more details. ; ; You should have received a copy of the GNU General Public License ; along with this program; if not, write to the Free Software ; Foundation, Inc., 675 Mass Ave, Cambridge, MA 02139, USA.
上傳時間： 2013-10-12
上傳用戶：windgate
This application note describes how the existing dual-port block memories in the Spartan™-IIand Virtex™ families can be used as Quad-Port memories. This essentially involves a dataaccess time (halved) versus functionality (doubled) trade-off. The overall bandwidth of the blockmemory in TERMS of bits per second will remain the same.
上傳時間： 2014-01-24
上傳用戶：15527161163
The CoolRunner-II CPLD is a highly uniform family of fast, low-power devices. Theunderlying architecture is a traditional CPLD architecture, combining macrocells intofunction blocks interconnected with a global routing matrix, the Xilinx AdvancedInterconnect Matrix (AIM). The function blocks use a PLA configuration that allowsall product TERMS to be routed and shared among any of the macrocells of the functionblock.
上傳時間： 2013-11-03
上傳用戶：1037540470
USB接口控制器參考設計,xilinx提供VHDL代碼 usb xilinx vhdl ; This program is free software; you can redistribute it and/or modify ; it under the TERMS of the GNU General Public License as published by ; the Free Software Foundation; either version 2 of the License, or ; (at your option) any later version. ; ; This program is distributed in the hope that it will be useful, ; but WITHOUT ANY WARRANTY; without even the implied warranty of ; MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the ; GNU General Public License for more details. ; ; You should have received a copy of the GNU General Public License ; along with this program; if not, write to the Free Software ; Foundation, Inc., 675 Mass Ave, Cambridge, MA 02139, USA.
上傳時間： 2013-10-29
上傳用戶：zhouchang199
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上傳時間： 2013-11-17
上傳用戶：cjf0304
LAYOUT REPORT .............. 1 目錄.................. 1 1. PCB LAYOUT 術語解釋(TERMS)......... 2 2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2 3. 基準點 (光學點) -for SMD:........... 4 4. 標記 (LABEL ING)......... 5 5. VIA HOLE PAD................. 5 6. PCB Layer 排列方式...... 5 7.零件佈置注意事項 (PLACEMENT NOTES)............... 5 8. PCB LAYOUT 設計............ 6 9. Transmission Line ( 傳輸線 )..... 8 10.General Guidelines – 跨Plane.. 8 11. General Guidelines – 繞線....... 9 12. General Guidelines – Damping Resistor. 10 13. General Guidelines - RJ45 to Transformer................. 10 14. Clock Routing Guideline........... 12 15. OSC & CRYSTAL Guideline........... 12 16. CPU
上傳時間： 2013-10-29
上傳用戶：1234xhb
Copyright© 2004 Sergiu Dumitriu, Marta Gî rdea, Că tă lin Hriţ cu Permission is granted to copy, distribute and/or modify this document under the TERMS of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A copy of the license is included in the section entitled "GNU Free Documentation License" All brand names, product names, or trademarks belong to their respective holders.
標簽： Permission Copyright 259 Dumitriu
上傳時間： 2015-04-02
上傳用戶：jackgao
*西門子6688上使用 * konGPS.java * * Implementation of konGPS for Siemens SL45i * * Copyright (C) 2002-2003 by KoncaOnLine (http://www.konca.com). * * Author: Konca Fung (konca@tom.com) * * This program may be distributed according to the TERMS of the GNU * General Public License, version 2 or (at your option) any later version. *
標簽： konGPS Implementation Copyright Siemens
上傳時間： 2015-04-27
上傳用戶：cylnpy
