設計一種基于P89V51RD2的功率因數測量儀，采用光電隔離器和專用數碼管驅動器。該測量儀是以增強型單片機P89V51RD2為核心，大大簡化系統硬件設計。而軟件部分采用模塊化設計思想，采用中值濾波和小數補償算法，實現功率因數的高精度測量。實驗測試表明，該功率因數測量儀測量精度高，運行穩定可靠。
Abstract:
A power－factor measurement instrument based on P89V51RD2is designed，which uses optical coupler and specific LED drive chip.The power factor measurement instrument uses P89V51RD2as a core of which greatly simplifies the system design.Furthermore，modularization software is developed in detail.The high precision power－factor measuring system is realized by the center value filter and fractional compensation algorithm.Experiments manifests that the power－ factor measurement instrument is high precision，steady and reliable.
為深入了解基于UC3854A控制的PFC變換器中的動力學特性，研究系統參數變化對變換器中分岔現象的影響，在建立Boost PFC變換器雙閉環數學模型的基礎上，用Matlab軟件對變換器中慢時標分岔及混沌等不穩定現象進行了仿真。在對PFC變換器中慢時標分岔現象仿真的基礎上，分析了系統參數變化對分岔點的影響，并進行了仿真驗證。仿真結果清晰地顯示了輸入整流電壓的幅值變化對系統分岔點的影響。
Abstract:
In order to better understand the dynamics characteristic of power factor correction converter based on UC3854A， and make the way that parameters change influences the bifurcation phenomena of the system clearly. The math model of the two closed loop circuits to the Boost PFC （Power factor Correction） converter controller was built. Then， with the help of Matlab， the simulation for nonlinear phenomena such as chaos and slow-scale bifurcation in the PFC converter was made. Finally the factors that have influence to the phenomenon of bifurcation under slow-scale in PFC converter were analyzed. The simulation results clearly show the parameters change influences the bifurcation point of the system.
The C500 microcontroller family usually provides only one on-chip synchronous serialchannel (SSC). If a second SSC is required, an emulation of the missing interface mayhelp to avoid an external hardware solution with additional electronic components.The solution presented in this paper and in the attached source files emulates the mostimportant SSC functions by using optimized SW routines with a performance up to 25KBaud in Slave Mode with half duplex transmission and an overhead less than 60% atSAB C513 with 12 MHz. Due to the implementation in C this performance is not the limitof the chip. A pure implementation in assembler will result in a strong reduction of theCPU load and therefore increase the maximum speed of the interface. In addition,microcontrollers like the SAB C505 will speed up the interface by a factor of two becauseof an optimized architecture compared with the SAB C513.Moreover, this solution lays stress on using as few on-chip hardware resources aspossible. A more excessive consumption of those resources will result in a highermaximum speed of the emulated interface.Due to the restricted performance of an 8 bit microcontroller a pin compatible solution isprovided only; the internal register based programming interface is replaced by a set ofsubroutine calls.The attached source files also contain a test shell, which demonstrates how to exchangeinformation between an on-chip HW-SSC and the emulated SW-SSC via 5 external wiresin different operation modes. It is based on the SAB C513 (Siemens 8 bit microcontroller).A table with load measurements is presented to give an indication for the fraction of CPUperformance required by software for emulating the SSC.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
基于通用集成運算放大器，利用MASON公式設計了一個多功能二階通用濾波器，能同時或分別實現低通、高通和帶通濾波，也能設計成一個正交振蕩器。電路的極點頻率和品質因數能夠獨立、精確地調節。電路使用4個集成運放、2個電容和11個電阻，所有集成運放的反相端虛地。利用計算機仿真電路的通用濾波功能、極點頻率和品質因數的獨立控制和正交正弦振蕩，從而證明該濾波器正確有效。
Abstract:
A new multifunctional second-order filter based on OPs was presented by MASON formula. Functions， such as high-pass， band-pass， low-pass filtering， can be realized respectively and simultaneously， and can become a quadrature oscillator by modifying resistance ratio. Its pole angular frequency and quality factor can be tuned accurately and independently. The circuit presented contains four OPs， two capacitors， and eleven resistances， and inverting input of all OPs is virtual ground. Its general filtering， the independent control of pole frequency and quality factor and quadrature sinusoidal oscillation were simulated by computer， and the result shows that the presented circuit is valid and effective.
Abstract: The reality of modern, small form-factor ceramic capacitors is a good reminder to always readthe data sheet. This tutorial explains how ceramic capacitor type designations, such as X7R and Y5V,imply nothing about voltage coefficients. Engineers must check the data to know, really know, how aspecific capacitor will perform under voltage.
