Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
基于通用集成運算放大器,利用MASON公式設計了一個多功能二階通用濾波器,能同時或分別實現(xiàn)低通、高通和帶通濾波,也能設計成一個正交振蕩器。電路的極點頻率和品質(zhì)因數(shù)能夠獨立、精確地調(diào)節(jié)。電路使用4個集成運放、2個電容和11個電阻,所有集成運放的反相端虛地。利用計算機仿真電路的通用濾波功能、極點頻率和品質(zhì)因數(shù)的獨立控制和正交正弦振蕩,從而證明該濾波器正確有效。
Abstract:
A new multifunctional second-order filter based on OPs was presented by MASON formula. Functions, such as high-pass, band-pass, low-pass filtering, can be realized respectively and simultaneously, and can become a quadrature oscillator by modifying resistance ratio. Its pole angular frequency and quality factor can be tuned accurately and independently. The circuit presented contains four OPs, two capacitors, and eleven resistances, and inverting input of all OPs is virtual ground. Its general filtering, the independent control of pole frequency and quality factor and quadrature sinusoidal oscillation were simulated by computer, and the result shows that the presented circuit is valid and effective.
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A Waiter relays an order Object to a Producer, waits in an independent thread during the production, and then delivers the result using a Consumer callback method.
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SR-tree is an index structure for high-dimensional nearest neighbor queries,C++ sourcecode. SR-tree outperforms the R*-tree and the SS-tree especially for high-dimensional and non-uniform data which are likely to appear in the actual image / video applications.