A wireless communication network can be viewed as a collection of nodes, located in some domain, which can in turn be transmitters or receivers (depending on the network considered, nodes may be mobile users, base stations in a cellular network, access points of a WiFi mesh etc.). At a given time, several nodes transmit simultaneously, each toward its own receiver. Each transmitter–receiver pair requires its own wireless link. The signal received from the link transmitter may be jammed by the signals received from the other transmitters. Even in the simplest model where the signal power radiated from a point decays in an isotropic way with Euclidean distance, the geometry of the locations of the nodes plays a key role since it determines the signal to interference and noise ratio (SINR) at each receiver and hence the possibility of establishing simultaneously this collection of links at a given bit rate. The interference seen by a receiver is the sum of the signal powers received from all transmitters, except its own transmitter.
標簽： Stochastic Geometry Networks Wireless Volume and II
上傳時間： 2020-06-01
上傳用戶：shancjb
An acronym for Multiple-In, Multiple-Out, MIMO communication sends the same data as several signals simultaneously through multiple antennas, while still utilizing a single radio channel. This is a form of antenna diversity, which uses multiple antennas to improve signal quality and strength of an RF link. The data is split into multiple data streams at the transmission point and recombined on the receive side by another MIMO radio configured with the same number of antennas. The receiver is designed to take into account the slight time difference between receptions of each signal, any additional noise or interference, and even lost signals.
標簽： Understanding_the_Basics_of_MIMO
上傳時間： 2020-06-01
上傳用戶：shancjb
n the first part of this book, we give an introduction to the basic applications of wireless com- munications, as well as the technical problems inherent in this communication paradigm. After a brief history of wireless, Chapter 1 describes the different types of wireless services, and works out their fundamental differences. The subsequent Section 1.3 looks at the same problem from a different angle: what data rates, ranges, etc., occur in practical systems, and especially, what combination of performance measures are demanded (e.g., what data rates need to be transmitted over short distances; what data rates are required over long distances?) Chapter 2 then describes the technical challenges of communicating without wires, putting special emphasis on fading and co-channel interference. Chapter 3 describes the most elementary problem of designing a wireless system, namely to set up a link budget in either a noise-limited or an interference-limited system. After studying this part of the book, the reader should have an overview of different types of wireless services, and understand the technical challenges involved in each of them. The solutions to those challenges are described in the later parts of this book.
標簽： Communications Wireless Edition 2nd
上傳時間： 2020-06-01
上傳用戶：shancjb
Electrostatic discharge (ESD) phenomena have been known to mankind since Thales of Miletus in approximately 600 B.C.E. noticed the attraction of strands of hay to amber. Two thousand six hundred years have passed and the quest to obtain a better under- standing of electrostatics and ESD phenomenon continues. Today, the manufacturing of microelectronics has continued the interest in the field of electrostatic phenomenon spanning factory issues, tooling, materials, and the microelectronic industry
上傳時間： 2020-06-05
上傳用戶：shancjb
常用芯片DIP SOT SOIC QFP電阻電容二極管等3D模型庫 3D視圖封裝庫 STEP后綴三維視圖（154個）:050-9.STEP0805R.STEP1001-1.STEP1001-2.STEP1001-3.STEP1001-4.STEP1001-5.STEP1001-6.STEP1001-7.STEP1001-8.STEP103_1KV.STEP10X5JT.STEP1206R.STEP13PX2.STEP15PX2.STEP20P插針.STEP25V1000UF.STEP3296W.STEP35V2200UF.STEP3mmLED.STEP3mmLEDH.STEP3X3可調電阻.STEP400V0.1UF.STEP455.STEP630V0.1UF.STEP7805.STEP8P4R.STEPAXIAL-0.2-0.125W.STEPAXIAL-0.4-0.25W.STEPaxial-0.6-2W.STEPB-3528.STEPC-0805.STEPC06x18.STEPCAP-6032.STEPCH3.96 X2.STEPCH3.96-3P.STEPD-PAK.STEPDB25.STEPDC-30.STEPDIP14.STEPDIP16.STEPDIP6.STEPDIP8.STEPDO-214AA.STEPDO-214AB.STEPDO-214AC.STEPDO-41.STEPDO-41Z.STEPFMQ.STEPGNR14D.STEPH9700.STEPILI4981.STEPIN4007.STEPIN5408.STEPJP051-6P6C_02.STEPJQC-3F.STEPJS-1132-10.STEPJS-1132-11.STEPJS-1132-12.STEPJS-1132-13.STEPJS-1132-14.STEPJS-1132-15.STEPJS-1132-2.STEPJS-1132-3.STEPJS-1132-4.STEPJS-1132-5.STEPJS-1132-6.STEPJS-1132-7.STEPJS-1132-8.STEPJS-1132-9.STEPJS-1132R-2.STEPJS-1132R-3.STEPJS-1132R-4.STEPJS-1132R-5.STEPJS-1132R-6.STEPJS-1132R-7.STEPJS-1132R-8.STEPJZC-33F.STEPKBP210.STEPKE2108.STEPKF2510 X8.STEPKF301.STEPKF301x3.STEPKSD-9700.STEPLED5_BLUE.STEPLED5_GRE.STEPLED5_RED.STEPLED5_YEL.STEPLFCSP_WQ.STEPLQFP100.STEPLQFP48.STEPMC-146.STEPmolex-22-27-2021.STEPmolex-22-27-2031.STEPmolex-22-27-2041.STEPmolex-22-27-2051.STEPmolex-22-27-2061.STEPmolex-22-27-2071.STEPmolex-22-27-2081.STEPMSOP10.STEPMSOP8.STEPPA0630NOXOX-HA1.STEPPIN10.STEPPIN24.STEPPIN24A.STEPR 0805.STEPR0402.STEPR0603.STEPR0805.STEPR1206.STEPRA-15.STEPRA-20.STEPRS808.STEPSIP-3-3.96 22-27-2031.STEPSL-B.STEPSL-D.STEPSL-E.STEPSL-G.STEPSL-H.STEPSOD-123.STEPSOD-323.STEPSOD-523.STEPSOD-723.STEPSOD-80.STEPSOIC-8.STEPSOP-4.STEPSOP14.STEPSOP16.STEPSOP18.STEPSOT-89.STEPSOT223.STEPSOT23-3.STEPSOT23-5.STEPSSOP28.STEPTAJ-A.STEPTAJ-B.STEPTAJ-C.STEPTAJ-D.STEPTAJ-E.STEPTAJ-R.STEPTHB6064H.STEPTO-126.STEPTO-126X.STEPTO-220.STEPTO-247.STEPTO-252-3L.STEPTOSHIBA_11-4C1.STEPTSSOP-8.STEPTSSOP14-BOTTON.STEPTSSOP14.STEPTSSOP28.STEPUSB-A.STEPUSB-B.STEPWT.STEP
標簽： 芯片 dip sot soic qfp 電阻 電容 二極管 封裝
上傳時間： 2021-11-21
上傳用戶：XuVshu
DHT11 MIC SHT11 VS1838B CHT8305 MQ-3 溫濕度氣體等傳感器元件Altium封裝庫三維視圖PCB封裝庫(3D封裝庫),PcbLibb后綴文件，封裝列表如下：Component Count : 32Component Name-----------------------------------------------AHT10CHT8305DHT11DHT11 - duplicateGP1A52HRGP1A53HRI-LED-3MMI-LED-5MMMIC-4.5*1.9MIC-6*5.5mmMIC0622DIPMLX90614MQ-3MS5611OPT-3MMOPT-5MMRG5528ROC16S58SHT1X-8PSHT2XSHT3x-ARPSHT3x-DISST188TO-18TO-39TO-66TO-356VS1838B-AVS1838B-A_HVS1838B-BVS1838B-B_H
上傳時間： 2021-12-21
上傳用戶：shjgzh
用三點法實現機器人三維位置測量的研究摘 要 ：提 出 了一 種 微 小 爬 壁 機 器 人 三 維 位 置 測 量 的新 方 法 。筆 者 通 過 深 入 分 析 研 究各 種 位 置 測 控 方 法 與 系 統 ，提 出采 用單 目視 覺方 法 中的 聚 焦法 ，以 CCD作 為 傳 感 器 ，用 三 點 法 實現 對 機 器 人 的 三 維 位 置 測 量 。 驗 證性 實驗 結果表 明 ，本研 究提 出的測 量原 理和 系統是 正 確 可行 的 。 關鍵詞 ：機 器人 ；位置 測量 ；CCD傳 感 器 ；單 目視 覺 ；攝 像 機 標 定 中 圖分 類 號 ：TP242．6 文 獻 標 識 碼 ：B Abstract：A new 3D position measurementmethod Ofa wall—climbing micro robothas been researched．Researc— hing on the various position measuring and controlling method，theauthorhasputforwardanewprojecttomeas— ure the 3D position of the robot，in which the focusing method with singlecamera and CCD sensorhasbeen used to getthe position information．The elementary experiment has verified the principle and the system． Key words：robot；position detection；CCD sensor；single camera vision；camera caiibration 位置測量技 術是智 能機 器人 的關鍵 技術 ，是各 種 機器人控 制系統 中極 為重 要 的環節 ，也 是 國內外研 究 的熱點所 在。 按 照測試 系統 與被 測機 器 人 的關 系 ，可 以將位 置 測量技術 分為接觸 式和非接觸式 兩大類 。接觸 式測量 系統 由于在測 量過程 中或多或少地 對機器人施 加 了載 荷 ，因而僅適用于靜 態 位置測 量 。而動 態 位 置測量 系 統 主要分 5類 ：①激光跟蹤 系統 ；@ CCD交 互測量 收 稿 日期 ：2001—07—03 基 金項 目：國家 863高科技 研 究 資助 項 目(9804-06)；教 育 部 高 等 學校 骨干教 師 資助 計 3t,j項 目 作者 簡 介 ：張 智海 (1973一 )，男 ，工 學碩 士 ，主 要 研 究 方 向 為 智 能 機 器人 測 控 技 術 。 系統 ；③ 超聲波 測量 系統 ；④ PSD(positionsensitivede— vice)位 置 測 量 系統 ；⑤ 帶 有 接 近覺 傳 感 器 的 測量 系 統 。位置測量 還可 以從另一個分類 角度劃分為主動式 測量和被動 式測 量 。主動式測 量主要可 以分為結 構光方法和激光 自動聚焦法兩類 。被 動式測量 主要 可 以分為雙 目視 覺 、三 目視覺 、單 目視覺 等方法 。 對 比以上各種方法 的 優缺 點 ，針對 筆者 研制 的微 小爬壁機器人 的空 間三 維位 置 測量 的要 求 ，測量 系統 必須滿足尺 寸小 、分 辨率 高 、穩定 性 和可 靠性 好 、時 間 響應快等特 點 ，提 出了采用 單 目視覺方法 中的聚焦法 ， 選用 CCD作 為傳感器 ，用 三點法實現對機器人 的三維 位置測量 ，并用 Matlab和 V
標簽： 機器人
上傳時間： 2022-02-12
上傳用戶：
Altium Designer常用器件集成庫PCB封裝庫原理圖庫3D庫元件庫集成庫原理圖器件型號列表：76個13W3 2N7002 74HC0474HC0874HC244D74HC595 74LS138 80508550 8P4R_0603ADM2582EADM3053AS5145B AT24C02BAT54SBUZZ BatteryCCT6806CD4001CD4053CapacitorDS18B20Diode Diode SchottkyFP6101FT2232DFUSEHMC5883LINA118IR2010IR2101SIR2136SIRF1010EIRFP7404ISO7240InductorLEDLF444LG9110SLM339LM393LMV7239MAX232MCP2551MCP6022MCP6024MPU6050Mic2941Micro SD CardMicro USBNuMicro-M051OPTOISOIPESDxS2UATPT2272PVI1050PhonejackResistanceSN65VHD230STC12LE5202STM32F103CBT6STM32F103RBT6STM32F103VCT6STM32F407VSwitchTJA1050TLV5638ITMS320F28035PAGTMS320F28035PNTOP242U18UC3854ULN2803USB A-BVBUS Xtal 集成庫PCB封裝列表：76個8P4R_060313W30805DBC04-BBT_CR1220BUZZC0201C0402C0603C0805C1206CD127CPX-32CRYSTALD1206DC-0003DC-0005DIP-4DIP-6DIP-8DO-201ADDO-214AADO-214ABDO-214ACF5mmFUSEFUSE_001FUSE_LFUSE2HC-49/U-SHDRX3L-330uHLCC-24NLPCC-16NLQFP-48LQFP-64LQFP-80Micro SD CardMicro USBR0201R0402R0603R0805R1206R1210R2512SDRH5D18-220NSIP-3SMD CRYSTALSMD-8SOIC-4SOIC-8SOIC-14SOIC-16SOIC-16WSOIC-18SOIC-20SOIC-24SOIC-28SOT-23SOT23-5SOT23-6SWSwitch1TD-19XATO-92TO-92ATO-220-2TO-220ATO-220BTO-247ACTO-263-5TQFP-100TSSOP-16USB DIPUSB-A
標簽： altium designer pcb
上傳時間： 2022-02-12
上傳用戶：
STM32 F1系列 MCU ATIUM AD集成庫 原理圖庫 PCB 3D封裝庫文件,STM32F1XXXXX全系列原理圖+PCB封裝庫文件，共209個器件型號，CSV text has been written to file : STM32 F1.csvLibrary Component Count : 209Name Description----------------------------------------------------------------------------------------------------STM32F100C4T6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C4T7B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100C6T6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C6T6BTR STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, Tape and ReelSTM32F100C6T7B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100C8T6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100C8T6BTR STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, Tape and ReelSTM32F100CBT6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 48-Pin LQFP, TraySTM32F100CBT7B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +105癈 Temperature, 48-Pin LQFP, TraySTM32F100R4H6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R4T6B STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R4T6BTR STM32 ARM-based 32-bit MCU Value Line with 16 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100R6H6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R6T6 STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R6T6B STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R6T6BTR STM32 ARM-based 32-bit MCU Value Line with 32 kB Flash, 4 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, Tape and ReelSTM32F100R8H6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100R8T6B STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100R8T6BTR STM32 ARM-based 32-bit MCU Value Line with 64 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100RBH6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, TraySTM32F100RBH6BTR STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin TFBGA, Tape and ReelSTM32F100RBT6B STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RBT6BTR STM32 ARM-based 32-bit MCU Value Line with 128 kB Flash, 8 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, Tape and ReelSTM32F100RCT6B STM32 ARM-based 32-bit MCU Value Line with 256 kB Flash, 24 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RDT6 STM32 ARM-based 32-bit MCU Value Line with 384 kB Flash, 32 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RDT6B STM32 ARM-based 32-bit MCU Value Line with 384 kB Flash, 32 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RET6 STM32 ARM-based 32-bit MCU Value Line with 512 kB Flash, 32 kB Internal RAM, -40 to +85癈 Temperature, 64-Pin LQFP, TraySTM32F100RET6B STM32 ARM-based 32-bit MCU Value Line with 512 kB Flash, 32 kB Internal RAM, Internal Code B, -40 to +85癈 Temperature, 64-
上傳時間： 2022-04-30
上傳用戶：jiabin
說明：1，測試交流電源（Test AC Power Supply）：A.中國（China）：AC 220V+/-2%50Hz+/-2%B.美國（United States of America）：AC 120V+/-2%60Hz+/-2%。C.英國（Britain）：AC 240V+/-2%50Hz+/-2%D.歐洲（Europe）：AC 230V+/-2%50Hz+/-2%E.日本（Japan）：AC 100V+/-2%60Hz+/-2%F.墨西哥（Mexico）：AC 127V+/-2%60Hz+/-2%2，測試溫度條件（Test Temperature Conditions）：25℃+/-2℃。3，測試以右聲道為準（Standard Test Use Right Channell）4，信號由AUX插座輸入（Signal From AUX Jack Input）。5，測試以音量最大，音調和平衡在中央位置（電子音調在正常狀態）。（Test Volume Setup Max，Equalizer And Balance Setup Center）。6，標準輸出（Standard Output）：A.輸入1 KHz頻率信號（Input 1 KHz Frequency Signal）B.左右聲道輸入信號測試右聲道（L&R Input Signal Test Use R Channel）C.額定輸出功率満（Rating Output Power Full）10 W，標準輸出定為1w.（Rating Output Power Full 10 w，Standard Output Setup 1 W）D.額定輸出功率1W到10w，標準輸出定為500 mW（Rating Output Power 1 W To 10 W，Standard Output Setup 500 mW）E.額定輸出功率小于1w，標準輸出定為50 mW（Rating Output Power Not Full 1 W，Standard Output Setup 50 mW）F.標準輸出電壓以V-VPR為準（Standard Output Voltage Use V-V/PR）。G.V-V/PR中P為額定輸出功率，R為喇叭標稱阻抗。
標簽： 音響功放
上傳時間： 2022-06-18
上傳用戶：
