3D Graphics Modelling and Rendering3D計算機圖形造型與渲染
標簽： Rendering3D Modelling Graphics and
上傳時間： 2017-09-03
上傳用戶：ruan2570406
solution for the Statistical modelling for digital signal processing by hayes
標簽： Statistical processing for modelling
上傳時間： 2017-09-26
上傳用戶：dbs012280
'Physics Toy(物理玩具)是zh1110設計的一款2D物理模擬軟件,仿制了真實環境物體的各種連接與碰撞效果 應用介紹： 少年智力開發，學校物理課程指導，各種機構運動的研究 基于沖量的剛體鉸鏈與碰撞,銷限制鉸接計算出鏈、擺、小車等模型,通過與扭簧配合模擬出玩具木馬模型 仿真真實世界物理狀態，建立了可用戶控制的功能,達成了如同兒童玩具房的環境
標簽： Physics Toy 2D物理模擬 VB
上傳時間： 2015-05-22
上傳用戶：ynitqi
Optimization Modelling A Practical Approach Ruhul A. Sarker Charles S. Newton
標簽： 數學建模
上傳時間： 2016-02-15
上傳用戶：jh442755_1
·JOHN DANIEL KRAUS: 94 DIED 18 July 2004 MEMBER GRADE Life Fellow EDUCATION Bachelors, masters, and doctorate-all in physics from the University of Michigan, Ann Arbor, USA FIELDS OF INTEREST Electroma
標簽： nbsp Applications Antennas Edition
上傳時間： 2013-07-29
上傳用戶：ukuk
用matlab編寫的 Hidden Markov Modelling 工具包 應用便捷 在國外網站找到的 還不錯
上傳時間： 2013-07-26
上傳用戶：ywqaxiwang
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
上傳時間： 2014-12-23
上傳用戶：xinhaoshan2016
模擬集成電路的設計與其說是一門技術，還不如說是一門藝術。它比數字集成電路設計需要更嚴格的分析和更豐富的直覺。嚴謹堅實的理論無疑是嚴格分析能力的基石，而設計者的實踐經驗無疑是誕生豐富直覺的源泉。這也正足初學者對學習模擬集成電路設計感到困惑并難以駕馭的根本原因。.美國加州大學洛杉機分校(UCLA)Razavi教授憑借著他在美國多所著名大學執教多年的豐富教學經驗和在世界知名頂級公司(AT&T，Bell Lab，HP)卓著的研究經歷為我們提供了這本優秀的教材。本書自2000午出版以來得到了國內外讀者的好評和青睞，被許多國際知名大學選為教科書。同時，由于原著者在世界知名頂級公司的豐富研究經歷，使本書也非常適合作為CMOS模擬集成電路設計或相關領域的研究人員和工程技術人員的參考書。... 本書介紹模擬CMOS集成電路的分析與設計。從直觀和嚴密的角度闡述了各種模擬電路的基本原理和概念，同時還闡述了在SOC中模擬電路設計遇到的新問題及電路技術的新發展。本書由淺入深，理論與實際結合，提供了大量現代工業中的設計實例。全書共18章。前10章介紹各種基本模塊和運放及其頻率響應和噪聲。第11章至第13章介紹帶隙基準、開關電容電路以及電路的非線性和失配的影響，第14、15章介紹振蕩器和鎖相環。第16章至18章介紹MOS器件的高階效應及其模型、CMOS制造工藝和混合信號電路的版圖與封裝。 1 Introduction to Analog Design 2 Basic MOS Device Physics 3 Single-Stage Amplifiers 4 Differential Amplifiers 5 Passive and Active Current Mirrors 6 Frequency Response of Amplifiers 7 Noise 8 Feedback 9 Operational Amplifiers 10 Stability and Frequency Compensation 11 Bandgap References 12 Introduction to Switched-Capacitor Circuits 13 Nonlinearity and Mismatch 14 Oscillators 15 Phase-Locked Loops 16 Short-Channel Effects and Device Models 17 CMOS Processing Technology 18 Layout and Packaging
上傳時間： 2014-12-23
上傳用戶：杜瑩12345
Abstract: Engineers often wish that radio susceptibility (RS) or radio immunity could be cured with an antibiotic, a vaccine, or someform of cure-all. Unfortunately, solving the RS problem is not that easy. Indeed, the laws of physics apply. In this article we discusssources of RS. We also offer tips and hints to protect systems, power supplies, printed circuit boards (PCBs), and electroniccomponents from radio frequency interference.
標簽： Susceptibility Radio 無線電干擾
上傳時間： 2014-12-30
上傳用戶：旗魚旗魚
It would not be an exaggeration to say that semiconductor devices have transformed humanlife. From computers to communications to internet and video games these devices and the technologies they have enabled have expanded human experience in a way that is unique in history. Semiconductor devices have exploited materials, physics and imaginative applications to spawn new lifestyles. Of course for the device engineer, in spite of the advances, the challenges of reaching higher frequency, lower power consumption, higher power generation etc.
上傳時間： 2013-10-28
上傳用戶：songnanhua
