Although Stellaris microcontrollers have generous internal SRAM capabilities, certain applicationsmay have data storage requirements that exceed the 8 KB limit of the Stellaris LM3S8xx seriesdevices. Since microcontrollers do not have an external parallel data-bus, serial memory optionsmust be considered. Until recently, the ubiquitous serial EEPROM/flash device was the only serialmemory solution. The major limitations of EEPROM and flash technology are slow write speed, slowerase times, and limited write/erase endurance.Recently, serial SRAM devices have become available as a solution for high-speed dataapplications. The N256S08xxHDA series of devices, from AMI Semiconductor, offer 32 K x 8 bits oflow-power data storage, a fast Serial Peripheral Interface (SPI) serial bus, and unlimited write cycles.The parts are available in 8-pin SOIC and compact TSSOP packages.
The XA-S3 is a member of Philips Semiconductors’ XA (eXtended Architecture) family of high performance 16-bit single-chip Microcontrollers. The XA-S3 combines many powerful peripherals on one chip. Therefore, it is suited for general multipurpose high performance embedded control functions.One of the on-chip peripherals is the I2C bus interface. This report describes worked-out driver software (written in C) to program / use the I2C interface of the XA-S3. The driver software, together with a demo program and interface software routines offer the user a quick start in writing a complete I2C - XAS3 system application.
Xilinx Next Generation 28 nm FPGA Technology Overview
Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. These devices enable unprecedented levels of integration and bandwidth and provide system architects and designers a fully programmable alternative to ASSPs and ASICs.
Field Programmable Gate Arrays (FPGAs) are becoming a critical part of every system design. Many vendors offer many different architectures and processes. Which one is right for your design? How do you design one of these so that it works correctly and functions as you expect in your entire system? These are the questions that this paper sets out to answer.
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced development cost. Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements. For all these reasons the COM methodology has gained much popularity with OEMs in the embedded industry. COM Express® is an open industry standard for Computer-On-Modules. It is designed to be future proof and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage Differential Signaling) interfaces. These include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other hand.
CodeWarrior Development Tool Suites are comprehensive integrated developmentenvironments (IDE) that provide a highly visual and automated framework toaccelerate the development of the most complex embedded applications. Acrossmost stages of the development cycle, we offer tools to help configure, debug andoptimize your design built on Freescale MPUs, MCUs, DSPs and DSCs. These toolsuites provide solutions to get your design up and running fast.
We offer a broad line of high performance low dropout (LDO) linear regulators with fasttransient response, excellent line and load regulation, and very wide input voltage rangefrom 0.9V to 100V. Output currents range from 20mA to 10A, with positive, negative andmultiple output versions available. Many devices offer output voltage operation <0.8V andsome feature operation as low as 0V, even with a single supply. Most are stable with ceramicoutput capacitors. LDO regulators can be applied in virtually any application.
Abstract: Engineers often wish that radio susceptibility (RS) or radio immunity could be cured with an antibiotic, a vaccine, or someform of cure-all. Unfortunately, solving the RS problem is not that easy. Indeed, the laws of physics apply. In this article we discusssources of RS. We also offer tips and hints to protect systems, power supplies, printed circuit boards (PCBs), and electroniccomponents from radio frequency interference.
Xilinx Next Generation 28 nm FPGA Technology Overview
Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. These devices enable unprecedented levels of integration and bandwidth and provide system architects and designers a fully programmable alternative to ASSPs and ASICs.
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
