This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
PCI ExpressTM is the third generation of PCI (PeripheralComponent Interconnect) technology used to connect I/Operhipheral devices in computer systems. It is intended asa general purpose I/O device interconnect that meets theneeds of a wide variety of computing platforms such asdesktop, mobile, server and communications. It alsospecifies the electrical and mechanical attributes of thebackplane, connectors and removable cards in thesesystems.
針對目前使用的RS232接口數字化B超鍵盤存在PC主機啟動時不能設置BIOS，提出一種PS2鍵盤的設計方法。基于W78E052D單片機，采用8通道串行A/D轉換器設計了8個TGC電位器信息采集電路，電位器位置信息以鍵盤掃描碼序列形式發送，正交編碼器信號通過XC9536XL轉換為單片機可接收的中斷信號，軟件接收到中斷信息后等效處理成按鍵。結果表明，在滿足開機可設置BIOS同時，又可實現超聲特有功能，不需要專門設計驅動程序，接口簡單，成本低。
Abstract: Aiming at the problem of the digital ultrasonic diagnostic imaging system keyboard with RS232 interface currently used couldn?蒺t set the BIOS when the PC boot， this paper proposed a design method of PS2 keyboards. Based on W78E052D microcontroller，designed eight TGC potentiometers information acquisition circuit with 8-channel serial A/D converter， potentiometer position information sent out with keyboard scan code sequentially.The control circuit based on XC9536 CPLD is used for converting the mechanical actions of the encoders into the signals that can be identified by the MCU， software received interrupt information and equivalently treatmented as key. The results show that the BIOS can be set to meet the boot， ultrasound specific functionality can be achieved at the same time， it does not require specially designed driver，the interface is simple and low cost.
In this document, the term Ô60xÕ is used to denote a 32-bit microprocessor from the PowerPC architecture family that conforms to the bus interface of the PowerPC 601ª, PowerPC 603ª, or PowerPC 604 microprocessors. Note that this does not include the PowerPC 602ª microprocessor which has a multiplexed address/data bus. 60x processors implement the PowerPC architecture as it is speciÞed for 32-bit addressing, which provides 32-bit effective (logical) addresses, integer data types of 8, 16, and 32 bits,and ßoating-point data types of 32 and 64 bits (single-precision and double-precision).1.1 Overview The MPC106 provides an integrated high-bandwidth, high-performance, TTL-compatible interface between a 60x processor, a secondary (L2) cache or additional (up to four total) 60x processors, the PCI bus,and main memory. This section provides a block diagram showing the major functional units of the 106 and describes brießy how those units interact.Figure 1 shows the major functional units within the 106. Note that this is a conceptual block diagram intended to show the basic features rather than an attempt to show how these features are physically implemented on the device.
The Motorola MPC106 PCI bridge/memory controller provides a PowerPCªmicroprocessor common hardware reference platform (CHRPª) compliant bridgebetween the PowerPC microprocessor family and the Peripheral Component Interconnect(PCI) bus. In this document, the term Ô106Õ is used as an abbreviation for the phraseÔMPC106 PCI bridge/memory controllerÕ. This document contains pertinent physicalcharacteristics of the 106. For functional characteristics refer to theMPC106 PCI Bridge/Memory Controller UserÕs Manual.This document contains the following topics:Topic PageSection 1.1, ÒOverviewÓ 2Section 1.2, ÒFeaturesÓ 3Section 1.3, ÒGeneral ParametersÓ 5Section 1.4, ÒElectrical and Thermal CharacteristicsÓ 5Section 1.5, ÒPin AssignmentsÓ 17Section 1.6, ÒPinout Listings 18Section 1.7, ÒPackage DescriptionÓ 22Section 1.8, ÒSystem Design InformationÓ 24Section 1.9, ÒDocument Revision HistoryÓ 29Section 1.10, ÒOrdering InformationÓ 29
The PCI Special Interest Group disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI Special Interest Group make a commitment to update the information contained herein.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
See Appendix B for a description of the programs included
on this companion disk. RESOURCE.WRI identifies other books
and resources for Internet programming. WEBHELP.HLP contains
an introduction to the World Wide Web. TCPMAN.HLP provides
detailed instructions to help you use the Trumpet Winsock
included on this disk. Use the Program Manager s File menu
Run option to execute the SETUP.EXE program found on this
disk. SETUP.EXE will install the programs on your hard drive
and create an Internet Programming group window.
Internet編程技術 [配套程序]
[涉及平臺] VC
[作者] void
[文件大小] 1032K
* "Copyright (c) 2006 Robert B. Reese ("AUTHOR")"
* All rights reserved.
* (R. Reese, reese@ece.msstate.edu, Mississippi State University)
* IN NO EVENT SHALL THE "AUTHOR" BE LIABLE TO ANY PARTY FOR
* DIRECT, INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES ARISING OUT
* OF THE USE OF THIS SOFTWARE AND ITS DOCUMENTATION, EVEN IF THE "AUTHOR"
* HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
