資料說明介紹 PCB Translator_CAMCAD轉換器3.95版本，里面含CAMCAD_3.9.5a_crack文件，可以對軟件進行破解 （需要安裝PCB Translator后才能進行破解） 針對PCB設計文件的RSI轉換器能夠轉換PCB設計和生產所需要的所有信息。它們包括：庫，布置位置，插入屬性信息，網表，走線，文字和銅箔，以及其它相關的項目。不需要執行"導入Gerber"和"交叉參考"就可以完成所有這些工作。事實上，根本不需要定義參考，因為軟件可以從原始文件格式中提取出CAD數據，并把它直接輸出到新的文件格式中。只需要注意CAD系統本身的限制就可以了。 CAMCAD PCB 轉換器 CAMCAD PCB 轉換器是一個功能完善的PCB CAD 轉換器，圖形用戶界面也很淺顯易懂。CAMCAD PCB 轉換器支持大多數流行的CAD格式，比如Cadence Allegro, Orcad, Mentor and Accel EDA,也支持工業標準格式，比如GenCAM, GenCAD, and IPC-D-356.CAMCAD PCB 轉換器允許導入CAD文件到CAMCAD圖形用戶環境中，校驗數據，修改數據，然后可以把數據導出為任意格式的文件。這些特性意味著用戶可以完全控制所有的事情，比如層的轉換，也能解決CAD格式之間不兼容的問題。 一個案例,如果要轉換Cadence Allegro文件到PADS,所有必須的設計信息都會包含在新的文件中。不過，Cadence Allegro允許板子上的銅箔重疊，PADS卻不允許。Allegro 文件可以正常導入到CAMCAD。如果要立即把這個文件導出到PADS，程序會有錯誤提示。這時，可以使用CAMCAD的數據處理特性來改變有問題的銅箔，解決問題后再導出到PADS。 下面的矩陣表格，列出了CAMCAD PCB 轉換器所支持的當前PCB的轉換組合。Import Modules 一列中列出了可以被導入（讀取）的所有ECAD文件格式。Export Modules一行中列出了可以被導出（寫）的文件格式。在這個矩陣中的任意輸入和輸出模塊組合轉換都是可行的。當然，沒有任何ECAD到ECAD的轉換器是絕對完美的。由于ECAD layout系統有自己獨特的特性，而這些可能不能直接轉換到另一個有自己獨特特性的ECAD系統中。 CAMCAD PCB 轉換器支持的組合 建議配置：Windows 2000 或者 XP Professional，800 MHZ 處理器，512MB RAM 17"顯示器，1024×768分辨率 Copyright 2004 Router solutions Incorporated RSI Reserves the right to make changes to its specifications and products without prior notice. CAMCAD is a registered trademark of Router solutions Incorporated. All rights reserved. RSI recognizes other brand and product names as trademarks or registered trademarks of their respective holders.
標簽： Translator_CAMCAD PCB 轉換器
上傳時間： 2014-12-31
上傳用戶：wvbxj
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標簽： UltraScale Xilinx 架構
上傳時間： 2013-11-21
上傳用戶：wxqman
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-11-21
上傳用戶：不懂夜的黑
Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells called complexprogrammable logic devices (CPLDs)or they can be high-density devicesbased on SRAM look-up tables (LUTs)
標簽： solutions Analog Altera FPGAs
上傳時間： 2013-10-27
上傳用戶：fredguo
Designing withProgrammable Logicin an Analog WorldProgrammable logic devicesrevolutionized digital design over 25years ago, promising designers a blankchip to design literally any functionand program it in the field. PLDs canbe low-logic density devices that usenonvolatile sea-of-gates cells calledcomplex programmable logic devices(CPLDs) or they can be high-densitydevices based on SRAM look-up tables
標簽： solutions Analog Xilinx FPGAs
上傳時間： 2013-11-07
上傳用戶：suicone
This application note contains a reference design consisting of HDL IP and Xilinx AdvancedConfiguration Environment (ACE) software utilities that give designers great flexibility increating in-system programming (ISP) solutions. In-system programming support allowsdesigners to revise existing designs, package the new bitstream programming files with theprovided software utilities, and update the remote system through the JTAG interface using theEmbedded JTAG ACE Player.
上傳時間： 2013-10-22
上傳用戶：gai928943
The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously.
上傳時間： 2013-10-09
上傳用戶：evil
解壓密碼：www.elecfans.com 隨著微電子技術的迅速發展以及集成電路規模不斷提高，對電路性能的設計 要求越來越嚴格，這勢必對用于大規模集成電路設計的EDA 工具提出越來越高的 要求。自1972 年美國加利福尼亞大學柏克萊分校電機工程和計算機科學系開發 的用于集成電路性能分析的電路模擬程序SPICE（Simulation Program with IC Emphasis）誕生以來，為適應現代微電子工業的發展，各種用于集成電路設計的 電路模擬分析工具不斷涌現。HSPICE 是Meta-Software 公司為集成電路設計中 的穩態分析，瞬態分析和頻域分析等電路性能的模擬分析而開發的一個商業化通 用電路模擬程序，它在柏克萊的SPICE（1972 年推出），MicroSim公司的PSPICE （1984 年推出）以及其它電路分析軟件的基礎上，又加入了一些新的功能，經 過不斷的改進，目前已被許多公司、大學和研究開發機構廣泛應用。HSPICE 可 與許多主要的EDA 設計工具，諸如Candence,Workview 等兼容，能提供許多重要 的針對集成電路性能的電路仿真和設計結果。采用HSPICE 軟件可以在直流到高 于100MHz 的微波頻率范圍內對電路作精確的仿真、分析和優化。在實際應用中， HSPICE能提供關鍵性的電路模擬和設計方案，并且應用HSPICE進行電路模擬時， 其電路規模僅取決于用戶計算機的實際存儲器容量。 The HSPICE Integrator Program enables qualified EDA vendors to integrate their products with the de facto standard HSPICE simulator, HSPICE RF simulator, and WaveView Analyzer™. In addition, qualified HSPICE Integrator Program members have access to HSPICE integrator application programming interfaces (APIs). Collaboration between HSPICE Integrator Program members will enable customers to achieve more thorough design verification in a shorter period of time from the improvements offered by inter-company EDA design solutions.
上傳時間： 2013-10-18
上傳用戶：s363994250
The revolution of automation on factory floors is a key driver for the seemingly insatiable demand for higher productivity， lower total cost of ownership，and high safety. As a result， industrial applications drive an insatiable demand of higher data bandwidth and higher system-level performance. This white paper describes the trends and challenges seen by designers and how FPGAs enable solutions to meet their stringent design goals.
上傳時間： 2013-11-08
上傳用戶：yan2267246
Abstract: As industrial control systems (ICSs) have become increasingly connected and use more off-the-shelfcomponents, new vulnerabilities to cyber attacks have emerged. This tutorial looks at three types of ICSs:programmable logic controllers (PLCs), supervisory control and data acquisition (SCADA) systems, anddistributed control systems (DCSs), and then discusses security issues and remedies. This document alsoexplains the benefits and limitations of two cryptographic solutions (digital signatures and encryption) andelaborates on the reasons for using security ICs in an ICS to support cryptography.
上傳時間： 2013-10-09
上傳用戶：woshinimiaoye
