Radio frequency (RF) can be a complex subject to navigate, but it does not have to be. If you are just getting started with radios or maybe you cannot find that old reference book about antenna aperture, this guide can help. It is intended to provide a basic understanding of RF technology, as well act as a quick reference for those who “know their stuff” but may be looking to brush up on that one niche term that they never quite understood. This document is also a useful reference for Maxim’s products and data sheets, an index to deeper analysis found in our application notes, and a general reference for all things RF.
Radio frequency (RF) can be a complex subject to navigate, but it does not have to be. If you are just getting started with radios or maybe you cannot find that old reference book about antenna aperture, this guide can help. It is intended to provide a basic understanding of RF technology, as well act as a quick reference for those who “know their stuff” but may be looking to brush up on that one niche term that they never quite understood. This document is also a useful reference for Maxim’s products and data sheets, an index to deeper analysis found in our application notes, and a general reference for all things RF.
Radio Frequency Identifi cation (RFID) technology usesradiated and refl ected RF power to identify and track avariety of objects. A typical RFID system consists of areader and a transponder (or tag). An RFID reader containsan RF transmitter, one or more antennas and an RFreceiver. An RFID tag is simply an uniquely identifi ed ICwith an antenna.
闡述了軌道交通列車定位技術。介紹了在軌道交通系統中列車定位技術的功能，國內外軌道交通中主要采用的列車定位方法，重點論述了幾種主要定位技術，并從定位精度、閉塞制式、維護投資成本、抗干擾等方面進行分析比較。提出目前軌道交通定位技術應綜合運用，取長補短，多種方法相互融合，才能滿足軌道交通中對安全可靠性的要求。
Abstract:
Rail train positioning technology is described. The paper introduces the funetions of the train positioning technology in the rail transit system， the main methods of train positioning do mestic and international rail， and focuses on several key methods， analyzes and compares from the positioning accuracy， block system, maintenance and investment cost， interference and so on， suggested that the current rail positioning technology should be integrated use of positioning method of meriging， learn from each other， to meet the reliability requirements of rail safety.
為滿足無線網絡技術具有低功耗、節點體積小、網絡容量大、網絡傳輸可靠等技術要求，設計了一種以MSP430單片機和CC2420射頻收發器組成的無線傳感節點。通過分析其節點組成，提出了ZigBee技術中的幾種網絡拓撲形式，并研究了ZigBee路由算法。針對不同的傳輸要求形式選用不同的網絡拓撲形式可以盡大可能地減少系統成本。同時針對不同網絡選用正確的ZigBee路由算法有效地減少了網絡能量消耗，提高了系統的可靠性。應用試驗表明，采用ZigBee方式通信可以提高傳輸速率且覆蓋范圍大，與傳統的有線通信方式相比可以節約40%左右的成本。
Abstract:
To improve the proposed technical requirements such as low-ower， small nodes， large capacity and reliable network transmission， wireless sensor nodes based on MSP430 MCU and CC2420 RF transceiver were designed. This paper provided network topology of ZigBee technology by analysing the component of the nodes and researched ZigBee routing algorithm. Aiming at different requirements of transmission mode to choose the different network topologies form can most likely reduce the system cost. And aiming at different network to choose the correct ZigBee routing algorithm can effectively reduced the network energy consumption and improved the reliability of the system. Results show that the communication which used ZigBee mode can improve the transmission rate， cover more area and reduce 40% cost compared with traditional wired communications mode.
針對UHF讀寫器設計中，在符合EPC Gen2標準的情況下，對標簽返回的高速數據進行正確解碼以達到正確讀取標簽的要求，提出了一種新的在ARM平臺下采用邊沿捕獲統計定時器數判斷數據的方法，并對FM0編碼進行解碼。與傳統的使用定時器定時采樣高低電平的FM0解碼方法相比，該解碼方法可以減少定時器定時誤差累積的影響；可以將捕獲定時器數中斷與數據判斷解碼相對分隔開，使得中斷對解碼影響很小，實現捕獲與解碼的同步。通過實驗表明，這種方法提高了解碼的效率，在160 Kb/s的接收速度下，讀取一張標簽的時間約為30次/s。
Abstract:
Aiming at the requirement of receiving correctly decoded data from the tag under high-speed communication which complied with EPC Gen2 standard in the design of UHF interrogator， the article introduced a new technology for FM0 decoding which counted the timer counter to judge data by using the edge interval of signal capture based on the ARM7 platform. Compared with the traditional FM0 decoding method which used the timer timed to sample the high and low level， the method could reduce the accumulation of timing error and could relatively separate capture timer interrupt and the data judgment for decoding， so that the disruption effect on the decoding was small and realizd synchronization of capture and decoding. Testing result shows that the method improves the efficiency of decoding， at 160 Kb/s receiving speed， the time of the interrogator to read a tag is about 30 times/s.
Agilent AN 154 S-Parameter Design Application Note S參數的設計與應用
The need for new high-frequency, solid-state circuitdesign techniques has been recognized both by microwaveengineers and circuit designers. These engineersare being asked to design solid state circuitsthat will operate at higher and higher frequencies.The development of microwave transistors andAgilent Technologies’ network analysis instrumentationsystems that permit complete network characterizationin the microwave frequency rangehave greatly assisted these engineers in their work.The Agilent Microwave Division’s lab staff hasdeveloped a high frequency circuit design seminarto assist their counterparts in R&D labs throughoutthe world. This seminar has been presentedin a number of locations in the United States andEurope.From the experience gained in presenting this originalseminar, we have developed a four-part videotape, S-Parameter Design Seminar. While the technologyof high frequency circuit design is everchanging, the concepts upon which this technologyhas been built are relatively invariant.The content of the S-Parameter Design Seminar isas follows:
Today in many applications such as network switches, routers, multi-computers,and processor-memory interfaces, the ability to integrate hundreds of multi-gigabit I/Os is desired to make better use of the rapidly advancing IC technology.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
