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標(biāo)簽： 雙端網(wǎng)絡(luò) 等效變換
上傳時(shí)間： 2013-10-15
上傳用戶：adada
機(jī)電類比法是一種把機(jī)械量通過一定的計(jì)算等效類比為電量的方法，其在對(duì)電子機(jī)械系統(tǒng)的分析中應(yīng)用非常廣泛。它能夠把一個(gè)較復(fù)雜的機(jī)械系統(tǒng)類比為我們熟知的電路系統(tǒng)來進(jìn)行分析，從而使問題的分析得到簡(jiǎn)化。本文通過對(duì)振弦式傳感器的分析介紹了機(jī)電類比法，并對(duì)使用電路進(jìn)行了相關(guān)的分析。 Summary：The electromechanical analogy is assort of analysis which is to analogize the mechanical system by using circuit system , it applied widely in the filed of analysis the electronic-mechanical system. The analysis can take a complex mechanical system analogous to a circuitry that we well-known, which can simplify the problems. In the paper, the electro-mechanical analogy method is briefly introduced by analysis the vibrating wire sensor，and have a correlation analysis about the circuit we used.關(guān)鍵詞： 機(jī)電類比法 振弦式傳感器 頻率 振蕩 反饋Keyword：electro-mechanical analogy method，vibrating wire sensor，frequency, oscillation, feedback 0 引言振弦式傳感器是屬于頻率式傳感器的一種。所謂頻率式傳感器就是能直接將被測(cè)量轉(zhuǎn)換為振動(dòng)頻率信號(hào)的傳感器，這類傳感器一般是通過測(cè)量振弦、振筒、振梁、振膜等彈性振體或石英晶體諧振器的固有諧振頻率來達(dá)到測(cè)量引起諧振頻率變化的被測(cè)非電量的目的，其也稱為諧振式傳感器[1]。在分析該類傳感器中，由于其涉及到頻率，就容易讓人聯(lián)想到在電子技術(shù)中接觸到的RLC振蕩電路。因此可以嘗試著用類比的方法使之對(duì)應(yīng)起來分析,即機(jī)電類比法分析。
上傳時(shí)間： 2013-11-16
上傳用戶：paladin
主要介紹了高效率E類射頻功率振蕩器的原理和設(shè)計(jì)方法，通過電路等效變換，E類射頻功率振蕩器最終轉(zhuǎn)換成與E類放大器相同的結(jié)構(gòu)，MOS管工作在軟開關(guān)狀態(tài)，漏極高電壓、大電流不會(huì)同時(shí)交疊，大大降低了功率損耗，在同等工作條件下，能夠獲得與E類放大器相似的高效率。文中以ARF461型LDMOS做為功率器件，結(jié)合E類射頻振蕩器在等離子體源中的應(yīng)用，給出了的設(shè)計(jì)實(shí)例。ADS仿真結(jié)果表明，在13.56MHz的工作頻率下，振蕩器輸出功率46W，效率為92%，符合設(shè)計(jì)預(yù)期。
上傳時(shí)間： 2014-02-10
上傳用戶：yczrl
本文設(shè)計(jì)了一套完整的數(shù)字化 T/R 組件框圖、電路。并主要對(duì)大功率固態(tài)放大器和數(shù)字接收系統(tǒng)進(jìn)行了硬件設(shè)計(jì)和實(shí)驗(yàn)。針對(duì)數(shù)字化 T/R 組件在雷達(dá)上應(yīng)用所面臨的一些問題，包括：多通道的檢測(cè)和校準(zhǔn)；系統(tǒng)噪聲系數(shù)的等效；高速串行傳輸技術(shù)的選用以及分布式頻率源對(duì)系統(tǒng)的影響，本文進(jìn)行了相關(guān)的分析。
上傳時(shí)間： 2014-12-30
上傳用戶：ewtrwrtwe
1、高溫薄膜濾波器技術(shù)(圍墻技術(shù)) 大規(guī)模集成電路，等效50階帶通濾波器，在接近-200℃左右工作，導(dǎo)體電阻接近0歐姆，帶通濾波器的品質(zhì)因素Qu為100，000，是普通腔體濾波器品質(zhì)因素Qu的20倍。有效抑制帶外干擾和進(jìn)入帶內(nèi)的高階互調(diào)。 2、高性能的射頻電路技術(shù) 低溫低噪聲放大器具有高增益(12dB)低噪聲系數(shù)(<0.5dB)的高性能，增益平坦度小于0.04dB,有效地壓低底噪聲，放大有用 信號(hào)。 比現(xiàn)網(wǎng)用的TMA和LNA的噪聲系數(shù)好3.5dB左右。世界尖端的制冷機(jī)技術(shù)，奶瓶大的氦制冷機(jī)，無需加冷凍液，可連續(xù)可靠地工作幾十年。其冷端溫度達(dá)77°K或-196.15°C。
上傳時(shí)間： 2013-11-07
上傳用戶：brain kung
SCF原理的基礎(chǔ)是開關(guān)電容與電阻的等效：在電容兩端開關(guān)控 制下，電容被充放電，電荷的轉(zhuǎn)移過程產(chǎn)生脈沖電流，可以計(jì)算其平均值。當(dāng)開關(guān)頻率足夠快時(shí)，該電流等效于流過電阻的電流，可看作是電阻被開關(guān)電容取代。可 以證明，電阻R可表示為開關(guān)電容Ck與開關(guān)切換周期T的比值：
標(biāo)簽： CPLD SCF 程控濾波 電路設(shè)計(jì)
上傳時(shí)間： 2013-10-22
上傳用戶：manga135
提出一種利用FPGA實(shí)現(xiàn)相關(guān)干涉儀測(cè)向算法的方法，給出了測(cè)向系統(tǒng)的結(jié)構(gòu)和組成框圖，并詳細(xì)介紹了FPGA內(nèi)部模塊的劃分及設(shè)計(jì)流程，最后結(jié)合實(shí)際設(shè)計(jì)出一種實(shí)現(xiàn)方案，并討論了該方案在寬帶測(cè)向中較原有實(shí)現(xiàn)方式的優(yōu)勢(shì)。為了使算法更適于FPGA實(shí)現(xiàn)，提出了一種新的相位樣本選取方法，并仿真驗(yàn)證了該方法與傳統(tǒng)方法的等效性。
上傳時(shí)間： 2013-11-21
上傳用戶：LP06
教學(xué)提示：FX2N系列可編程控制器是日本三菱公司小型PLC的代表產(chǎn)品之一。本章主要介紹FX2N系列可編程控制器的系統(tǒng)特點(diǎn)、型號(hào)說明、技術(shù)指標(biāo)、硬件配置及其等效元件等基本內(nèi)容，是學(xué)習(xí)FX2N系列PLC的基礎(chǔ) 教學(xué)要求： 學(xué)習(xí)、使用可編程控制器首先要熟悉可編程控制器的基本配置情況，例如PLC的技術(shù)指標(biāo)、各單元的功能、輸入輸出點(diǎn)數(shù)、編程器及其他外部設(shè)備的使用等內(nèi)容。要熟練使用可編程控制器必須牢牢掌握兩個(gè)重要基本內(nèi)容——等效元件及編程指令。本章詳細(xì)介紹了FX2N系列可編程控制器的內(nèi)部等效元件，這部分內(nèi)容應(yīng)熟練掌握，尤其是各等效元件的功能、使用方法及編號(hào)范圍應(yīng)重點(diǎn)掌握 3.1 FX2N的系統(tǒng)特點(diǎn)及配置 3.1.1 FX2N的技術(shù)特點(diǎn) 3.1.2 FX2N的型號(hào)說明 3.1.3 FX2N系統(tǒng)的硬件配置3.2 FX2N的編程等效元件3.3 FX2N的技術(shù)指標(biāo)
上傳時(shí)間： 2013-11-25
上傳用戶：liuchee
現(xiàn)代的電子設(shè)計(jì)和芯片制造技術(shù)正在飛速發(fā)展，電子產(chǎn)品的復(fù)雜度、時(shí)鐘和總線頻率等等都呈快速上升趨勢(shì)，但系統(tǒng)的電壓卻不斷在減小，所有的這一切加上產(chǎn)品投放市場(chǎng)的時(shí)間要求給設(shè)計(jì)師帶來了前所未有的巨大壓力。要想保證產(chǎn)品的一次性成功就必須能預(yù)見設(shè)計(jì)中可能出現(xiàn)的各種問題，并及時(shí)給出合理的解決方案，對(duì)于高速的數(shù)字電路來說，最令人頭大的莫過于如何確保瞬時(shí)跳變的數(shù)字信號(hào)通過較長(zhǎng)的一段傳輸線，還能完整地被接收，并保證良好的電磁兼容性，這就是目前頗受關(guān)注的信號(hào)完整性（SI）問題。本章就是圍繞信號(hào)完整性的問題，讓大家對(duì)高速電路有個(gè)基本的認(rèn)識(shí)，并介紹一些相關(guān)的基本概念。 第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1066.2 源同步時(shí)序系統(tǒng).......................................................................................1086.2.1 源同步系統(tǒng)的基本結(jié)構(gòu)...................................................................1096.2.2 源同步時(shí)序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構(gòu)成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關(guān)工具及鏈接..............................................................................120第八章 高速設(shè)計(jì)理論在實(shí)際中的運(yùn)用.............................................................1228.1 疊層設(shè)計(jì)方案...........................................................................................1228.2 過孔對(duì)信號(hào)傳輸?shù)挠绊?..........................................................................1278.3 一般布局規(guī)則...........................................................................................1298.4 接地技術(shù)...................................................................................................1308.5 PCB 走線策略............................................................................................134
標(biāo)簽： 信號(hào)完整性
上傳時(shí)間： 2013-11-01
上傳用戶：xitai
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
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