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AXI-interconnect

  • 采用UART做LIN總線的從節點應用

    采用UART做LIN總線的從節點應用:本應用例使用SPMC75F2313A和通用LIN Bus收發器TJA1020(或ATA6661)實現LIN(Local Interconnect Network)是低成本的汽車網絡的傳輸。1.2 LIN Bus規范LIN 是低成本網絡中的汽車通訊協議標準,LIN(Local Interconnect Network)是低成本的汽車網絡,它是現有多種汽車網絡在功能上的補充由于能夠提高質量、降低成本,LIN 將是在汽車中使用汽車分級網絡的啟動因素。LIN 的標準化將簡化多種現存的多點解決方案且將降低在汽車電子領域中的開發生產服務和后勤成本。LIN 標準包括傳輸協議規范、傳輸媒體規范、開發工具接口規范和用于軟件編程的接口LIN在硬件和軟件上保證了網絡節點的互操作性并有可預測EMC的功能。

    標簽: UART LIN 總線 節點

    上傳時間: 2013-11-19

    上傳用戶:

  • 采用UART做LIN總線的主節點應用

    采用UART做LIN總線的主節點應用:本應用例使用SPMC75F2313A和通用LIN Bus收發器TJA1020(或ATA6661)實現LIN(Local Interconnect Network)是低成本的汽車網絡的傳輸。1.2 LIN Bus規范LIN 是低成本網絡中的汽車通訊協議標準,LIN(Local Interconnect Network)是低成本的汽車網絡,它是現有多種汽車網絡在功能上的補充由于能夠提高質量、降低成本,LIN 將是在汽車中使用汽車分級網絡的啟動因素。LIN 的標準化將簡化多種現存的多點解決方案且將降低在汽車電子領域中的開發生產服務和后勤成本。LIN 標準包括傳輸協議規范、傳輸媒體規范、開發工具接口規范和用于軟件編程的接口LIN在硬件和軟件上保證了網絡節點的互操作性并有可預測EMC的功能。

    標簽: UART LIN 總線 主節點

    上傳時間: 2013-10-15

    上傳用戶:AISINI005

  • 多功能高集成外圍器件

     多功能高集成外圍器件6. 1  多功能高集成外圍器件82371PCI的英文名稱:Peripheral Component Interconnect (外圍部件互聯PCI總線);82371是PCI總線組件。ISA是:Industry Standard Architecture(工業標準體系結構)IDE是 (Integrated Device Electronics)集成電路設備簡稱PIIX4PIIX4器件(芯片)的特點1、是一種支持Pentium和PentiumII微處理器的部件。2、82371對ISA橋來說,是一種多功能PCI總線。3、對可移動性和桌面深綠色環境均提供支持。4、電源管理邏輯。5、被集成化的IDE控制器。6、增強了性能的DMA控制器。 (7)基于兩個82C59的中斷控制器。(8)基于82C54芯片的定時器。(9)USB(Universal Serial Bus)通用串行總線。(10)SMBus系統管理總線。(11)實時時鐘(12)順應Microsoft Win95所需的功能其芯片的邏輯框圖如圖6-1所示。    PIIX4芯片邏輯框圖6.1.1   概述PIIX4芯片是一個多功能的PCI器件,圖6-2 是82371在系統中扮演的角色。(續上圖)1. PCI與EIO之間的橋(PIIX4芯片)橋是不對程的,是各類不同標準總線與PCI總線連接,82371AB橋也可理解為一種總線轉換譯碼器和控制器,橋內包含復雜的協議總線信號和緩沖器。(1).在PCI系統內,當PIIX4操作時,它總是作為系統內各種模塊的主控設備,如USB和DMA控制器、IDE總線和分布式DMA的主控設備等,而且總是以ISA主控設備的名義出現。(2).  在向ISA總線或IDE總線進行傳送操作的傳送周期期間作為從屬設備使用,并對內部寄存器譯碼。PIIX4芯片(橋)的配置(1).可以把PIIX4芯片配置成整個ISA總線,或ISA總線的子集,也可擴展成EIO總線。在使用EIO總線時,可以把未使用的信號配置成通用的輸入和輸出。(2).PIIX4可直接驅動5個ISA插槽;(3).能提供字節-交換邏輯、I/O的恢復支持、等待狀態的生成以及SYSCLK的生成。(4).提供X-BUS鍵盤控制器芯片、BIOS芯片、實時時鐘芯片、二級微程序器等的選擇。2.  IDE接口(總線主控設備的權利和同步DMA方式)IDE接口為4個IDE的設備提供支持,比如IDE接口的硬盤和CD-ROM等。注意:目前硬盤接口有5類:IDE、SCSI、Fibre Channel、IEEE1394和USB等。IDE口幾乎在PC機最多,因為便宜。SCSI多用于服務器和集群機。IDE的PIO IDE速率:14MB/s;而總線主控設備IDE的速率:33MB/s在PIIX4芯片的IDE系統內,配有兩個各次獨立的IDE信號通道。3. 具有兼容性的模塊—DMA、定時器/計數器、中斷控制器等(1)在PIIX4內的兩各82C37 DMA控制器經邏輯的組合,產生7個獨立的可編程通道。通道[0:3]是通過與8個二進位的硬件連線實現的。通過以字節為單位的計數進行傳送。而通道[5:7]是通過16個二進位的連線實現的,以字為單位的計數進行傳送。(2)DMA控制器還能通過PCI總線,處理舊的DMA的兩個不同的方法提供支持。(3)計數/定時器模塊在功能上與82C54等價。(4)中斷控制器與ISA兼容,其功能是兩個82C59的功能之和。

    標簽: 多功能 外圍器件 集成

    上傳時間: 2013-11-19

    上傳用戶:3到15

  • MPC106 PCI橋/存儲器控制器硬件規范說明

    The Motorola MPC106 PCI bridge/memory controller provides a PowerPCªmicroprocessor common hardware reference platform (CHRPª) compliant bridgebetween the PowerPC microprocessor family and the Peripheral Component Interconnect(PCI) bus. In this document, the term Ô106Õ is used as an abbreviation for the phraseÔMPC106 PCI bridge/memory controllerÕ. This document contains pertinent physicalcharacteristics of the 106. For functional characteristics refer to theMPC106 PCI Bridge/Memory Controller UserÕs Manual.This document contains the following topics:Topic PageSection 1.1, ÒOverviewÓ 2Section 1.2, ÒFeaturesÓ 3Section 1.3, ÒGeneral ParametersÓ 5Section 1.4, ÒElectrical and Thermal CharacteristicsÓ 5Section 1.5, ÒPin AssignmentsÓ 17Section 1.6, ÒPinout Listings 18Section 1.7, ÒPackage DescriptionÓ 22Section 1.8, ÒSystem Design InformationÓ 24Section 1.9, ÒDocument Revision HistoryÓ 29Section 1.10, ÒOrdering InformationÓ 29

    標簽: MPC 106 PCI 存儲器

    上傳時間: 2013-11-04

    上傳用戶:as275944189

  • 微型計算機總線知識

    計算機部件要具有通用性,適應不同系統與不同用戶的需求,設計必須模塊化。計算機部件產品(模塊)供應出現多元化。模塊之間的聯接關系要標準化,使模塊具有通用性。模塊設計必須基于一種大多數廠商認可的模塊聯接關系,即一種總線標準??偩€的標準總線是一類信號線的集合是模塊間傳輸信息的公共通道,通過它,計算機各部件間可進行各種數據和命令的傳送。為使不同供應商的產品間能夠互換,給用戶更多的選擇,總線的技術規范要標準化。總線的標準制定要經周密考慮,要有嚴格的規定??偩€標準(技術規范)包括以下幾部分:機械結構規范:模塊尺寸、總線插頭、總線接插件以及按裝尺寸均有統一規定。功能規范:總線每條信號線(引腳的名稱)、功能以及工作過程要有統一規定。電氣規范:總線每條信號線的有效電平、動態轉換時間、負載能力等??偩€的發展情況S-100總線:產生于1975年,第一個標準化總線,為微計算機技術發展起到了推動作用。IBM-PC個人計算機采用總線結構(Industry Standard Architecture, ISA)并成為工業化的標準。先后出現8位ISA總線、16位ISA總線以及后來兼容廠商推出的EISA(Extended ISA)32位ISA總線。為了適應微處理器性能的提高及I/O模塊更高吞吐率的要求,出現了VL-Bus(VESA Local Bus)和PCI(Peripheral Component Interconnect,PCI)總線。適合小型化要求的PCMCIA(Personal Computer Memory Card International Association)總線,用于筆記本計算機的功能擴展。總線的指標計算機主機性能迅速提高,各功能模塊性能也要相應提高,這對總線性能提出更高的要求??偩€主要技術指標有幾方面:總線寬度:一次操作可以傳輸的數據位數,如S100為8位,ISA為16位,EISA為32位,PCI-2可達64位??偩€寬度不會超過微處理器外部數據總線的寬度??倲倒ぷ黝l率:總線信號中有一個CLK時鐘,CLK越高每秒鐘傳輸的數據量越大。ISA、EISA為8MHz,PCI為33.3MHz, PCI-2可達達66.6MHz。單個數據傳輸周期:不同的傳輸方式,每個數據傳輸所用CLK周期數不同。ISA要2個,PCI用1個CLK周期。這決定總線最高數據傳輸率。5. 總線的分類與層次系統總線:是微處理器芯片對外引線信號的延伸或映射,是微處理器與片外存儲器及I/0接口傳輸信息的通路。系統總線信號按功能可分為三類:地址總線(Where):指出數據的來源與去向。地址總線的位數決定了存儲空間的大小。系統總線:數據總線(What)提供模塊間傳輸數據的路徑,數據總線的位數決定微處理器結構的復雜度及總體性能。控制總線(When):提供系統操作所必需的控制信號,對操作過程進行控制與定時。擴充總線:亦稱設備總線,用于系統I/O擴充。與系統總線工作頻率不同,經接口電路對系統總統信號緩沖、變換、隔離,進行不同層次的操作(ISA、EISA、MCA)局部總線:擴充總線不能滿足高性能設備(圖形、視頻、網絡)接口的要求,在系統總線與擴充總線之間插入一層總線。由于它經橋接器與系統總線直接相連,因此稱之為局部總線(PCI)。

    標簽: 微型計算機 總線

    上傳時間: 2013-11-09

    上傳用戶:nshark

  • Xilinx UltraScale:新一代架構滿足您的新一代架構需求(EN)

      中文版詳情瀏覽:http://www.elecfans.com/emb/fpga/20130715324029.html   Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture    The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.   The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.   Some of the UltraScale architecture breakthroughs include:   • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%    • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability   • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization   • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard    • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets   • Greatly enhanced DSP and packet handling   The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.

    標簽: UltraScale Xilinx 架構

    上傳時間: 2013-11-13

    上傳用戶:瓦力瓦力hong

  • AXI總線協議的接口信號

    總線接口的詳細介紹,可在可編程邏輯電路上實現

    標簽: AXI 總線協議 接口信號

    上傳時間: 2013-11-02

    上傳用戶:ccccccc

  • Xilinx UltraScale:新一代架構滿足您的新一代架構需求(EN)

      中文版詳情瀏覽:http://www.elecfans.com/emb/fpga/20130715324029.html   Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture    The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.   The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.   Some of the UltraScale architecture breakthroughs include:   • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%    • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability   • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization   • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard    • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets   • Greatly enhanced DSP and packet handling   The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.

    標簽: UltraScale Xilinx 架構

    上傳時間: 2013-11-21

    上傳用戶:wxqman

  • AXI總線協議的接口信號

    總線接口的詳細介紹,可在可編程邏輯電路上實現

    標簽: AXI 總線協議 接口信號

    上傳時間: 2013-12-15

    上傳用戶:13681659100

  • pci e PCB設計規范

    This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.  

    標簽: pci PCB 設計規范

    上傳時間: 2014-01-24

    上傳用戶:s363994250

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