藍(lán)牙耳機(jī)的參考電路圖(BC4 BGA 6X6)
標(biāo)簽： BC4 6X6 BGA 藍(lán)牙耳機(jī)
上傳時(shí)間： 2013-12-31
上傳用戶：star_in_rain
BGA Binary Genetic Algorithm Matlab Code
標(biāo)簽： Algorithm Genetic Binary Matlab
上傳時(shí)間： 2013-11-30
上傳用戶：zhuyibin
BGA Binary Genetic Algorithm Matlab Code
標(biāo)簽： Algorithm Genetic Binary Matlab
上傳時(shí)間： 2017-08-05
上傳用戶：koulian
電子工藝,質(zhì)量及可靠性相關(guān)專輯 80冊(cè) 902MBGA焊接視頻 5.8M.rar
標(biāo)簽：
上傳時(shí)間： 2014-05-05
上傳用戶：時(shí)代將軍
1.5mm間距BGA封裝庫(kù)BGA芯片封裝ALTIUM庫(kù)(AD庫(kù)PCB封裝庫(kù) )，51個(gè)封裝，列表如下：Component Count : 51Component Name-----------------------------------------------BGA150P3X3-9BGA150P4X4-16BGA150P4X4-16ABGA150P5X5-25BGA150P5X5-25ABGA150P5X5-25BBGA150P6X6-36BGA150P6X6-36ABGA150P6X6-36BBGA150P7X7-49BGA150P7X7-49ABGA150P7X7-49BBGA150P8X8-64BGA150P8X8-64ABGA150P8X8-64BBGA150P9X9-81BGA150P9X9-81ABGA150P10X10-100BGA150P10X10-100ABGA150P11X11-121BGA150P11X11-121ABGA150P12X12-144BGA150P13X13-169BGA150P14X14-196BGA150P14X14-196ABGA150P15X15-225BGA150P15X15-225ABGA150P15X15-225BBGA150P16X16-256BGA150P17X17-289BGA150P18X18-324BGA150P18X18-324ABGA150P19X19-361BGA150P19X19-361ABGA150P20X20-400BGA150P21X21-441BGA150P22X22-484BGA150P22X22-484ABGA150P23X23-529BGA150P24X24-576BGA150P25X25-625BGA150P25X25-625ABGA150P26X26-676BGA150P27X27-729BGA150P28X28-784BGA150P29X29-841BGA150P30X30-900BGA150P30X30-900ABGA150P31X31-961BGA150P32X32-1024BGA150P33X33-1089
標(biāo)簽： BGA封裝庫(kù)
上傳時(shí)間： 2021-11-30
上傳用戶：qingfengchizhu
0.5mm間距BGA封裝庫(kù)BGA芯片封裝ALTIUM庫(kù)(AD庫(kù)PCB封裝庫(kù) )，21個(gè)，封裝型號(hào)列表如下：Component Count : 21Component Name-----------------------------------------------BGA50P5X5-25BGA50P5X5-25VBGA50P6X6-36VBGA50P7X7-48BGA50P7X7-49BGA50P7X7-49VBGA50P8X8-56BGA50P8X8-64BGA50P9X9-80BGA50P9X9-81BGA50P10X10-56BGA50P11X11-100BGA50P11X11-120BGA50P11X11-121BGA50P14X14-100BGA50P14X14-132BGA50P14X14-196BGA50P15X15-164BGA50P18X18-180BGA50P19X19-281BGA50P20X20-256
標(biāo)簽： BGA封裝庫(kù)
上傳時(shí)間： 2021-11-30
上傳用戶：
0.8mm間距BGA封裝庫(kù)BGA芯片封裝ALTIUM庫(kù)(AD庫(kù)PCB封裝庫(kù) )，50個(gè)，PCB封裝列表：Component Count : 50Component Name-----------------------------------------------BGA80P6X6-36BGA80P7X7-48BGA80P7X7-49BGA80P7X7-49ABGA80P8X6-48BGA80P8X8-64BGA80P8X8-64ABGA80P8X8-64BBGA80P9X9-81BGA80P10X10-84BGA80P10X10-100BGA80P10X10-100ABGA80P12X12-128BGA80P12X12-128ABGA80P12X12-128BBGA80P12X12-144BGA80P12X12-144ABGA80P13X13-144ABGA80P13X13-144BBGA80P13X13-144CBGA80P13X13-152BGA80P13X13-169BGA80P14X14-160BGA80P14X14-180BGA80P14X14-180ABGA80P14X14-196BGA80P14X14-196ABGA80P15X15-176BGA80P15X15-177BGA80P16X16-208BGA80P16X16-256BGA80P16X16-256ABGA80P17X17-208BGA80P17X17-208ABGA80P17X17-256BGA80P17X17-272BGA80P17X17-289BGA80P19X19-257BGA80P19X19-257ABGA80P19X19-280ABGA80P19X19-280BBGA80P19X19-280CBGA80P19X19-288BGA80P19X19-332BGA80P20X20-324BGA80P20X20-363BGA80P22X22-240BGA80P22X22-340BGA80P22X22-384BGA80P22X22-484
標(biāo)簽： BGA封裝庫(kù)
上傳時(shí)間： 2021-11-30
上傳用戶：xsr1983
1mm間距BGA芯片封裝庫(kù)ALTIUM庫(kù)PCB封裝庫(kù)(AD庫(kù) )，114個(gè)，封裝庫(kù)型號(hào)列表：Component Count : 114Component Name-----------------------------------------------BGA100P5X5-25BGA100P6X6-36BGA100P6X6-36ABGA100P7X7-49BGA100P7X7-49ABGA100P8X8-64BGA100P8X8-64ABGA100P9X9-81BGA100P9X9-81ABGA100P10X10-100BGA100P10X10-100ABGA100P10X10-100BBGA100P10X10-100CBGA100P11X11-121BGA100P11X11-121ABGA100P12X12-144BGA100P12X12-144ABGA100P12X12-144BBGA100P13X13-169BGA100P13X13-169ABGA100P14X14-160BGA100P14X14-176BGA100P14X14-196BGA100P14X14-196BBGA100P15X15-225BGA100P16X16-208BGA100P16X16-256BGA100P16X16-256BBGA100P16X16-256CBGA100P17X17-169BGA100P17X17-289BGA100P18X18-320BGA100P18X18-324BGA100P19X19-361BGA100P20X20-292BGA100P20X20-400BGA100P20X20-400ABGA100P21X21-441BGA100P22X22-324BGA100P22X22-388BGA100P22X22-456BGA100P22X22-484BGA100P22X22-484BBGA100P22X22-484CBGA100P22X22-484DBGA100P23X23-413BGA100P23X23-529BGA100P24X24-552BGA100P24X24-552ABGA100P24X24-552BBGA100P24X24-576BGA100P24X24-576ABGA100P25X25-625BGA100P26X26-352BGA100P26X26-388BGA100P26X26-416BGA100P26X26-452BGA100P26X26-456ABGA100P26X26-484BGA100P26X26-665BGA100P26X26-668BGA100P26X26-672BGA100P26X26-675BGA100P26X26-676BGA100P26X26-676ABGA100P27X27-729BGA100P28X28-780BGA100P28X28-780ABGA100P28X28-783BGA100P28X28-784BGA100P29X29-841BGA100P30X30-516BGA100P30X30-556BGA100P30X30-676BBGA100P30X30-896ABGA100P30X30-900BGA100P31X31-961BGA100P32X32-772BGA100P32X32-772ABGA100P32X32-1020BGA100P32X32-1024BGA100P33X33-1089BGA100P34X34-580BGA100P34X34-680BGA100P34X34-1136BGA100P34X34-1148BGA100P34X34-1152ABGA100P34X34-1152BBGA100P34X34-1153BGA100P34X34-1156BGA100P36X36-1296BGA100P37X37-1369BGA100P38X38-1444BGA100P39X39-680BGA100P39X39-680ABGA100P39X39-792BGA100P39X39-896BGA100P39X39-1508ABGA100P39X39-1513BGA100P39X39-1517BGA100P39X39-1521BGA100P41X41-1681BGA100P42X42-860BGA100P42X42-1696BGA100P42X42-1704BGA100P42X42-1738BGA100P42X42-1760BGA100P42X42-1764
上傳時(shí)間： 2021-11-30
上傳用戶：
印刷線路板制作技術(shù)大全-高速PCB設(shè)計(jì)指南:改進(jìn)電路設(shè)計(jì)規(guī)程提高可測(cè)試性隨著微型化程度不斷提高，元件和布線技術(shù)也取得巨大發(fā)展，例如BGA外殼封裝的高集成度的微型IC，以及導(dǎo)體之間的絕緣
標(biāo)簽： PCB 印刷線路板制 技術(shù)大全 設(shè)計(jì)指南
上傳時(shí)間： 2013-06-26
上傳用戶：waitingfy
現(xiàn)代信息技術(shù)的迅猛發(fā)展，使得圖像處理方面的研究與應(yīng)用，尤其是實(shí)時(shí)圖像處理引起了更廣泛的關(guān)注。近年來，隨著嵌入式和DSP技術(shù)的不斷發(fā)展，數(shù)字信號(hào)處理領(lǐng)域的理論研究成果被逐漸應(yīng)用到實(shí)際系統(tǒng)中，從而推動(dòng)了新理論的產(chǎn)生和應(yīng)用，對(duì)圖像處理等領(lǐng)域的技術(shù)發(fā)展起到了十分重要的作用。可見，研究如何將ARM和DSP雙處理器結(jié)構(gòu)應(yīng)用于實(shí)時(shí)圖像處理系統(tǒng)的新方法有著非常重要的理論價(jià)值和應(yīng)用價(jià)值。本文主要研究?jī)?nèi)容如下： 1.分析了實(shí)時(shí)圖像處理領(lǐng)域的最新發(fā)展，得出了以ARM和DSP分別作為實(shí)時(shí)圖像處理系統(tǒng)核心的優(yōu)勢(shì)和劣勢(shì)，結(jié)合本課題實(shí)時(shí)性，高效性和便攜性的特點(diǎn)，設(shè)計(jì)一個(gè)以ARM+DSP雙處理器為核心的通用實(shí)時(shí)圖像處理系統(tǒng)，并通過增加或裁剪可以廣泛應(yīng)用于圖像處理和圖像識(shí)別領(lǐng)域。 2.掌紋識(shí)別技術(shù)是繼指紋識(shí)別和虹膜識(shí)別后人體生物特征識(shí)別領(lǐng)域中最新的研究方向，正處在不斷的研究和探索階段。在論文中，介紹了以ARM+DSP雙處理器為核心的通用實(shí)時(shí)圖像處理系統(tǒng)和掌紋識(shí)別技術(shù)相融合的實(shí)例，構(gòu)成最基本的脫機(jī)掌紋識(shí)別系統(tǒng)，給出了系統(tǒng)的組成和運(yùn)行的基本流程，實(shí)現(xiàn)最基本的識(shí)別功能，降低成本，提升實(shí)時(shí)掌紋識(shí)別系統(tǒng)的性能。 3.具體設(shè)計(jì)中，在對(duì)兩種系統(tǒng)組成方案經(jīng)過比較后，選擇了基于TI公司的TMS320VC5470雙核處理器為核心，根據(jù)TMS320VC5470芯片的特點(diǎn)，對(duì)系統(tǒng)平臺(tái)的硬件原理進(jìn)行設(shè)計(jì)，擴(kuò)充了進(jìn)行研究所需的片外RAM，ROM(Flash)，人機(jī)接口電路，外圍接口電路，仿真接口JTAG等。隨后根據(jù)原理圖所需器件，選擇相對(duì)應(yīng)的封裝形式，設(shè)計(jì)8層印刷電路板，對(duì)BGA封裝形式芯片的扇出方式，布線規(guī)則以及高速數(shù)字電路與高速PCB設(shè)計(jì)中涉及的信號(hào)完整性問題予以重點(diǎn)研究，較好解決了高密度BGA封裝集成電路的布線及其電磁兼容性問題。除此之外，在軟件設(shè)計(jì)方面，討論了針對(duì)TMS320VC5470系統(tǒng)脫離主機(jī)開發(fā)環(huán)境成為獨(dú)立系統(tǒng)時(shí)雙核Bootload的實(shí)現(xiàn)、雙核間通訊及程序固化到FLASH中的方法。 本文所做的創(chuàng)新工作是將ARM和DSP有效的相結(jié)合，使他們?cè)趯?shí)時(shí)圖像處理系統(tǒng)中發(fā)揮各自的優(yōu)勢(shì)，克服自身的劣勢(shì)，提升了實(shí)時(shí)圖像處理系統(tǒng)的性能，縮小了體積，節(jié)約了成本；并基于上述研究成果，將該ARM+DSP實(shí)時(shí)圖像處理系統(tǒng)和最新的掌紋識(shí)別的原理相結(jié)合，構(gòu)成了手持式掌紋識(shí)別系統(tǒng)，對(duì)于實(shí)時(shí)掌紋識(shí)別技術(shù)的研究有著非常重要意義。
標(biāo)簽： ARMDSP 實(shí)時(shí)圖像 處理系統(tǒng)
上傳時(shí)間： 2013-07-31
上傳用戶：muyehuli
蟲蟲下載站版權(quán)所有 京ICP備2021023401號(hào)-1
