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LLCR Pin Socket Testing with the Model 3732 High Density Matrix Card
Computer processors (CPUs) today have come a long way from the computer processors of the past. They draw more power, run at lower voltages, and have more pins than ever Before.
PICkit™ 2 Microcontroller Programmer USER’S GUIDE
This chapter contains general information that will be useful to know Before using thePICkit™ 2 Microcontroller Programmer. Items discussed in this chapter include:• Document Layout• Conventions Used in this Guide• Warranty Registration• Recommended Reading• The Microchip Web Site• Development Systems Customer Change Notification Service• Customer Support• Document Revision History
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their productsor to discontinue any product or service without notice, and advise customers to obtain the latestversion of relevant information to verify, Before placing orders, that information being relied onis current and complete. All products are sold subject to the terms and conditions of sale suppliedat the time of order acknowledgement, including those pertaining to warranty, patentinfringement, and limitation of liability.
Designing Boards with Atmel AT89C51, AT89C52, AT89C1051, and AT89C2051 for Writing Flash at In-Circuit Test:Recent improvements in chips andtesters have made it possible for thetester to begin taking over the role traditionallyassigned to the PROM programmer.Instead of having a PROM programmerwrite nonvolatile memoriesBefore assembling the board, the in-circuittester writes them during in-circuittesting operations. Many Teradyne Z18-series testers are now in use loadingcode into nonvolatile memories, microcontrollersand in-circuit programmable logic devices. The purpose of this note is to explain how the Z18 approaches the writing task for Atmel AT89C series IC’s,so that designers of boards using these chips can get the best results.
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their productsor to discontinue any product or service without notice, and advise customers to obtain the latestversion of relevant information to verify, Before placing orders, that information being relied onis current and complete. All products are sold subject to the terms and conditions of sale suppliedat the time of order acknowledgement, including those pertaining to warranty, patentinfringement, and limitation of liability
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Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never Before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
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Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never Before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
Abstract: This application note presents an overview of electronic margining and its value in detectingpotential system failures Before a product ships from the factory. It is a calibration method that effectivelypredicts and allows adjustments to improve product quality. Margining also can be used to sort productsinto performance levels, allowing premium products to be sold at premium prices. We discuss thedownside of sorting and suggest alternative ways to segregate products.
Have you had the exasperating experience of a laptop orPDA defi antly not responding to your commands? Youfrantically press key after key, but to no avail. As hopeturns to anger (but just Before you throw the company’slaptop through the window) you slam your fi nger againstthe on/off power button. Ten seconds later, your laptopfi nally surrenders and the screen goes black in a highpitched whimper.
