Many CAD users dismiss schematic capture as a necessary evil in the process of creating\r\nPCB layout but we have always disputed this point of view. With PCB layout now offering\r\nautomation of both component placement and track routing, getting the des
•Founded in Jan. 08, 2001 in Shanghai, China.•Fabless IDH focused on Analog & Mixed Signal Chip design & marketing •Over 100 IC introduced.•Over 200 OEM Customer worldwide•ISO-9000 Certified•Distribution Channel in Taiwan, China & Japan
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Leverages on proprietary process and world-class engineering team to develop innovative & high quality analog solutions that add value to electronics equipment.
Abstract: The rapid build out of today's smart grid raises a number of security questions. In this article,we review two recent well-documented security breaches and a report of a security gap. These situationsinclude a 2009 smart-meter hack in Puerto Rico; a 2012 password discovery in grid distributionequipment; and insecure storage of a private key in distribution automation equipment. For each of theseattacks, we examine the breach, the potential threat, and secure silicon methods that, as part of acomplete security strategy, can help thwart the attacks.
Automotive power systems are unforgiving electronicenvironments. Transients to 90V can occur when thenominal voltage range is 10V to 15V (ISO7637), along withbattery reversal in some cases. It’s fairly straightforwardto build automotive electronics around this system, butincreasingly end users want to operate portable electronics,such as GPS systems or music/video players,and to charge their Li-Ion batteries from the automotivebattery. To do so requires a compact, robust, effi cientand easy-to-design charging system
Abstract: This application note describes how to build, debug, and run applications on the on-board MAXQ622microcontroller to interface with the DS8005 dual smart card interface. This is demonstrated in both IAREmbedded Workbench and the Rowley CrossWorks IDE, using sample code provided with the kit.
匯編器在微處理器的驗證和應用中舉足輕重，如何設計通用的匯編器一直是研究的熱點之一。本文提出了一種開放式的匯編器系統設計思想，在匯編語言與機器語言間插入中間代碼CMDL（code mapping description language）語言，打破匯編語言與機器語言的直接映射關系，由此建立起一套描述匯編語言與機器語言的開放式映射體系。基于此開放式映射體系開發了一套匯編器系統，具有較高層次上的通用性和可移植性。【關鍵詞】指令集，CMDL，匯編器，開放式
Design of Retargetable Assembler System Liu Ling Feng Wen Nan Wang Ying Chun Jiang An Ping Ji Li Jiu IME of Peking University, 100871【摘要】An assembler plays a very important role in the field of microprocessor verifications and applications, thus how to build a retargetable assembler system has been a hotspot in this field for long time. This paper presents a new method about the retargetable assembler system design.It provides a kind of language CMDL, code mapping description language. During the process of assembling, assembler languages are firstly translated to CMDL, and then mapped to the machine codes. In an other word, CMDL is inserted between assembler languages and machine codes during the translation procedure. As a medium code, CMDL has a lot of features, such as high extraction, strong descript capabilities. It can describe almost all attributes of assembler languages. By breaking the direct mapping relationship between assembler languages and machine codes, the complexities of machine codes are hided to the users, therefore, the new retargetable assembler system has higher retargetable level by converting the mapping from assembler languages and machine codes to assembler languages and CMDL, and implementationof it becomes easier. Based on the new mapping system structure, a retargetable assemblersystem is developed. It proved the whole system has good retargetability and implantability.【關鍵詞】instruction set, symbol table, assembler, lexical analysis, retargetability
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Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
