This example provides a description of how to use the USART with hardware flowcontrol and communicate with the Hyperterminal.First, the USART2 sends the TxBuffer to the hyperterminal and still waiting fora string from the hyperterminal that you must enter which must end by '\r'character (keypad ENTER button). Each byte received is retransmitted to theHyperterminal. The string that you have entered is stored in the RxBuffer array. The receivebuffer have a RxBufferSize bytes as maximum.
The USART2 is configured as follow: - BaudRate = 115200 baud - Word Length = 8 Bits - One Stop Bit - No parity - Hardware flow control enabled (RTS and CTS signals) - Receive and transmit enabled - USART Clock disabled - USART CPOL: Clock is active low - USART CPHA: Data is captured on the second edge - USART LastBit: The clock pulse of the last data bit is not output to the SCLK pin
Abstract: This application note discusses the development and deployment of 3G cellular femtocell base stations. The technicalchallenges for last-mile residential connectivity and adding system capacity in dense urban environments are discussed, with 3Gfemtocell base stations as a cost-effective solution. Maxim's 3GPP TS25.104-compliant transceiver solution is presented along withcomplete radio reference designs such as RD2550. For more information on the RD2550, see reference design 5364, "FemtocellRadio Reference Designs Using the MAX2550–MAX2553 Transceivers."
The SDI standards are the predominant standards for uncompressed digital videointerfaces in the broadcast studio and video production center. The first SDI standard,SD-SDI, allowed standard-definition digital video to be transported over the coaxial cableinfrastructure initially installed in studios to carry analog video. Next, HD-SDI wasto support high-definition video. Finally, dual link HD-SDI and 3G-SDIdoubled the bandwidth of HD-SDI to support 1080p (50 Hz and 60 Hz) and other videoformats requiring more bandwidth than HD-SDI provides.
The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously.
FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many applications, let alone for System Level Integration (SLI). Plus, the development
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
Abstract: Many modern industrial, medical, and commercial applications require temperature measurements in the extended temperature rangewith accuracies of ±0.3°C or better, performed with reasonable cost and often with low power consumption. This article explains how platinumresistance temperature detectors (PRTDs) can perform measurements over wide temperature ranges of -200°C to +850°C, with absolute accuracyand repeatability better than ±0.3°C, when used with modern processors capable of resolving nonlinear mathematical equation quickly and costeffectively. This article is the second installment of a series on PRTDs. For the first installment, please read application note 4875, "High-Accuracy Temperature Measurements Call for Platinum Resistance Temperature Detectors (PRTDs) and Precision Delta-Sigma ADCs."
