SFP模塊的國際標準. Cooperation Agreement for Small Form-Factor Pluggable Transceivers
標簽： Transceivers Cooperation Form-Factor Agreement
上傳時間： 2015-09-05
上傳用戶：h886166
CP-1000 是 Antec 新的高階電源供應器.結合全新的技術,CP-1000 提供了絕佳的性價比. 新的功能有: 革新的電路設計; 較大的空間可以安排電子零件及增進風流; 直流式的風道設計,讓風扇的風可以直接吹進機身內(nèi)部. 使用較大的風扇在低轉速時就可以提供很好的風流效果,而且還不會制造噪音. Antec 新的 form factor: CPX, 他比其他標準大小也使用大風扇的 PSU 可以提供更好的風流效果. CP-1000 可以安裝在 Antec 的Performance One 和 Gaming 機箱上,包含 Twelve Hundred, P183 和 P193.
上傳時間： 2013-10-17
上傳用戶：lijianyu172
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-11-21
上傳用戶：不懂夜的黑
Abstract: The reality of modern, small Form-Factor ceramic capacitors is a good reminder to always readthe data sheet. This tutorial explains how ceramic capacitor type designations, such as X7R and Y5V,imply nothing about voltage coefficients. Engineers must check the data to know, really know, how aspecific capacitor will perform under voltage.
上傳時間： 2013-11-04
上傳用戶：梧桐
A major societal challenge for the decades to come will be the delivery of effective medical services while at the same time curbing the growing cost of healthcare. It is expected that new concepts-particularly electronically assisted healthcare will provide an answer. This will include new devices, new medical services as well as networking. On the device side, impressive innovation has been made possible by micro- and nanoelectronics or CMOS Integrated Circuits. Even higher accuracy and smaller form factor combined with reduced cost and increased convenience of use are enabled by incorporation of CMOS IC design in the realization of biomedical systems. The compact hearing aid devices and current pacemakers are good examples of how CMOS ICs bring about these new functionalities and services in the medical field. Apart from these existing applications, many researchers are trying to develop new bio-medical solutions such as Artificial Retina, Deep Brain Stimulation, and Wearable Healthcare Systems. These are possible by combining the recent advances of bio-medical technology with low power CMOS IC technology.
上傳時間： 2017-02-06
上傳用戶：linyj
The SA7527 is an active power factor correction(PFC)controller for boost PFC application whic
標簽： Correction Circuit Design Factor
上傳時間： 2013-04-24
上傳用戶：onewq
struts in action, 詳細介紹action,form的使用方法。經(jīng)典
上傳時間： 2013-12-22
上傳用戶：hustfanenze
如何使用圖形對象（如Form，Image等）的畫布（Canvas）在C++Builder應用程序中繪制圖形
上傳時間： 2013-12-18
上傳用戶：zgu489
改變Form的標題
上傳時間： 2013-12-11
上傳用戶：kristycreasy
