多遠(yuǎn)程二極管溫度傳感器-Design Considerations for pc thermal management
Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and placement issues encountered when trying to place external sensors. PCB component count decreases when using a device that provides multiple inputs.Better temperature sensing improves product performance and reliability. Disk drive data integrity suffers at elevated temperatures. IBM published an article stating that a 5°C rise in operating temperature causes a 15% increase in the drive’s failure rate. The overall performance of a system can be IMproved by providing a more accurate temperature measurement of the most critical devices allowing them to run just a few degrees hotter.The LM83 directly senses its own temperature and the temperature of three external PN junctions. One is dedicated to the CPU of choice, the other two go to other parts of your system that need thermal monitoring such as the disk drive or graphics chip. The SMBus-compatible LM83 supports SMBus timeout and logic levels. The LM83 has two interrupt outputs; one for user-programmable limits and WATCHDOG capability (INT), the other is a Critical Temperature Alarm output (T_CRIT_A) for system power supply shutdown.
The CC1101 is a low-cost sub- 1 GHztransceiver designed for very low-powerwireless applications. The circuit is mainlyintended for the ISM (Industrial, Scientific andMedical) and SRD (Short Range Device)frequency bands at 315, 433, 868, and 915MHz, but can easily be programmed foroperation at other frequencies in the 300-348MHz, 387-464 MHz and 779-928 MHz bands.CC1101 is an IMproved and code compatibleversion of the CC1100 RF transceiver. Themain improvements on the CC1101 include:
Abstract: This application note illustrates the flexibility of the MAX7060 ASK/FSK transmitter. While the currently available evaluationkit (EV kit) has been optimized for the device's use in a specific frequency band (i.e., 288MHz to 390MHz), this document addresseshow the EV kit circuitry can be modified for IMproved operation at 433.92MHz, a frequency commonly used in Europe. Twoalternative match and filter configurations are presented: one for optimizing drain efficiency, the other for achieving higher transmitpower. Features and capabilities of earlier Maxim industrial, scientific, and medical radio-frequency (ISM-RF) transmitters areprovided, allowing comparison of the MAX7060 to its predecessors. Several design guidelines and cautions for using the MAX7060are discussed.
為滿足無線網(wǎng)絡(luò)技術(shù)具有低功耗、節(jié)點(diǎn)體積小、網(wǎng)絡(luò)容量大、網(wǎng)絡(luò)傳輸可靠等技術(shù)要求，設(shè)計(jì)了一種以MSP430單片機(jī)和CC2420射頻收發(fā)器組成的無線傳感節(jié)點(diǎn)。通過分析其節(jié)點(diǎn)組成，提出了ZigBee技術(shù)中的幾種網(wǎng)絡(luò)拓?fù)湫问剑⒀芯苛薢igBee路由算法。針對(duì)不同的傳輸要求形式選用不同的網(wǎng)絡(luò)拓?fù)湫问娇梢员M大可能地減少系統(tǒng)成本。同時(shí)針對(duì)不同網(wǎng)絡(luò)選用正確的ZigBee路由算法有效地減少了網(wǎng)絡(luò)能量消耗，提高了系統(tǒng)的可靠性。應(yīng)用試驗(yàn)表明，采用ZigBee方式通信可以提高傳輸速率且覆蓋范圍大，與傳統(tǒng)的有線通信方式相比可以節(jié)約40%左右的成本。
Abstract:
To improve the proposed technical requirements such as low-ower， small nodes， large capacity and reliable network transmission， wireless sensor nodes based on MSP430 MCU and CC2420 RF transceiver were designed. This paper provided network topology of ZigBee technology by analysing the component of the nodes and researched ZigBee routing algorithm. Aiming at different requirements of transmission mode to choose the different network topologies form can most likely reduce the system cost. And aiming at different network to choose the correct ZigBee routing algorithm can effectively reduced the network energy consumption and IMproved the reliability of the system. Results show that the communication which used ZigBee mode can improve the transmission rate， cover more area and reduce 40% cost compared with traditional wired communications mode.
本軟件是關(guān)于MAX338, MAX339的英文數(shù)據(jù)手冊(cè)：MAX338, MAX339 8通道/雙4通道、低泄漏、CMOS模擬多路復(fù)用器
The MAX338/MAX339 are monolithic, CMOS analog multiplexers (muxes). The 8-channel MAX338 is designed to connect one of eight inputs to a common output by control of a 3-bit binary address. The dual, 4-channel MAX339 is designed to connect one of four inputs to a common output by control of a 2-bit binary address. Both devices can be used as either a mux or a demux. On-resistance is 400Ω max, and the devices conduct current equally well in both directions.
These muxes feature extremely low off leakages (less than 20pA at +25°C), and extremely low on-channel leakages (less than 50pA at +25°C). The new design offers guaranteed low charge injection (1.5pC typ) and electrostatic discharge (ESD) protection greater than 2000V, per method 3015.7. These IMproved muxes are pin-compatible upgrades for the industry-standard DG508A and DG509A. For similar Maxim devices with lower leakage and charge injection but higher on-resistance, see the MAX328 and MAX329.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide IMproved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. IMproved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
8051參考設(shè)計(jì)，與其他8051的免費(fèi)IP相比，文檔相對(duì)較全，Oregano System 提供
This is version 1.3 of the MC8051 IP core.
September 2002: Oregano Systems - Design & Consulting GesmbH
Change history:
- IMproved tb_mc8051_siu_sim.vhd to verify duplex operation.
- Corrected problem with duplex operation in file
mc8051_siu_rtl.vhd
mp3設(shè)計(jì)程序資料，采用c語言編寫。
README file for
yampp-3 source code 2001-05-27
This is the current state of the yampp-3 source code, 2001-05-27.
This code is intended to run on Rev. B of the yampp-3 PCB, but can
ofcourse be used on compatible systems as well.
It still uses the "old" song selection system as the yampp-2.
However, the disk handling routines has IMproved a lot and the
obviosly, the new VS1001 handling has been put in.
The codesize is almost at it s maximum at 1F40 bytes.
A .ROM file is included if you don t have the compiler set up.
For now, the documentation is in the code
- MP3 streaming support for Shoutcast/Icecast added.
- Ogg Vorbis support added.
- Playlist implementation and M3U support added.
- JavaLayer 0.1.1 included to improve MP3 support.
- WinAmp Skins 2.0 support IMproved.
- Seek bar added (for WAV files only).
