The field of microelectromechanical systems (MEMS), particularly micromachinedmechanical transducers, has been expanding over recent years, and the productioncosts of these devices continue to fall. Using materials, fabrication processes, anddesign tools originally developed for the microelectronic circuits industry, newtypes of microengineered device are evolving all the time—many offering numerousadvantages over their traditional counterparts. The electrical properties of siliconhave been well understood for many years, but it is the mechanical properties thathave been exploited in many examples of MEMS. This book may seem slightlyunusual in that it has four editors. However, since we all work together in this fieldwithin the School of Electronics and Computer Science at the University of Southampton,it seemed natural to work together on a project like this. MEMS are nowappearing as part of the syllabus for both undergraduate and postgraduate coursesat many universities, and we hope that this book will complement the teaching thatis taking place in this area.
The Maxim Integrated 71M6541-DB REV 3.0 Demo Board is a demonstration board for evaluating the 71M6541 device for single-phase electronic energy metering applications in conjunction with the Remote Sensor Inter-face. It incorporates a 71M6541 integrated circuit, a 71M6601 Remote Interface IC, peripheral circuitry such as a serial EEPROM, emulator port, and on-board power supply. A serial to USB converter allows communication to a PC through a USB port. The Demo Board allows the evaluation of the 71M6541 energy meter chip for measurement accuracy and overall system use.
The CC1101 is a low-cost sub- 1 GHztransceiver designed for very low-powerwireless applications. The circuit is mainlyintended for the ISM (Industrial, Scientific andMedical) and SRD (Short Range Device)frequency bands at 315, 433, 868, and 915MHz, but can easily be programmed foroperation at other frequencies in the 300-348MHz, 387-464 MHz and 779-928 MHz bands.CC1101 is an improved and code compatibleversion of the CC1100 RF transceiver. Themain improvements on the CC1101 include:
Abstract: When people want portable music, they usually rely on battery-powered audio devices. With a bit of engineeringblood (or curiosity) running in your veins, it is not difficult to build a wireless Bluetooth® stereo audio system that can becontrolled with any device that has a Bluetooth connection and a music player
Abstract: This application note helps system designers choose the correct external components for use with the MAX16948 dualremote antenna LDO/switch, thus ensuring that automobile-regulated phantom antenna supply and output-current-monitoring circuitrymeet performance objectives. An electronic calculator is provided that helps specify the critical external components for theMAX16948, thus reducing design time. The calculator also determines the device's analog output voltage, output current-limitthreshold, and output current-sensing accuracies. The calculator includes new automatic Step By Step feature that assists designerswith component choice. To use the new automatic feature, click on the Step By Step button relative to the desired section.
The LTC®3207/LTC3207-1 is a 600mA LED/Camera driverwhich illuminates 12 Universal LEDs (ULEDs) and onecamera fl ash LED. The ULEDs are considered universalbecause they may be individually turned on or off, setin general purpose output (GPO) mode, set to blink at aselected on-time and period, or gradate on and off at aselected gradation rate. This device also has an externalenable (ENU) pin that may be used to blink, gradate, orturn on/off the LEDs without using the I2C bus. This may beuseful if the microprocessor is in sleep or standby mode. Ifused properly, these features may save valuable memoryspace, programming time, and reduce the I2C traffi c.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
The high defi nition multimedia interface (HDMI) is fastbecoming the de facto standard for passing digitalaudio and video data in home entertainment systems.This standard includes an I2C type bus called a displaydata channel (DDC) that is used to pass extended digitalinterface data (EDID) from the sinkdevice (such as adigital TV) to the source device (such as a digital A/Vreceiver). EDID includes vital information on the digitaldata formats that the sink device can accept. The HDMIspecifi cation requires that devices have less than 50pFof input capacitance on their DDC bus lines, which canbe very diffi cult to meet. The LTC®4300A’s capacitancebuffering feature allows devices to pass the HDMI DDCinput capacitance compliance test with ease.
