The ISO7220 and ISO7221 are dual-channel digital isolators. To facilitate PCB layout, the channels are orientedin the same direction in the ISO7220 and in opposite directions in the ISO7221. These devices have a logic inputand output buffer separated by TI’s SILICON-dioxide (SiO2) isolation barrier, providing galvanic isolation of up to4000 V. Used in conjunction with isolated power supplies, these devices block high voltage, isolate grounds, andprevent noise currents on a data bus or other circuits from entering the local ground and interfering with ordamaging sensitive circuitry.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in SILICON technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
The field of microelectromechanical systems (MEMS), particularly micromachinedmechanical transducers, has been expanding over recent years, and the productioncosts of these devices continue to fall. Using materials, fabrication processes, anddesign tools originally developed for the microelectronic circuits industry, newtypes of microengineered device are evolving all the time—many offering numerousadvantages over their traditional counterparts. The electrical properties of SILICONhave been well understood for many years, but it is the mechanical properties thathave been exploited in many examples of MEMS. This book may seem slightlyunusual in that it has four editors. However, since we all work together in this fieldwithin the School of Electronics and Computer Science at the University of Southampton,it seemed natural to work together on a project like this. MEMS are nowappearing as part of the syllabus for both undergraduate and postgraduate coursesat many universities, and we hope that this book will complement the teaching thatis taking place in this area.
Abstract: This reference design provides design ideas for a cost-effective, low-power liquid-level measurement dataacquisition system (DAS) using a compensated SILICON pressure sensor and a high-precision delta-sigma ADC. Thisdocument discusses how to select the compensated SILICON pressure sensor, suggest system algorithms, and providenoise analyses. It also describes calibration ideas to improve system performance while also reducing complexity andcost.
The super-junction structure, which has P-type pillar layers as shown left,
realizes high withstand voltage and ON-resistance lower than the conventional
theoretical limit of SILICON.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in SILICON technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
SILICON Motion, Inc. has made best efforts to ensure that the information contained in this document is accurate andreliable. However, the information is subject to change without notice. No responsibility is assumed by SILICONMotion, Inc. for the use of this information, nor for infringements of patents or other rights of third parties.Copyright NoticeCopyright 2002, SILICON Motion, Inc. All rights reserved. No part of this publication may be reproduced, photocopied,or transmitted in any form, without the prior written consent of SILICON Motion, Inc. SILICON Motion, Inc. reserves theright to make changes to the product specification without reservation and without notice to our users
