Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
Applying power to a standard logic chip, SRAM, or EPROM, usually results in output pinstracking the applied voltage as it rises. Programmable logic attempts to emulate that behavior,but physics forbids perfect emulation, due to the device programmability. It requires care tospecify the pin behavior, because programmable parts encounter unknown variables – yourdesign and your power environment.
