In this first part of the book the Vienna Link Level (LL) Simulators are described. The first chapter provides basics of LL simulations, introduces the most common variables and parameters as well as the transceiver Structures that are applied in Long-Term Evolution (LTE) and Long-Term Evolution-Advanced (LTEA). We focus here mostly on the Downlink (DL) of LTE as most results reported in later chapters are related to DL transmissions.
標(biāo)簽： LTE-Advanced Simulators Vienna
上傳時(shí)間： 2020-06-01
上傳用戶：shancjb
Electrostatic discharge (ESD) is one of the most prevalent threats to the reliability of electronic components. It is an event in which a finite amount of charge is trans- ferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time, and, hence, more than 35% of chip damages can be attributed to an ESD-related event. As such, designing on-chip ESD Structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry.
標(biāo)簽： Electrostatic Protection Discharge
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
Electrostatic discharge (ESD) phenomena have been known to mankind since the Greek Empire when Thales of Miletus, one of the Seven Sages of Greece, noticed the attraction of strands of hay to amber, leading to the coining of the word “electron.” Electrical discharge and the guiding of electrical discharge (e.g., lightning) was of interest to Benjamin Franklin in the 1700s, with the invention of the lightning rod. The lightning rod was mankind’s first effort to guide the electrical discharge current of a lightning strike in a direction that would not harm Structures.
標(biāo)簽： Circuits Devices 2015 ESD and
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
ESD is a crucial factor for integrated circuits and influences their quality and reliability. Today increasingly sensitive processes with deep sub micron Structures are developed. The integration of more and more functionality on a single chip and saving of chip area is required. Integrated circuits become more susceptible to ESD/EOS related damages. However, the requirements on ESD robustness especially for automotive applications are increasing. ESD failures are very often the reason for redesigns. Much research has been conducted by semiconductor manufacturers on ESD robust design.
標(biāo)簽： Guidelines Design Basic ESD
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
As we enter the next millennium, there are clear technological patterns. First, the electronic industry continues to scale microelectronic Structures to achieve faster devices, new devices, or more per unit area. Secondly, electrostatic charge, electrostatic discharge (ESD), electrical overstress (EOS) and electromagnetic emissions (EMI) continue to be a threat to these scaled Structures. This dichotomy presents a dilemma for the scaling of semiconductor technologies and a future threat to new technologies. Technological advancements, material changes, design techniques, and simulation can fend off this growing concern – but to maintain this ever-threatening challenge, one must continue to establish research and education in this issue.
標(biāo)簽： ESD-Phenomena-and-the-Reliability
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
Microengineering and Microelectromechanical systems (MEMS) have very few watertight definitions regarding their subjects and technologies. Microengineering can be described as the techniques, technologies, and practices involved in the realization of Structures and devices with dimensions on the order of micrometers. MEMS often refer to mechanical devices with dimensions on the order of micrometers fabricated using techniques originating in the integrated circuit (IC) industry, with emphasis on silicon-based Structures and integrated microelectronic circuitry. However, the term is now used to refer to a much wider range of microengineered devices and technologies.
標(biāo)簽： Microengineering Interfacing MEMS and
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
Since the original publication of Manual 74 in 1991, and the preceding “Guidelines for Transmission Line Structural Loading” in 1984, the understanding of structural loadings on transmission line Structures has broadened signifi cantly. However, improvements in computational capa- bility have enabled the transmission line engineer to more easily deter- mine structural loadings without properly understanding the parameters that affect these loads. Many seasoned professionals have expressed concern for the apparent lack of recent information on the topic of struc- tural loadings as new engineers enter this industry. The Committee on Electrical Transmission Structures is charged with the responsibility to report, evaluate, and provide loading requirements of transmission struc- tures. This task committee was therefore formed to update and revise the 1991 manual.
標(biāo)簽： Transmission Guidelines Electrical Line for
上傳時(shí)間： 2020-06-07
上傳用戶：shancjb
This paper presents a new type of electromagnetic damper with rotating inertial mass that has been devel oped to control the vibrations of Structures subjected to earthquakes. The electromagnetic inertial mass damper (EIMD) consists of a ball screw that converts axial oscillation of the rod end into rotational motion of the internal flflywheel and an electric generator that is turned by the rotation of the inner rod. The EIMD is able to generate a large inertial force created by the rotating flflywheel and a variable damping force devel oped by the electric generator. Device performance tests of reduced-scale and full-scale EIMDs were under taken to verify the basic characteristics of the damper and the validity of the derived theoretical formulae. Shaking table tests of a three-story structure with EIMDs and earthquake response analyses of a building with EIMDs were conducted to demonstrate the seismic response control performance of the EIMD. The EIMD is able to reduce story drifts as well as accelerations and surpasses conventional types of dampers in reducing acceleration responses.
標(biāo)簽： electromagnetic response Seismic control using
上傳時(shí)間： 2021-11-04
上傳用戶：a1293065
German universities and scientists have repeatedly set the intermational standard in drive technology. Identification and active compensation of natural frequencies in oscillatory mechanics, status controls with monitoring Structures incorporating acceleration sensors, adaptive compensation of measurement system deficiencies, self-adjusting detent torque compensation… everything invented with only a single aim in mind: to continue improv-ing the motion control, dynamics, precision and processing speed of your machines. For the industrial applicabability of this technology scientific publications in proceedings and laboratory test rigs are not enough. These features consequenty need to be converted into cost-efficient and easily manageable products. That 's exactly what we have done.So in future, if you should need more than today ' smarket can offer you, now everything isgoing to be alright. With our new high-performance ServoOne drive series you will experi-ence
標(biāo)簽： servoone
上傳時(shí)間： 2022-06-24
上傳用戶：kingwide
譚浩強(qiáng)《C程序設(shè)計(jì)》隨書(shū)光盤教學(xué)視頻共51講2.38G -2016-01-31 08:12 C專家編程 -2015-11-14 11:24 c語(yǔ)言圖形編程技術(shù) -2015-11-14 11:24 C語(yǔ)言深度解剖 -2015-11-14 11:24 C語(yǔ)言核心技術(shù)（中文版） -2015-11-14 11:24 c語(yǔ)言參考手冊(cè) -2015-11-14 11:24 c語(yǔ)言標(biāo)準(zhǔn)與實(shí)現(xiàn) -2015-11-14 11:24 C語(yǔ)言12天基礎(chǔ)課 -2015-11-14 11:24 c陷阱與缺陷 -2015-11-14 11:24 c和指針 -2015-11-14 11:24 c程序設(shè)計(jì)語(yǔ)言（TCPL）K&R -2015-11-14 11:24 C標(biāo)準(zhǔn)庫(kù)-中文 -2015-11-14 11:24 中國(guó)石油大學(xué)（華東）C語(yǔ)言編程練習(xí)題及答案全集.zip 125KB2015-11-14 11:24 再再論指針.pdf 272KB2015-11-14 11:24 一份不錯(cuò)的C語(yǔ)言指針教程.pdf 131KB2015-11-14 11:24 現(xiàn)代操作系統(tǒng)（第三版）中文版.pdf 27.5M2015-11-14 11:24 微軟C編程精粹.pdf 901KB2015-11-14 11:24 譚浩強(qiáng)C程序設(shè)計(jì)課件.zip 8.5M2015-11-14 11:24 數(shù)據(jù)結(jié)構(gòu)C語(yǔ)言版.pdf 16.2M2015-11-14 11:24 深入體驗(yàn)C語(yǔ)言項(xiàng)目開(kāi)發(fā).pdf 54.7M2015-11-14 11:24 深入理解C語(yǔ)言指針的奧秘.rar 26KB2015-11-14 11:24 鳥(niǎo)哥的Linux私房菜 基礎(chǔ)學(xué)習(xí)篇(第三版).pdf 22.1M2015-11-14 11:24 精華本.zip 924.6M2015-11-14 11:24 高質(zhì)量c、c++.pdf 653KB2015-11-14 11:24 堆和棧的區(qū)別_深入理解c語(yǔ)言指針的奧秘_C+中指針的復(fù)雜應(yīng)用Kevinspace_+2007年9月.pdf 219KB2015-11-14 11:24 必須弄懂的495個(gè)C語(yǔ)言問(wèn)題.pdf 1.4M2015-11-14 11:24 《C陷阱與缺陷》學(xué)習(xí)筆記.txt 15KB2015-11-14 11:24 [資料][其他]C語(yǔ)言經(jīng)典編程282例.pdf 163.5M2015-11-14 11:24 [資料][其他]21天學(xué)通C語(yǔ)言 掃描版.pdf 78.6M2015-11-14 11:24 [你必須知道的495個(gè)C語(yǔ)言問(wèn)題]HD.300dpi.pdf 134M2015-11-14 11:24 [大家網(wǎng)]C語(yǔ)言實(shí)例解析精粹_曹衍龍[www.TopSage.com].pdf 8.6M2015-11-14 11:24 [C陷阱與缺陷].(美)Andrew.Koenig.pdf 4.8M2015-11-14 11:24 Linux應(yīng)用開(kāi)發(fā)教材v1.0.pdf 1.9M2015-11-14 11:24 linux操作系統(tǒng)下c語(yǔ)言編程入門.pdf 633KB2015-11-14 11:24 C專家編程(英文文字版).pdf 2.1M2015-11-14 11:24 C專家編程(清晰版).pdf 13.5M2015-11-14 11:24 C指針經(jīng)驗(yàn)總結(jié).pdf 214KB2015-11-14 11:24 C語(yǔ)言預(yù)處理命令總結(jié).pdf 326KB2015-11-14 11:24 C語(yǔ)言圖形編程技術(shù).pdf 571KB2015-11-14 11:24 C語(yǔ)言深度剖析.pdf 967KB2015-11-14 11:24 C語(yǔ)言精彩編程百例.rar 31.1M2015-11-14 11:24 C語(yǔ)言經(jīng)典問(wèn)題摘錄.pdf 120KB2015-11-14 11:24 c語(yǔ)言經(jīng)典例題.txt 29KB2015-11-14 11:24 C語(yǔ)言技術(shù)文章.CHM 537KB2015-11-14 11:24 c語(yǔ)言函數(shù)使用大全.pdf 446KB2015-11-14 11:24 C語(yǔ)言高級(jí)編程技術(shù).pdf 693KB2015-11-14 11:24 C語(yǔ)言大全第4版.pdf 16.4M2015-11-14 11:24 C語(yǔ)言程序設(shè)計(jì)大賽題目和答案.pdf 562KB2015-11-14 11:24 C語(yǔ)言程序設(shè)計(jì)_現(xiàn)代方法.pdf 29.2M2015-11-14 11:24 C語(yǔ)言常見(jiàn)問(wèn)題集.pdf 1.3M2015-11-14 11:24 C語(yǔ)言參考手冊(cè)之函數(shù)庫(kù).pdf 238KB2015-11-14 11:24 C語(yǔ)言參考手冊(cè)第五版 中文版.pdf 9.9M2015-11-14 11:24 C語(yǔ)言參考手冊(cè)第五版 英文版.pdf 3.3M2015-11-14 11:24 C語(yǔ)言標(biāo)準(zhǔn)與實(shí)現(xiàn).pdf 1.1M2015-11-14 11:24 C和指針（中文版）.pdf 28.5M2015-11-14 11:24 C高級(jí)實(shí)用程序設(shè)計(jì).pdf 11.2M2015-11-14 11:24 C_Primer_Plus習(xí)題答案.pdf 185KB2015-11-14 11:24 c99標(biāo)準(zhǔn).pdf 1.5M2015-11-14 11:24 C.and.Data.Structures.by.Practice.2007.pdf 4.7M2015-11-14 11:24 C Primer Plus（第五版）中文版.pdf 70.2M2015-11-14 11:24 C Primer plus 第五版（非掃描帶書(shū)簽 .zip 4.8M2015-11-14 11:24 Advanced C.pdf
上傳時(shí)間： 2013-04-15
上傳用戶：eeworm
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