<strike id="awo8c"></strike>
The XA-S3 is a member of Philips Semiconductors’ XA (eXtended Architecture) family of high performance 16-bit single-chip Microcontrollers. The XA-S3 combines many powerful peripherals on one chip. Therefore, it is suited for general multipurpose high performance embedded control functions.One of the on-chip peripherals is the I2C bus interface. This report describes worked-out driver software (written in C) to program / use the I2C interface of the XA-S3. The driver software, together with a demo program and interface software routines offer the user a quick start in writing a complete I2C - XAS3 system application.
上傳時間： 2013-11-10
上傳用戶：liaofamous
The AT89C52 is a low-power, high-performance CMOS 8-bit microcomputer with 8Kbytes of Flash programmable and erasable read only memory (PEROM). The deviceis manufactured using Atmel’s high-density nonvolatile memory technology and iscompatible with the industry-standard 80C51 and 80C52 instruction set and pinout.The on-chip Flash allows the program memory to be reprogrammed in-system or by aconventional nonvolatile memory programmer. By combining a versatile 8-bit CPUwith Flash on a monolithic chip, the Atmel AT89C52 is a powerful microcomputerwhich provides a highly-flexible and cost-effective solution to many embedded controlapplications.
上傳時間： 2013-11-10
上傳用戶：1427796291
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
The C8051F020/1/2/3 devices are fully integrated mixed-signal System-on-a-Chip MCUs with 64 digital I/O pins (C8051F020/2) or 32 digital I/O pins (C8051F021/3). Highlighted features are listed below; refer to Table 1.1 for specific product feature selection.
上傳時間： 2013-11-08
上傳用戶：lwq11
LVDS、xECL、CML（低電壓差分信號傳輸、發射級耦合邏輯、電流模式邏輯）………4多點式低電壓差分信號傳輸(M-LVDS) ……………………………………………………8數字隔離器 ………………………………………………………………………………10RS-485/422 …………………………………………………………………………………11RS-232………………………………………………………………………………………13UART（通用異步收發機）…………………………………………………………………16CAN（控制器局域網）……………………………………………………………………18FlatLinkTM 3G ………………………………………………………………………………19SerDes（串行G 比特收發機及LVDS）……………………………………………………20DVI（數字視頻接口）/PanelBusTM ………………………………………………………22TMDS（最小化傳輸差分信號） …………………………………………………………24USB 集線器控制器及外設器件 …………………………………………………………25USB 接口保護 ……………………………………………………………………………26USB 電源管理 ……………………………………………………………………………27PCI Express® ………………………………………………………………………………29PCI 橋接器 …………………………………………………………………………………33卡總線 (CardBus) 電源開關 ………………………………………………………………341394 (FireWire®, 火線®) ……………………………………………………………………36GTLP (Gunning Transceiver Logic Plus，體效應收發機邏輯+) ………………………………39VME（Versa Module Eurocard）總線 ………………………………………………………41時鐘分配電路 ……………………………………………………………………………42交叉參考指南 ……………………………………………………………………………43器件索引 …………………………………………………………………………………47技術支持 …………………………………………………………………………………48 德州儀器（TI）為您提供了完備的接口解決方案，使得您的產品別具一格，并加速了產品面市。憑借著在高速、復合信號電路、系統級芯片 (system-on-a-chip ) 集成以及先進的產品開發工藝方面的技術專長，我們將能為您提供硅芯片、支持工具、軟件和技術文檔，使您能夠按時的完成并將最佳的產品推向市場，同時占據一個具有競爭力的價格。本選擇指南為您提供與下列器件系列有關的設計考慮因素、技術概述、產品組合圖示、參數表以及資源信息：
上傳時間： 2013-10-21
上傳用戶：Jerry_Chow
介紹了SoPC（System on a Programmable Chip）系統的概念和特點，給出了基于PLB總線的異步串行通信（UART）IP核的硬件設計和實現。通過將設計好的UART IP核集成到SoPC系統中加以驗證，證明了所設計的UART IP核可以正常工作。該設計方案為其他基于SoPC系統IP核的開發提供了一定的參考。
上傳時間： 2013-11-12
上傳用戶：894448095
The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embeddedapplications. The ARM Cortex-M3 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC1850/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals. The ARMCortex-M3 CPU also includes an internal prefetch unit that supports speculativebranching.The LPC1850/30/20/10 include up to 200 kB of on-chip SRAM data memory, a quad SPIFlash Interface (SPIFI), a State Configuration Timer (SCT) subsystem, two High-speedUSB controllers, Ethernet, LCD, an external memory controller, and multiple digital andanalog peripherals.
上傳時間： 2014-12-31
上傳用戶：zhuoying119
On the LPC13xx, programming, erasure and re-programming of the on-chip flash can be performed using In-System Programming (ISP) via the UART serial port, and also, can be performed using In-Application Programming (IAP) calls directed by the end-user code. For In-System Programming (ISP) via the UART serial port, the ISP command handler (resides in the bootloader) allows erasure of one or more sector (s) of the on-chip flash memory.
上傳時間： 2013-12-13
上傳用戶：lmq0059
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-11-21
上傳用戶：不懂夜的黑
The power of programmability gives industrial automation designers a highly efficient， cost-effective alternative to traditional motor control units （MCUs）。 The parallel-processing power， fast computational speeds， and connectivity versatility of Xilinx® FPGAs can accelerate the implementation of advanced motor control algorithms such as Field Oriented Control （FOC）。 Additionally， Xilinx devices lower costs with greater on-chip integration of system components and shorten latencies with high-performance digital signal processing （DSP） that can tackle compute-intensive functions such as PID Controller， Clark/Park transforms， and Space Vector PWM. The Xilinx Spartan®-6 FPGA Motor Control Development Kit gives designers an ideal starting point for evaluating time-saving， proven， motor-control reference designs. The kit also shortens the process of developing custom control capabilities， with integrated peripheral functions （Ethernet， PowerLink， and PCI® Express）， a motor-control FPGA mezzanine card （FMC） with built-in Texas Instruments motor drivers and high-precision Delta-Sigma modulators， and prototyping support for evaluating alternative front-end circuitry.
上傳時間： 2013-10-28
上傳用戶：wujijunshi
