In this document, the term Ô60xÕ is used to denote a 32-bit microprocessor from the PowerPC architecture family that conforms to the bus interface of the PowerPC 601ª, PowerPC 603ª, or PowerPC 604 microprocessors. Note that this does not include the PowerPC 602ª microprocessor which has a multiplexed address/data bus. 60x processors implement the PowerPC architecture as it is speciÞed for 32-bit addressing, which provides 32-bit effective (logical) addresses, integer data types of 8, 16, and 32 bits,and ßoating-point data types of 32 and 64 bits (single-precision and double-precision).1.1 Overview The MPC106 provides an integrated high-bandwidth, high-performance, TTL-compatible interface between a 60x processor, a secondary (L2) cache or additional (up to four total) 60x processors, the PCI bus,and main memory. This section provides a block diagram showing the major functional units of the 106 and describes brießy how those units interact.Figure 1 shows the major functional units within the 106. Note that this is a conceptual block diagram intended to show the basic features rather than an attempt to show how these features are physically implemented on the device.
上傳時間： 2013-10-08
上傳用戶：18711024007
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
Radio frequency (RF) can be a complex subject to navigate, but it does not have to be. If you are just getting started with radios or maybe you cannot find that old reference book about antenna aperture, this guide can help. It is intended to provide a basic understanding of RF technology, as well act as a quick reference for those who “know their stuff” but may be looking to brush up on that one niche term that they never quite understood. This document is also a useful reference for Maxim’s products and data sheets, an index to deeper analysis found in our application notes, and a general reference for all things RF.
上傳時間： 2013-10-23
上傳用戶：685
Radio frequency (RF) can be a complex subject to navigate, but it does not have to be. If you are just getting started with radios or maybe you cannot find that old reference book about antenna aperture, this guide can help. It is intended to provide a basic understanding of RF technology, as well act as a quick reference for those who “know their stuff” but may be looking to brush up on that one niche term that they never quite understood. This document is also a useful reference for Maxim’s products and data sheets, an index to deeper analysis found in our application notes, and a general reference for all things RF.
標簽： 無線技術
上傳時間： 2013-10-08
上傳用戶：kinochen
It would not be an exaggeration to say that semiconductor devices have transformed humanlife. From computers to communications to internet and video games these devices and the technologies they have enabled have expanded human experience in a way that is unique in history. Semiconductor devices have exploited materials, physics and imaginative applications to spawn new lifestyles. Of course for the device engineer, in spite of the advances, the challenges of reaching higher frequency, lower power consumption, higher power generation etc.
上傳時間： 2013-10-28
上傳用戶：songnanhua
怎樣使用Nios II處理器來構建多處理器系統 Chapter 1. Creating Multiprocessor Nios II Systems Introduction to Nios II Multiprocessor Systems . . . . . . . . . . . . . . 1–1 Benefits of Hierarchical Multiprocessor Systems . . . . . . . . . . . . . . . 1–2 Nios II Multiprocessor Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 Multiprocessor Tutorial Prerequisites . . . . . . . . . . . . . . . . . . . . . . . 1–3 Hardware Designs for Peripheral Sharing . . . . . . . . . . . .. . . . . . . . 1–3 Autonomous Multiprocessors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3 Multiprocessors that Share Peripherals . . . . . . . . . . . . . . . . . . . . . . 1–4 Sharing Peripherals in a Multiprocessor System . . . . . . . . . . . . . . . . . 1–4 Sharing Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6 The Hardware Mutex Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7 Sharing Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . 1–8 Overlapping Address Space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8 Software Design Considerations for Multiple Processors . . .. . . . . 1–9 Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–9 Boot Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 1–13 Debugging Nios II Multiprocessor Designs . . . . . . . . . . . . . . . . 1–15 Design Example: The Dining Philosophers’ Problem . . . . .. . . 1–15 Hardware and Software Requirements . . . . . . . . . . . . . . . .. . . 1–16 Installation Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–17 Creating the Hardware System . . . . . . . . . . . . . . .. . . . . . 1–17 Getting Started with the multiprocessor_tutorial_start Design Example 1–17 Viewing a Philosopher System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–18 Philosopher System Pipeline Bridges . . . . . . . . . . . . . . . . . . . . . 1–19 Adding Philosopher Subsystems . . . . . . . . . . . . . . . . . . . . . . . . . . 1–21 Connecting the Philosopher Subsystems . . . . . . . . . . . . .. . . . . 1–22 Viewing the Complete System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–27 Generating and Compiling the System . . . . . . . . . . . . . . . . . .. 1–28
上傳時間： 2013-11-21
上傳用戶：lo25643
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-11-21
上傳用戶：不懂夜的黑
In this paper, we discuss efficient coding and design styles using verilog. This can beimmensely helpful for any digital designer initiating designs. Here, we address different problems rangingfrom RTL-Gate Level simulation mismatch to race conditions in writing behavioral models. All theseproblems are accompanied by an example to have a better idea, and these can be taken care off if thesecoding guidelines are followed. Discussion of all the techniques is beyond the scope of this paper, however,here we try to cover a few of them.
標簽： Efficient Verilog Digital Coding
上傳時間： 2013-11-23
上傳用戶：我干你啊
Abstract: As industrial control systems (ICSs) have become increasingly connected and use more off-the-shelfcomponents, new vulnerabilities to cyber attacks have emerged. This tutorial looks at three types of ICSs:programmable logic controllers (PLCs), supervisory control and data acquisition (SCADA) systems, anddistributed control systems (DCSs), and then discusses security issues and remedies. This document alsoexplains the benefits and limitations of two cryptographic solutions (digital signatures and encryption) andelaborates on the reasons for using security ICs in an ICS to support cryptography.
上傳時間： 2013-10-09
上傳用戶：woshinimiaoye
英文書籍，Introduction.to.Mobile.Telephone.Systems.1G.2G.2.5G.and.3G.Wireless.Technologies.and.Services
上傳時間： 2015-02-25
上傳用戶：hoperingcong
